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SN74V263PZAEP

Texas Instruments

SN74V263PZAEP by Texas Instruments

SN74V263PZAEP by Texas Instruments is a FIFO memory with 8Kx18 organization, operating at 133 MHz. It features a cycle time of 7.5 ns and synchronous operation, suitable for military-grade applications requiring fast data processing and low power consumption. With a package style of flatpack and low profile design, it offers high memory density of 147456 bits in a compact form factor.

Median Price

$39.367

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 97 parts In-Stock

1+ parts

$29.420

100+ parts

$28.830

1k+ parts

$28.240

10k+ parts

-

97

$29.420

$28.830

$28.240

-

Texas Instruments

USA . 110 parts In-Stock

1+ parts

$39.367

100+ parts

$34.993

1k+ parts

$25.730

10k+ parts

-

110

$39.367

$34.993

$25.730

-

Mouser Electronics

USA . 90 parts In-Stock

1+ parts

$73.450

100+ parts

$60.430

1k+ parts

-

10k+ parts

-

90

$73.450

$60.430

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$34.751

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$34.751

-

-

-

Digiode

USA . 4,533 parts In-Stock

1+ parts

$37.399

100+ parts

-

1k+ parts

-

10k+ parts

-

4,533

$37.399

-

-

-

Vyrian

USA . 8,030 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,030

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,151 parts In-Stock

1+ parts

$4.069

100+ parts

-

1k+ parts

$4.533

10k+ parts

-

1,151

$4.069

-

$4.533

-

DigiPath Technology Company

USA . 1,309 parts In-Stock

1+ parts

$4.481

100+ parts

$4.122

1k+ parts

-

10k+ parts

-

1,309

$4.481

$4.122

-

-

ChromeModa Solutions

Germany . 2,418 parts In-Stock

1+ parts

$4.572

100+ parts

$3.749

1k+ parts

-

10k+ parts

-

2,418

$4.572

$3.749

-

-

IDEA Electronic Components Group

UK . 2,083 parts In-Stock

1+ parts

$4.572

100+ parts

-

1k+ parts

$4.115

10k+ parts

-

2,083

$4.572

-

$4.115

-

AZTECH Wire

Italy . 375 parts In-Stock

1+ parts

$7.784

100+ parts

-

1k+ parts

-

10k+ parts

-

375

$7.784

-

-

-

Ampacity Inc.

Singapore . 110 parts In-Stock

1+ parts

$33.460

100+ parts

-

1k+ parts

-

10k+ parts

-

110

$33.460

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$34.056

100+ parts

-

1k+ parts

$32.694

10k+ parts

-

500

$34.056

-

$32.694

-

Continental Prestige Electronics

USA . 3,471 parts In-Stock

1+ parts

$34.751

100+ parts

-

1k+ parts

-

10k+ parts

$34.056

3,471

$34.751

-

-

$34.056

Corphita

USA . 4,069 parts In-Stock

1+ parts

$35.430

100+ parts

-

1k+ parts

-

10k+ parts

-

4,069

$35.430

-

-

-

Microchip USA

USA . 1,087 parts In-Stock

1+ parts

$79.928

100+ parts

-

1k+ parts

-

10k+ parts

-

1,087

$79.928

-

-

-

Argo Parts USA

USA . 2,979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,979

-

-

-

-

Overview

Experience seamless data transfer and efficient data management with the SN74V263PZAEP FIFO by Texas Instruments. Boasting superior quality and reliability, this FIFO device is perfect for a wide range of applications in various industries. Texas Instruments, a trusted name in the industry, ensures that this product delivers unmatched performance and value to customers. From its advanced technology to its compact design, the SN74V263PZAEP offers speed, precision, and efficiency, making it an essential component for your next project. Elevate your data processing capabilities with this top-of-the-line FIFO from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight yet durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and resources.

Cycle Time: 7.5 ns

With a fast cycle time, this FIFO offers quick data retrieval and processing, enhancing overall system performance.

Package Shape: SQUARE

The square shape of the package ensures efficient use of space on the PCB, optimizing the layout for other components.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transmitted and processed in a synchronized manner, reducing errors and improving data integrity.

Nominal Supply Voltage: 3.3V

The standard 3.3V supply voltage makes it compatible with a wide range of systems and power sources.

Power Supplies: 3.3V

The low power supply requirement of 3.3V helps in reducing power consumption and heat dissipation.

No. of Terminals: 80

The ample number of terminals allows for easy connection to other components, improving scalability and versatility.

Package Style: FLATPACK, LOW PROFILE

The low-profile flatpack package style saves space on the PCB, making it suitable for compact designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the FIFO can withstand harsh environmental conditions without performance degradation.

Technical Specifications

FIFO SN74V263PZAEP attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

5 ns

Additional Features:

CAN ALSO BE CONFIGURED AS 16384 X 9

Alternate Memory Width:

9

Maximum Clock Frequency (fCLK):

133 MHz

Cycle Time:

7.5 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

147456 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

80

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.015 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74V263PZAEP Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.B

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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