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SN74ACT2236-20PM

Texas Instruments

SN74ACT2236-20PM by Texas Instruments

SN74ACT2236-20PM by Texas Instruments is a 2Kx9 FIFO with synchronous operation and 3-state output. It operates at 5V, has 64 terminals in a flatpack package, and uses CMOS technology. Ideal for applications requiring high-speed data transfer and temporary storage in parallel systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,491 parts In-Stock

1+ parts

-

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7,491

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Digiode

USA . 2,358 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,358

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,039 parts In-Stock

1+ parts

$2.415

100+ parts

-

1k+ parts

$2.910

10k+ parts

-

2,039

$2.415

-

$2.910

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DigiPath Technology Company

USA . 1,552 parts In-Stock

1+ parts

$2.659

100+ parts

$2.446

1k+ parts

-

10k+ parts

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1,552

$2.659

$2.446

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ChromeModa Solutions

Germany . 948 parts In-Stock

1+ parts

$2.713

100+ parts

$2.225

1k+ parts

-

10k+ parts

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948

$2.713

$2.225

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IDEA Electronic Components Group

UK . 265 parts In-Stock

1+ parts

$2.713

100+ parts

-

1k+ parts

$2.442

10k+ parts

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265

$2.713

-

$2.442

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AZTECH Wire

Italy . 442 parts In-Stock

1+ parts

$6.259

100+ parts

-

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442

$6.259

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One Stop Electronics

USA . 1,246 parts In-Stock

1+ parts

$8.000

100+ parts

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1,246

$8.000

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Corphita

USA . 1,217 parts In-Stock

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1,217

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Overview

Enhance your electronic projects with the SN74ACT2236-20PM by Texas Instruments, a top-tier manufacturer known for its high-quality components. This FIFO device is perfect for applications requiring synchronous operation and 3-STATE output characteristics, offering seamless data transfer with a memory density of 18432 bit. With a flatpack, low profile, fine pitch package style, this product provides a compact solution while delivering reliability and performance. Elevate your design with the cutting-edge technology and superior functionality of the SN74ACT2236-20PM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Operating Mode: SYNCHRONOUS

Ensures reliable and synchronized data transfer.

Nominal Supply Voltage / Vsup (V): 5

Works well with standard 5V power supply, making it compatible with many systems.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Compact design with fine pitch for space-saving and efficient usage.

Output Characteristics: 3-STATE

Provides flexibility in controlling the output signals.

Technology: CMOS

Uses low power and offers high noise immunity, ideal for efficient data handling.

Technical Specifications

FIFO SN74ACT2236-20PM attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Memory Density:

18432 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

64

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Organization:

2KX9

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

SN74ACT2236-20PM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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