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SN74ACT72211L35RJ

Texas Instruments

SN74ACT72211L35RJ by Texas Instruments

SN74ACT72211L35RJ by Texas Instruments is a 512x9 FIFO chip with synchronous operation and 5V nominal voltage. It features a memory density of 4608 bits, operates in commercial temperature grade up to 70°C, and supports parallel data transfer. This chip is commonly used in applications requiring high-speed data buffering and storage.

Median Price

$13.875

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 444 parts In-Stock

1+ parts

-

100+ parts

$11.100

1k+ parts

$9.930

10k+ parts

$9.340

444

-

$11.100

$9.930

$9.340

DigiKey

USA . 444 parts In-Stock

1+ parts

-

100+ parts

$14.600

1k+ parts

-

10k+ parts

-

444

-

$14.600

-

-

Verical

USA . 444 parts In-Stock

1+ parts

-

100+ parts

$13.875

1k+ parts

$12.412

10k+ parts

$11.675

444

-

$13.875

$12.412

$11.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,198 parts In-Stock

1+ parts

$11.723

100+ parts

-

1k+ parts

-

10k+ parts

-

2,198

$11.723

-

-

-

Vyrian

USA . 6,463 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,463

-

-

-

-

DigiKey Marketplace

USA . 444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

444

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 66 parts In-Stock

1+ parts

$2.814

100+ parts

-

1k+ parts

$3.299

10k+ parts

-

66

$2.814

-

$3.299

-

DigiPath Technology Company

USA . 550 parts In-Stock

1+ parts

$3.099

100+ parts

-

1k+ parts

-

10k+ parts

-

550

$3.099

-

-

-

IDEA Electronic Components Group

UK . 1,271 parts In-Stock

1+ parts

$3.162

100+ parts

-

1k+ parts

$2.846

10k+ parts

-

1,271

$3.162

-

$2.846

-

ChromeModa Solutions

Germany . 966 parts In-Stock

1+ parts

$3.162

100+ parts

$2.593

1k+ parts

-

10k+ parts

-

966

$3.162

$2.593

-

-

Corphita

USA . 2,911 parts In-Stock

1+ parts

$11.106

100+ parts

-

1k+ parts

-

10k+ parts

-

2,911

$11.106

-

-

-

Overview

Unlock the power of seamless data transfer with the SN74ACT72211L35RJ by Texas Instruments. Crafted with precision and expertise, this FIFO device offers unparalleled reliability and efficiency in managing your data storage needs. From industrial automation to telecommunications, this versatile chip carrier is designed to excel in a wide range of applications. Experience the Texas Instruments advantage today and elevate your projects with cutting-edge technology that delivers unmatched performance and value. Trust in the SN74ACT72211L35RJ to streamline your operations and take your business to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, allowing for easy handling and long-lasting performance.

Surface Mount: YES

With surface mount capability, the product can be easily integrated into existing circuit boards, saving space and simplifying the assembly process.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise timing and control, leading to efficient data transfer and reliable performance.

Nominal Supply Voltage (Vsup): 5V

A 5V supply voltage is commonly used in electronic devices, making this product compatible with a wide range of applications.

No. of Terminals: 32

Having 32 terminals allows for multiple input and output connections, enabling versatile functionality and connectivity options.

Maximum Operating Temperature: 70 °C

The product can operate efficiently up to 70°C, ensuring stability and performance even in higher temperature environments.

Organization: 512X9

With 512 words organized in a 9-bit width, the product offers ample memory capacity and data storage capabilities for various applications.

Minimum Supply Voltage (Vsup): 4.5V

The ability to operate at a minimum supply voltage of 4.5V allows for flexibility in power supply options and ensures reliable performance under varying voltage conditions.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of devices, making this product energy-efficient and versatile.

No. of Words: 512 words

With 512 words of memory, the product can store a large amount of data, providing ample storage capacity for information processing and retrieval.

Technical Specifications

FIFO SN74ACT72211L35RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-J32

Memory Density:

4608 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X9

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Position:

QUAD

Trade Compliance

SN74ACT72211L35RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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