Loading...

SN74ACT3631-30PCBR

Texas Instruments

SN74ACT3631-30PCBR by Texas Instruments

SN74ACT3631-30PCBR by Texas Instruments is a FIFO with 512x36 organization, 30 ns cycle time, and 5V nominal voltage. It operates in synchronous mode and has a memory density of 18432 bits. This device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,569 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,569

-

-

-

-

Digiode

USA . 4,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,369

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 55 parts In-Stock

1+ parts

$4.414

100+ parts

-

1k+ parts

$4.836

10k+ parts

-

55

$4.414

-

$4.836

-

ChromeModa Solutions

Germany . 1,988 parts In-Stock

1+ parts

$4.960

100+ parts

$4.067

1k+ parts

-

10k+ parts

-

1,988

$4.960

$4.067

-

-

IDEA Electronic Components Group

UK . 806 parts In-Stock

1+ parts

$4.960

100+ parts

-

1k+ parts

$4.464

10k+ parts

-

806

$4.960

-

$4.464

-

AZTECH Wire

Italy . 622 parts In-Stock

1+ parts

$6.091

100+ parts

-

1k+ parts

-

10k+ parts

-

622

$6.091

-

-

-

One Stop Electronics

USA . 1,074 parts In-Stock

1+ parts

$25.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,074

$25.000

-

-

-

Corphita

USA . 2,965 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,965

-

-

-

-

DigiPath Technology Company

USA . 172 parts In-Stock

1+ parts

-

100+ parts

$4.472

1k+ parts

-

10k+ parts

-

172

-

$4.472

-

-

Overview

Enhance your electronic projects with the high-quality SN74ACT3631-30PCBR FIFO from Texas Instruments. This cutting-edge device offers reliable performance and seamless operation, making it perfect for a wide range of applications. With fast cycle times and a robust construction, this FIFO ensures smooth data transfer and optimal efficiency. Upgrade your systems today with the SN74ACT3631-30PCBR and experience the unmatched value and benefits that Texas Instruments products have to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers durability and protection for the internal components of the FIFO product.

Cycle Time: 30 ns

Fast cycle time allows for quick access to data stored in the FIFO, improving overall system performance.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures accurate and synchronized data transfer within the system.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent and reliable performance of the FIFO.

No. of Terminals: 120

Large number of terminals provide versatility and connectivity options for integrating the FIFO into various systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FIFO energy-efficient and reliable.

Technical Specifications

FIFO SN74ACT3631-30PCBR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

MAILBOX

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

18432 bit

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SN74ACT3631-30PCBR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20