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SN74ACT7202LA-35NP

Texas Instruments

SN74ACT7202LA-35NP by Texas Instruments

SN74ACT7202LA-35NP by Texas Instruments is a 1Kx9 FIFO with 5V supply voltage, CMOS technology, and 3-STATE output. It has a rectangular package style with through-hole terminals and operates asynchronously. Ideal for applications requiring high-speed data buffering in electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,654 parts In-Stock

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Digiode

USA . 514 parts In-Stock

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Parana Technologies

USA . 1,717 parts In-Stock

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$4.799

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$5.306

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DigiPath Technology Company

USA . 755 parts In-Stock

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$5.284

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$4.861

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IDEA Electronic Components Group

UK . 1,555 parts In-Stock

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$5.392

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$4.853

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$5.392

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ChromeModa Solutions

Germany . 1,253 parts In-Stock

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$5.392

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$4.421

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AZTECH Wire

Italy . 664 parts In-Stock

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$9.307

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One Stop Electronics

USA . 1,321 parts In-Stock

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$18.000

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Corphita

USA . 4,289 parts In-Stock

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Overview

Experience seamless data transfer and efficient memory management with the SN74ACT7202LA-35NP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The FIFO category of this device offers fast and reliable data storage capabilities, making it ideal for applications requiring high-speed data processing. With its 3-STATE output characteristics and CMOS technology, this product ensures optimal performance and versatility. Invest in the SN74ACT7202LA-35NP today and unlock unparalleled value and benefits for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and resistance to heat and chemicals, making the product suitable for various industrial environments.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent read and write operations, increasing flexibility and efficiency in data management.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of systems and reduces the need for additional power conversion.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for interfacing with other components and systems.

Package Style (Meter): IN-LINE

The in-line package style facilitates easy integration into existing systems and ensures efficient use of space.

Organization: 1KX9

The 1Kx9 organization allows for efficient storage and retrieval of data in a structured manner.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide additional control over the output signals, allowing for more versatile data processing.

Maximum Seated Height: 4.57 mm

With a low seated height, the product takes up minimal space in a system, enabling compact design and efficient use of available space.

Width: 7.62 mm

The moderate width of the product allows for easy handling and installation in various applications.

Length: 34.545 mm

The length of 34.545 mm strikes a balance between compactness and accessibility, making the product versatile in different setups.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the overall performance and reliability of the product.

Parallel or Serial: PARALLEL

Operating in parallel mode enables high-speed data transfer and processing, suitable for demanding applications that require quick response times.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and easy soldering, ensuring robust and reliable electrical connections.

No. of Words: 1024 words

Having 1024 words of memory allows for storing a significant amount of data, making the product suitable for applications that require extensive data processing.

Memory Width: 9

The memory width of 9 bits enables efficient data retrieval and processing, contributing to the overall speed and performance of the product.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, the product offers compatibility with standard connectors and headers, ensuring easy integration into existing systems.

No. of Words Code: 1K

The 1K words code simplifies data organization and retrieval, making it easier to manage and access large volumes of data efficiently.

Memory Density: 9216 bit

With a memory density of 9216 bits, the product can store a substantial amount of data in a compact form factor, ideal for applications with limited space.

Technical Specifications

FIFO SN74ACT7202LA-35NP attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

Length:

34.545 mm

Memory Density:

9216 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

ASYNCHRONOUS

Organization:

1KX9

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN74ACT7202LA-35NP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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