Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
SN74V263PZAEP by Texas Instruments is a FIFO memory with 8Kx18 organization, operating at 133 MHz. It features a cycle time of 7.5 ns and synchronous operation, suitable for military-grade applications requiring fast data processing and low power consumption. With a package style of flatpack and low profile design, it offers high memory density of 147456 bits in a compact form factor.
Median Price
$39.367
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6
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1k+
Rochester
1+ parts
$29.420
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$28.830
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Texas Instruments
$34.993
$25.730
Mouser Electronics
$80.800
$57.640
Nova Conductors
$34.751
Digiode
$37.399
Vyrian
Parana Technologies
$4.069
$4.533
DigiPath Technology Company
$4.481
$4.122
ChromeModa Solutions
$4.572
$3.749
IDEA Electronic Components Group
$4.115
AZTECH Wire
$7.784
Ampacity Inc.
$33.460
Aranea Global
$34.056
$32.694
Continental Prestige Electronics
Corphita
$35.430
Microchip USA
$79.928
Argo Parts USA
This material is lightweight yet durable, making the product easy to handle and long-lasting.
Being surface mountable allows for easy and efficient PCB assembly, saving time and resources.
With a fast cycle time, this FIFO offers quick data retrieval and processing, enhancing overall system performance.
The square shape of the package ensures efficient use of space on the PCB, optimizing the layout for other components.
Synchronous operation ensures data is transmitted and processed in a synchronized manner, reducing errors and improving data integrity.
The standard 3.3V supply voltage makes it compatible with a wide range of systems and power sources.
The low power supply requirement of 3.3V helps in reducing power consumption and heat dissipation.
The ample number of terminals allows for easy connection to other components, improving scalability and versatility.
The low-profile flatpack package style saves space on the PCB, making it suitable for compact designs.
With a high maximum operating temperature, the FIFO can withstand harsh environmental conditions without performance degradation.
FIFO SN74V263PZAEP attributes and parameters. Explore more FIFO devices from Texas Instruments
Maximum Access Time:
Additional Features:
Alternate Memory Width:
Maximum Clock Frequency (fCLK):
Cycle Time:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
SN74V263PZAEP Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.B
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Packaging - 14x14x1.4 LQFP Tray Update 26/Sep/2013 New Tray 08/Jun/2020
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
LM358ADR
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
LP2950CDT-3.3G
Onsemi
LP2950CDT-3.3G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 0.1A. It has a small outline package style, operates at temperatures ranging from -40 to 125 °C, and is suitable for applications requiring low dropout voltage and precise voltage regulation in electronic circuits.
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM2931Z-5.0RPG
LM2931Z-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.1A Max Output Current, and 6V Min Input Voltage. It operates in temperatures ranging from -40 to 125 °C and is ideal for applications requiring stable voltage regulation in electronic circuits.
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
EU2B-YS2J03F
Idec
ROTARY SWITCH;
LFXTAL025159REEL
Iqd Frequency Products
LFXTAL025159REEL by IQD Frequency Products is a 32.768 kHz crystal oscillator with 20 ppm frequency tolerance and 40,000 ohm series resistance. It is ideal for applications requiring precise timekeeping, such as real-time clocks in IoT devices or microcontrollers in wearables. The surface-mount design with a drive level of 1 uW makes it suitable for compact electronic systems.
Eic Semiconductor
Central Semiconductor
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Transistor & Electronic
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Good-ark Electronics
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
SN74ACT7203L50RJ
SN74ACT7203L50RJ by Texas Instruments is a FIFO chip with 2Kx9 organization, operating at 5V with a cycle time of 65ns. It features parallel operation, 15MHz clock frequency, and is suitable for commercial temperature grade applications.
SN74ACT7202LA15RJ
SN74ACT7202LA15RJ by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 40MHz clock frequency. It has a cycle time of 25ns and can be used in applications requiring fast asynchronous data transfer. With a memory density of 9216 bits, it is suitable for commercial temperature grade environments.
CD74HC40105M
Rca Solid State
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words Code: 16;
IDT72V3660L6PFG8
Integrated Device Technology
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; No. of Functions: 1;
SN74ABT7815-40PQ
SN74ABT7815-40PQ by Texas Instruments is a 128x36 bi-directional FIFO memory IC with a max clock frequency of 25 MHz. Operating at 5V, it has a max access time of 16 ns and operates in synchronous mode. This device, housed in a square plastic/epoxy package, is ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ABT3611-20PQR
SN74ABT3611-20PQR by Texas Instruments is a FIFO with 64x36 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring synchronous operation, such as data buffering and communication systems.
72V05L25JGI
Renesas Electronics
Renesas Electronics' 72V05L25JGI FIFO chip features 8Kx9 organization, 35ns cycle time, and operates at a supply voltage of 3.3V. Ideal for industrial applications requiring fast access times and high memory density.
72V845L15PFI8
72V845L15PFI8 FIFO by Integrated Device Technology features a cycle time of 15ns, operating at 3.3V with an organization of 4KX18. Ideal for industrial applications, this CMOS technology device offers parallel operation and a memory width of 18 bits.
7201LA25JGI8
Renesas Electronics 7201LA25JGI8 FIFO chip features 512x9 organization, 35ns cycle time, and operates at 5V. Ideal for industrial applications requiring fast parallel access memory with a memory density of 4608 bits. The chip is designed in a rectangular chip carrier package style for surface mount assembly.
