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SN74ACT72231L-25RJ

Texas Instruments

SN74ACT72231L-25RJ by Texas Instruments

SN74ACT72231L-25RJ by Texas Instruments is a FIFO chip with 2Kx9 organization, operating at 25ns cycle time and 40MHz clock frequency. It is used in applications requiring synchronous operation, such as data buffering and communication systems.

Median Price

$16.087

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,447 parts In-Stock

1+ parts

-

100+ parts

$12.870

1k+ parts

$11.520

10k+ parts

$10.840

2,447

-

$12.870

$11.520

$10.840

DigiKey

USA . 2,447 parts In-Stock

1+ parts

-

100+ parts

$16.940

1k+ parts

-

10k+ parts

-

2,447

-

$16.940

-

-

Verical

USA . 2,447 parts In-Stock

1+ parts

-

100+ parts

$16.087

1k+ parts

$14.400

10k+ parts

$13.550

2,447

-

$16.087

$14.400

$13.550

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,626 parts In-Stock

1+ parts

$13.594

100+ parts

-

1k+ parts

-

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2,626

$13.594

-

-

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Vyrian

USA . 200 parts In-Stock

1+ parts

$14.310

100+ parts

-

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200

$14.310

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DigiKey Marketplace

USA . 2,447 parts In-Stock

1+ parts

-

100+ parts

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2,447

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 331 parts In-Stock

1+ parts

$2.072

100+ parts

-

1k+ parts

$2.591

10k+ parts

-

331

$2.072

-

$2.591

-

DigiPath Technology Company

USA . 2,319 parts In-Stock

1+ parts

$2.281

100+ parts

-

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10k+ parts

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2,319

$2.281

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-

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ChromeModa Solutions

Germany . 1,916 parts In-Stock

1+ parts

$2.328

100+ parts

$1.909

1k+ parts

-

10k+ parts

-

1,916

$2.328

$1.909

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IDEA Electronic Components Group

UK . 346 parts In-Stock

1+ parts

$2.328

100+ parts

-

1k+ parts

$2.095

10k+ parts

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346

$2.328

-

$2.095

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Corphita

USA . 4,105 parts In-Stock

1+ parts

$12.879

100+ parts

-

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4,105

$12.879

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Kepictronics

USA . 2,447 parts In-Stock

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2,447

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Overview

Unlock seamless data transfer and storage with the SN74ACT72231L-25RJ FIFO chip from Texas Instruments. Designed for reliability and precision, this chip boasts a cycle time of 25 ns and a maximum clock frequency of 40 MHz. Whether used in telecommunications, industrial automation, or networking applications, this FIFO chip offers unmatched performance and efficiency. Trust in Texas Instruments' reputation for quality and innovation, and elevate your projects with the SN74ACT72231L-25RJ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material ensures durability and reliability in various operating conditions

Cycle Time: 25 ns

Fast cycle time for efficient data transfer and processing

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data transfer

Nominal Supply Voltage / Vsup (V): 5

Nominal supply voltage of 5V is standard and easily available

Organization: 2KX9

Organized as 2Kx9 for efficient memory management and access

Maximum Clock Frequency (fCLK): 40 MHz

High clock frequency allows for fast data processing

Technology: CMOS

CMOS technology ensures low power consumption and high speed operation

Parallel or Serial: PARALLEL

Parallel operation allows for simultaneous data transfer for increased efficiency

Output Enable: YES

Output enable feature provides control over data output

Technical Specifications

FIFO SN74ACT72231L-25RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Maximum Clock Frequency (fCLK):

40 MHz

Cycle Time:

25 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.995 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sub-Category:

FIFOs

Maximum Supply Current:

160 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT72231L-25RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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