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SN74ACT7200L-15RJ

Texas Instruments

SN74ACT7200L-15RJ by Texas Instruments

SN74ACT7200L-15RJ by Texas Instruments is a FIFO chip with 256x9 organization, 25ns cycle time, and 40MHz clock frequency. It operates asynchronously at 5V and is ideal for commercial applications requiring fast memory access in a compact chip carrier package.

Median Price

$11.175

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,752 parts In-Stock

1+ parts

-

100+ parts

$8.940

1k+ parts

$8.000

10k+ parts

$7.530

1,752

-

$8.940

$8.000

$7.530

DigiKey

USA . 1,752 parts In-Stock

1+ parts

-

100+ parts

$11.760

1k+ parts

-

10k+ parts

-

1,752

-

$11.760

-

-

Verical

USA . 1,752 parts In-Stock

1+ parts

-

100+ parts

$11.175

1k+ parts

$10.000

10k+ parts

$9.412

1,752

-

$11.175

$10.000

$9.412

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,230 parts In-Stock

1+ parts

$9.443

100+ parts

-

1k+ parts

-

10k+ parts

-

3,230

$9.443

-

-

-

Vyrian

USA . 4,787 parts In-Stock

1+ parts

$9.940

100+ parts

-

1k+ parts

-

10k+ parts

-

4,787

$9.940

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 145 parts In-Stock

1+ parts

$4.042

100+ parts

-

1k+ parts

$4.506

10k+ parts

-

145

$4.042

-

$4.506

-

DigiPath Technology Company

USA . 2,131 parts In-Stock

1+ parts

$4.451

100+ parts

$4.095

1k+ parts

-

10k+ parts

-

2,131

$4.451

$4.095

-

-

ChromeModa Solutions

Germany . 2,223 parts In-Stock

1+ parts

$4.542

100+ parts

$3.724

1k+ parts

-

10k+ parts

-

2,223

$4.542

$3.724

-

-

IDEA Electronic Components Group

UK . 1,282 parts In-Stock

1+ parts

$4.542

100+ parts

-

1k+ parts

$4.088

10k+ parts

-

1,282

$4.542

-

$4.088

-

Corphita

USA . 4,905 parts In-Stock

1+ parts

$8.946

100+ parts

-

1k+ parts

-

10k+ parts

-

4,905

$8.946

-

-

-

Ampacity Inc.

Singapore . 1,309 parts In-Stock

1+ parts

$18.390

100+ parts

-

1k+ parts

-

10k+ parts

-

1,309

$18.390

-

-

-

Overview

Unlock seamless data transfer and improve system performance with the SN74ACT7200L-15RJ by Texas Instruments. Manufactured with precision and expertise, this FIFO device offers reliability and efficiency for a wide range of applications. With a cycle time of 25 ns and a maximum clock frequency of 40 MHz, this chip carrier package is designed for optimal performance in any setting. Say goodbye to bottlenecks and delays - experience the value and advantages of the SN74ACT7200L-15RJ today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FIFO, ensuring a long lifespan.

Cycle Time: 25 ns

Fast cycle time allows for quick data access and transfer, making the FIFO efficient in data handling applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent data transfers, making the FIFO versatile and suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement ensures compatibility with common power supplies, making integration easier.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows the FIFO to function in various environments without the risk of overheating.

Memory Width: 9

With a wide memory width, the FIFO can store and retrieve data efficiently, making it suitable for high-speed data processing.

Maximum Clock Frequency (fCLK): 40 MHz

High clock frequency allows for rapid data processing and transfer rates, making the FIFO ideal for applications that require quick data access.

Technical Specifications

FIFO SN74ACT7200L-15RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

RETRANSMIT

Maximum Clock Frequency (fCLK):

40 MHz

Cycle Time:

25 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.995 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X9

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Standby Current:

.0005 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

125 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT7200L-15RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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