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SN74ACT2236-40FN

Texas Instruments

SN74ACT2236-40FN by Texas Instruments

SN74ACT2236-40FN by Texas Instruments is a FIFO chip with 2Kx9 organization, 40ns cycle time, and 25MHz clock frequency. It operates synchronously at 5V and has a memory density of 18432 bits. Ideal for industrial applications requiring fast data storage and retrieval in a compact square chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,869 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,869

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-

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Digiode

USA . 1,761 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,761

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 473 parts In-Stock

1+ parts

$3.741

100+ parts

-

1k+ parts

$4.239

10k+ parts

-

473

$3.741

-

$4.239

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DigiPath Technology Company

USA . 1,984 parts In-Stock

1+ parts

$4.119

100+ parts

-

1k+ parts

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10k+ parts

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1,984

$4.119

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ChromeModa Solutions

Germany . 5,850 parts In-Stock

1+ parts

$4.203

100+ parts

$3.446

1k+ parts

-

10k+ parts

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5,850

$4.203

$3.446

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IDEA Electronic Components Group

UK . 1,344 parts In-Stock

1+ parts

$4.203

100+ parts

-

1k+ parts

$3.783

10k+ parts

-

1,344

$4.203

-

$3.783

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AZTECH Wire

Italy . 743 parts In-Stock

1+ parts

$19.826

100+ parts

-

1k+ parts

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10k+ parts

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743

$19.826

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Ampacity Inc.

Singapore . 968 parts In-Stock

1+ parts

$20.000

100+ parts

-

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10k+ parts

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968

$20.000

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One Stop Electronics

USA . 584 parts In-Stock

1+ parts

$30.000

100+ parts

-

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584

$30.000

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Corphita

USA . 3,870 parts In-Stock

1+ parts

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3,870

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Assy Fe

Spain . 25 parts In-Stock

1+ parts

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25

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Overview

Elevate your electronic projects with the SN74ACT2236-40FN by Texas Instruments, a top-tier manufacturer known for quality and innovation. This BI-DIRECTIONAL FIFO device offers a seamless solution for data storage and retrieval, ensuring smooth operation in various applications. With a fast cycle time of 40ns and a maximum clock frequency of 25MHz, this chip carrier package boasts industrial-grade reliability and efficiency. Say goodbye to data bottlenecks and hello to streamlined performance with the SN74ACT2236-40FN - an essential component for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Cycle Time: 40 ns

Fast cycle time allows for quick and efficient data storage and retrieval, making it suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transferred and processed consistently and accurately, reducing the risk of errors.

Nominal Supply Voltage: 5V

Compatible with standard voltage requirements, making it easy to integrate into existing systems.

Maximum Clock Frequency: 25 MHz

Supports high clock frequencies for fast data processing, making it ideal for demanding applications.

Technical Specifications

FIFO SN74ACT2236-40FN attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

35 ns

Additional Features:

BYPASS XCVR

Maximum Clock Frequency (fCLK):

25 MHz

Cycle Time:

40 ns

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

44

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.5862 mm

Trade Compliance

SN74ACT2236-40FN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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