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5962-9650901QXX

Texas Instruments

5962-9650901QXX by Texas Instruments

The Texas Instruments 5962-9650901QXX FIFO operates synchronously with a cycle time of 25ns. It has an organization of 512x18 words and a memory density of 9216 bits, suitable for military-grade applications requiring fast access times. The package is ceramic-metal-sealed co-fired, MIL-PRF-38535 Class Q screened, with a max operating temperature of 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,920 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,920

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Digiode

USA . 3,916 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,916

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,002 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

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-

1,002

$2.000

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Parana Technologies

USA . 1,196 parts In-Stock

1+ parts

$2.383

100+ parts

-

1k+ parts

$2.880

10k+ parts

-

1,196

$2.383

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$2.880

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DigiPath Technology Company

USA . 1,500 parts In-Stock

1+ parts

$2.623

100+ parts

$2.414

1k+ parts

-

10k+ parts

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1,500

$2.623

$2.414

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$2.677

100+ parts

-

1k+ parts

$2.409

10k+ parts

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1,473

$2.677

-

$2.409

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ChromeModa Solutions

Germany . 1,438 parts In-Stock

1+ parts

$2.677

100+ parts

$2.195

1k+ parts

-

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1,438

$2.677

$2.195

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AZTECH Wire

Italy . 500 parts In-Stock

1+ parts

$11.473

100+ parts

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500

$11.473

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Native Components

USA . 420 parts In-Stock

1+ parts

$753.560

100+ parts

$738.489

1k+ parts

$730.953

10k+ parts

$723.418

420

$753.560

$738.489

$730.953

$723.418

Northwest PG Solutions

USA . 945 parts In-Stock

1+ parts

$828.916

100+ parts

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945

$828.916

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Corphita

USA . 2,373 parts In-Stock

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2,373

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Overview

Experience unparalleled performance and reliability with the Texas Instruments 5962-9650901QXX FIFO memory. Crafted from high-quality ceramic and metal-sealed cofired materials, this synchronous operating mode device offers a seamless user experience in a MILITARY-grade package. With a wide temperature range and fast cycle time, this product is ideal for demanding applications where speed and precision are critical. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for your projects. Elevate your designs with the unmatched value and benefits of the 5962-9650901QXX FIFO memory today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This ensures durability and reliability, making the product suitable for harsh operating conditions.

Cycle Time: 25 ns

Fast cycle time allows for quick data access and processing, improving overall system performance.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is synchronized and processed efficiently, reducing errors and latency.

Maximum Operating Temperature: 125 °C

High operating temperature range allows the product to be used in a variety of environments without compromising performance.

No. of Words: 512 words

Large memory capacity allows for storing a significant amount of data, making it suitable for demanding applications.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both bipolar and CMOS technologies, providing high speed and low power consumption.

Output Enable: YES

Having an output enable feature allows for controlling the data output, enhancing flexibility and efficiency in data handling.

Technical Specifications

FIFO 5962-9650901QXX attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

18 ns

Cycle Time:

25 ns

JESD-30 Code:

S-CPGA-P84

JESD-609 Code:

e0

Length:

29.464 mm

Memory Density:

9216 bit

Memory Width:

18

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Functions:

1

No. of Terminals:

84

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

512X18

Output Enable:

YES

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT APPLICABLE

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class Q

Maximum Seated Height:

5.21 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

PIN/PEG

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT APPLICABLE

Width:

29.464 mm

Trade Compliance

5962-9650901QXX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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