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SN74ABT3614-30PQR

Texas Instruments

SN74ABT3614-30PQR by Texas Instruments

SN74ABT3614-30PQR by Texas Instruments is a FIFO with 64x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast data transfer and storage in synchronous operating mode.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,020 parts In-Stock

1+ parts

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3,020

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Vyrian

USA . 2,674 parts In-Stock

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2,674

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,130 parts In-Stock

1+ parts

$2.297

100+ parts

-

1k+ parts

$2.797

10k+ parts

-

1,130

$2.297

-

$2.797

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DigiPath Technology Company

USA . 805 parts In-Stock

1+ parts

$2.529

100+ parts

$2.327

1k+ parts

-

10k+ parts

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805

$2.529

$2.327

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ChromeModa Solutions

Germany . 415 parts In-Stock

1+ parts

$2.581

100+ parts

$2.116

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-

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415

$2.581

$2.116

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IDEA Electronic Components Group

UK . 322 parts In-Stock

1+ parts

$2.581

100+ parts

-

1k+ parts

$2.323

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322

$2.581

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$2.323

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AZTECH Wire

Italy . 556 parts In-Stock

1+ parts

$17.574

100+ parts

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556

$17.574

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One Stop Electronics

USA . 359 parts In-Stock

1+ parts

$24.000

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359

$24.000

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Corphita

USA . 2,025 parts In-Stock

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2,025

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Overview

Elevate your electronics with the SN74ABT3614-30PQR by Texas Instruments, a top-tier FIFO device designed for seamless data storage and retrieval. Crafted with precision and expertise, this product guarantees unmatched performance and reliability. Whether it's for industrial automation, telecommunications, or consumer electronics, this FIFO will exceed your expectations. Experience the value of faster cycle times, versatile operating modes, and 3-state output characteristics. Trust Texas Instruments to deliver excellence in every aspect, making your projects stand out from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material makes the package durable and reliable for long-term use.

Cycle Time: 30 ns

Fast cycle time of 30 ns ensures quick and efficient data processing.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with various systems.

Organization: 64X36

64x36 organization provides a decent memory capacity for storing data efficiently.

Technology: BICMOS

Utilizes BiCMOS technology for improved performance and energy efficiency.

Output Enable: YES

Output enable feature allows for flexible control over data output.

Technical Specifications

FIFO SN74ABT3614-30PQR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

PARITY GENERATOR/CHECKER, MAILBOX

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Memory Density:

2304 bit

Memory Width:

36

No. of Functions:

1

No. of Terminals:

132

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Width:

24.13 mm

Trade Compliance

SN74ABT3614-30PQR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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