Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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72V295L15PFI by Integrated Device Technology is a FIFO with 128KX18 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It is suitable for industrial applications requiring a memory density of 2359296 bit, with parallel operation and output enable feature.
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The use of plastic/epoxy as the package body material ensures durability and protection for the components inside.
Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly processes.
The fast cycle time of 15 ns ensures quick and efficient data processing.
The synchronous operating mode ensures precise timing and synchronization of data transfer.
The 3.3V nominal supply voltage is standard and widely compatible with various systems.
The high maximum operating temperature of 85°C makes this product suitable for industrial environments with potentially elevated temperatures.
The type of memory IC used in this product is FIFO (First In, First Out), which is ideal for data storage and retrieval applications requiring sequential access.
FIFO 72V295L15PFI attributes and parameters. Explore more FIFO devices from Integrated Device Technology
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72V295L15PFI Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Packaging - All Dev Label Chg 1/Dec/2022
Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Baneasa S A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
2N7002
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Taiwan Semiconductor
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
MBR0530T1G
Onsemi
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
MBRS130LT3G
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
IRLML6402TRPBF
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
SMBJ18CA
Diodes Incorporated
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
SN74ABT7819-30PNR
Texas Instruments
SN74ABT7819-30PNR by Texas Instruments is a FIFO with 512x18 organization, operating at 5V. It features a cycle time of 30.03 ns and offers 3-STATE output characteristics. This device is suitable for applications requiring synchronous operation and a memory density of 9216 bit in commercial temperature grade environments.
SN74ACT3632-15PQG4
SN74ACT3632-15PQG4 by Texas Instruments is a FIFO with 512x36 organization, operating at 66.7 MHz with a cycle time of 15 ns. It is used in applications requiring fast synchronous data transfer and features a max supply voltage of 5.5V, making it suitable for commercial-grade temperature environments.
SN74ABT3611-30PCB
SN74ABT3611-30PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 30 ns cycle time, and 33.4 MHz clock frequency. It operates synchronously at 5V and has a low profile flatpack package suitable for commercial temperature grade applications.
7203L12JG
Renesas Electronics
Renesas Electronics 7203L12JG FIFO chip features 2Kx9 organization, 20ns cycle time, and operates at a max clock frequency of 50MHz. Ideal for applications requiring high-speed data buffering in commercial-grade environments.
SN74ACT7204-40FM
SN74ACT7204-40FM by Texas Instruments is a FIFO chip with 4Kx9 organization, operating at 20MHz. It has a memory density of 36864 bits and operates on a 5V supply. This CMOS technology chip is ideal for applications requiring fast data transfer and storage in commercial temperature environments.
CD74HC40105E
CD74HC40105E by Texas Instruments is a 16x4 FIFO memory IC with 500ns cycle time, operating at 10MHz clock frequency. It has 3-state output characteristics and supports parallel operation. Ideal for military-grade applications requiring fast data storage and retrieval in a compact IN-LINE package.
SN74ACT2235-60PAGR
SN74ACT2235-60PAGR by Texas Instruments is a FIFO with 1KX9 organization, 60 ns cycle time, and 70°C max operating temp. It is used in applications requiring fast data storage and retrieval, such as communication systems and industrial automation.
CD74HCT40105E
CD74HCT40105E by Texas Instruments is a 16x4 FIFO memory IC with 100ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a max clock frequency of 10MHz. Ideal for military-grade applications requiring fast data storage and retrieval in parallel mode.
74HC7403D,512
NXP Semiconductors' 74HC7403D,512 FIFO chip operates at 5V with a cycle time of 83.33ns and supports a max clock frequency of 12MHz. Ideal for automotive applications, it features a memory width of 4 bits, output enable function, and offers a memory density of 256 bits.
SN74ACT72235-20PM
SN74ACT72235-20PM by Texas Instruments is a FIFO with 1KX9 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation, such as data buffering and communication systems. The device features a low profile flatpack package with gull wing terminals for surface mount assembly.
7204
Teledyne E2v (Uk)
FIFOs;
SN74ABT7819A-15PH
SN74ABT7819A-15PH by Texas Instruments is a 512Kx18 BI-DIRECTIONAL FIFO memory IC with 67 MHz clock frequency, 15 ns cycle time, and 95 mA max supply current. It operates in synchronous mode and has a memory density of 9437184 bit. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN54LS222W
SN54LS222W by Texas Instruments is a 16x4 FIFO memory IC operating at 5V, with a temperature range of -55°C to 125°C. It features asynchronous operation, flatpack package style, and dual terminal position. Ideal for military-grade applications requiring reliable data storage and retrieval in harsh environments.
CD74HCT40105M
General Electric Solid State
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Cycle Time: 100 ns;
SN74ACT7203L-50DVR
SN74ACT7203L-50DVR by Texas Instruments is a FIFO with 2KX9 organization, 65 ns cycle time, and 3-STATE output characteristics. It operates asynchronously at a supply voltage of 5V. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V05L25JGI8
The Renesas Electronics 72V05L25JGI8 FIFO chip features a cycle time of 35ns, operating at 3.3V with an organization of 8KX9. It is designed for industrial applications requiring fast parallel access times and a memory density of 73728 bits in a compact chip carrier package.
SN74ABT3614-15PCB
SN74ABT3614-15PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 15ns cycle time, and 66.7MHz clock frequency. It operates synchronously at 5V and features a low profile flatpack package for commercial applications requiring fast data storage and retrieval.
SN74ACT7201LA-25NP
SN74ACT7201LA-25NP by Texas Instruments is a FIFO with 512x9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates at 5V, has a temp range of 0-70°C, and is ideal for parallel memory applications due to its CMOS technology and 3-STATE output characteristics.
72V255LA10PFG8
Integrated Device Technology
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
SN74ACT3641-15PQ
SN74ACT3641-15PQ by Texas Instruments is a FIFO memory IC with 1Kx36 organization, operating at 66.7MHz cycle time of 15ns. It features a parallel interface, synchronous operation, and output enable function. This CMOS technology device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
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72V2105L10PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 262144 words;
72V2113L6PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Memory Width: 18;
72V2105L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
72V2111L15PFGI
The Renesas Electronics 72V2111L15PFGI FIFO operates synchronously with a cycle time of 15 ns and a clock frequency of up to 66.7 MHz. It features a memory density of 4718592 bit, suitable for industrial applications requiring fast data processing and parallel operation at temperatures ranging from -40 to 85°C.
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 524288 words;
72V2111L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Standby Current: .02 Amp;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
72V211L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 512 words;
72V2111L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Functions: 1;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3.15 V;
72V211L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Memory Density: 4608 bit;
72V241L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Surface Mount: YES;
72V241L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
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