SN74ACT7203-30N
SN74ACT7203-30N by Texas Instruments is a FIFO with 2Kx9 organization, operating at 5V. It has a max clock frequency of 25MHz and memory density of 18432 bits. Ideal for applications requiring asynchronous operation and fast access times up to 30ns.
CD40105BF3A
CD40105BF3A by Texas Instruments is a 16X4 FIFO with 666.66 ns cycle time, operating at 5V. It has 3-STATE output characteristics and supports a max clock frequency of 1.5 MHz. Ideal for military applications requiring fast data storage and retrieval in harsh environments.
IDT7203L15TPI
IDT7203L15TPI by Integrated Device Technology is a FIFO memory with 2Kx9 organization, operating at 40 MHz clock frequency. It features a cycle time of 25 ns and is suitable for industrial applications requiring fast data storage and retrieval. With a package style of IN-LINE and through-hole terminal form, it offers reliable performance in harsh environments.
SN74ACT3632-20PCBR
SN74ACT3632-20PCBR by Texas Instruments is a FIFO with 512x36 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments needing high memory density and low profile packaging.
SN74ACT3651-15PCB
SN74ACT3651-15PCB by Texas Instruments is a FIFO with 2Kx36 organization, operating at 66.7MHz with 15ns cycle time. It features a memory density of 73728 bits and is ideal for applications requiring bi-directional FIFO memory ICs with synchronous operation.
SN74V293-7PZA
SN74V293-7PZA by Texas Instruments is a FIFO memory with 64Kx18 organization, operating at 166 MHz. It features a cycle time of 7.5 ns and synchronous operation, suitable for applications requiring fast data transfer and storage in commercial-grade environments. The device has a low profile flatpack package with 80 terminals and supports an output enable function for efficient power management.
SN74ABT7819-20PH
SN74ABT7819-20PH by Texas Instruments is a 512x18 FIFO with 20ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a max clock frequency of 50MHz. Ideal for applications requiring high-speed data buffering in commercial temperature environments.
SN74ACT2229DW
SN74ACT2229DW by Texas Instruments is a FIFO memory with 256x1 organization, operating at 60 MHz clock frequency. It features a cycle time of 16.67 ns and operates in synchronous mode. This small outline package is ideal for industrial applications requiring fast access times and low standby current consumption.
SN74ACT7203L15NP
SN74ACT7203L15NP by Texas Instruments is a FIFO memory with 2Kx9 organization, operating at 40 MHz clock frequency and 25 ns cycle time. It is designed for parallel data transfer applications in commercial temperature grade environments.
SN74ACT7204L-15RJR
SN74ACT7204L-15RJR by Texas Instruments is a 4Kx9 FIFO chip with 25ns cycle time, operating at 5V. It features asynchronous mode, 3-STATE output, and parallel organization. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
IDT7200L15SOI8
Rochester Electronics
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words: 256 words;
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TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
SN74V293-6PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; No. of Functions: 1;
SN74V245-15PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Organization: 4KX18;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; JESD-30 Code: S-PQFP-G80;
SN74V245-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH;
SN74V235-7PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SN74V245-7PAG
SN74V245-7PAG by Texas Instruments is a FIFO with 4Kx18 organization, operating at 166MHz. It features a cycle time of 7.5ns, synchronous mode, and 3-state output characteristics. This memory IC type is suitable for applications requiring fast data transfer and parallel operation in commercial temperature environments.
SN74V215-7PAG
SN74V215-7PAG by Texas Instruments is a FIFO with 512x18 organization, operating at 133 MHz clock frequency. It features a cycle time of 7.5 ns and operates at a nominal voltage of 3.3 V. This device is ideal for applications requiring fast data storage and retrieval in synchronous mode with 3-STATE output characteristics.
SN74ACT7201LA-25NP
SN74ACT7201LA-25NP by Texas Instruments is a FIFO with 512x9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates at 5V, has a temp range of 0-70°C, and is ideal for parallel memory applications due to its CMOS technology and 3-STATE output characteristics.
SN74ACT7202LA25NP
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
SN74V263-6PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
SN74V215-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; JESD-609 Code: e4;
SN74V245-15PAGEP
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Parallel or Serial: PARALLEL;
SN74V215-20PAG
SN74V215-20PAG by Texas Instruments is a FIFO memory IC with 512x18 organization and 512 words code. It operates synchronously with a cycle time of 20 ns and has a max clock frequency of 133 MHz. This IC is commonly used in applications that require high-speed data buffering and storage.
SN74V283-15PZA
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Maximum Standby Current: .015 Amp;
SN74ALVC7803-40DL
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
SN74ABT7819A-15PN
SN74ABT7819A-15PN by Texas Instruments is a 512KX18 BI-DIRECTIONAL FIFO with a cycle time of 15 ns and max clock frequency of 67 MHz. It is commonly used in applications requiring high-speed data buffering and storage.
SN74ABT7819A-30PH
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Organization: 512KX18;
SN74V235-10PAG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: TFQFP; Package Shape: SQUARE; Surface Mount: YES;
SN74ABT7819A-10PN
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Cycle Time: 10 ns;
SN74ABT7819A-15PH
BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: 0 Cel;
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