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SN74ABT7819A-30PN

Texas Instruments

SN74ABT7819A-30PN by Texas Instruments

SN74ABT7819A-30PN by Texas Instruments is a FIFO memory IC with 512Kx18 organization, operating at 33.3MHz cycle time. It features a 5V nominal voltage and synchronous operation mode, suitable for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$19.670

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 599 parts In-Stock

1+ parts

-

100+ parts

$17.010

1k+ parts

$15.220

10k+ parts

$14.330

599

-

$17.010

$15.220

$14.330

DigiKey

USA . 599 parts In-Stock

1+ parts

-

100+ parts

$19.670

1k+ parts

-

10k+ parts

-

599

-

$19.670

-

-

Verical

USA . 599 parts In-Stock

1+ parts

-

100+ parts

$21.262

1k+ parts

$19.025

10k+ parts

$17.913

599

-

$21.262

$19.025

$17.913

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$16.860

100+ parts

-

1k+ parts

-

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-

150

$16.860

-

-

-

Digiode

USA . 2,535 parts In-Stock

1+ parts

$17.964

100+ parts

-

1k+ parts

-

10k+ parts

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2,535

$17.964

-

-

-

Vyrian

USA . 2,314 parts In-Stock

1+ parts

-

100+ parts

-

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2,314

-

-

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DigiKey Marketplace

USA . 599 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

599

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 501 parts In-Stock

1+ parts

$2.706

100+ parts

-

1k+ parts

$3.188

10k+ parts

-

501

$2.706

-

$3.188

-

DigiPath Technology Company

USA . 1,681 parts In-Stock

1+ parts

$2.979

100+ parts

$2.741

1k+ parts

-

10k+ parts

-

1,681

$2.979

$2.741

-

-

ChromeModa Solutions

Germany . 4,709 parts In-Stock

1+ parts

$3.040

100+ parts

$2.493

1k+ parts

-

10k+ parts

-

4,709

$3.040

$2.493

-

-

IDEA Electronic Components Group

UK . 729 parts In-Stock

1+ parts

$3.040

100+ parts

-

1k+ parts

$2.736

10k+ parts

-

729

$3.040

-

$2.736

-

Corphita

USA . 3,781 parts In-Stock

1+ parts

$17.019

100+ parts

-

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-

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3,781

$17.019

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Microchip USA

USA . 486 parts In-Stock

1+ parts

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486

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Overview

Experience seamless data transfer and storage with the Texas Instruments SN74ABT7819A-30PN FIFO memory IC. Designed for high-speed performance, this FIFO features a BICMOS technology, ensuring reliable operation in commercial-grade applications. With a maximum clock frequency of 33.3 MHz and a cycle time of just 30 ns, this versatile device offers fast data processing and efficient memory management. Ideal for parallel data transmission, this FIFO is perfect for a wide range of applications where speed and precision are key. Upgrade your system's performance today with the SN74ABT7819A-30PN from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB design, saving space and reducing overall product size.

Cycle Time: 30 ns

Fast cycle time of 30 ns ensures quick data transfer and efficient operation, suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination of data transfer, reducing errors and improving overall system performance.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of electronic systems and devices.

No. of Terminals: 80

High number of terminals allows for versatile connectivity options and integration with other components in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch design enhances PCB layout flexibility and optimizes space utilization in compact electronic devices.

Maximum Clock Frequency (fCLK): 33.3 MHz

High maximum clock frequency of 33.3 MHz enables fast data processing and efficient operation in demanding applications.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation within standard temperature ranges commonly found in commercial electronics.

Memory IC Type: BI-DIRECTIONAL FIFO

Bi-directional FIFO memory type allows for simultaneous read and write operations, improving data throughput and system efficiency.

Technical Specifications

FIFO SN74ABT7819A-30PN attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

14 ns

Maximum Clock Frequency (fCLK):

33.3 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Memory Density:

9437184 bit

Memory IC Type:

Memory Width:

18

No. of Functions:

1

No. of Terminals:

80

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.55SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

95 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

SN74ABT7819A-30PN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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