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SN74ACT3631-20PCB

Texas Instruments

SN74ACT3631-20PCB by Texas Instruments

Texas Instruments SN74ACT3631-20PCB FIFO operates synchronously at 50MHz with 512x36 organization. It has a cycle time of 20ns, suitable for applications requiring fast data transfer and storage in commercial-grade environments. The device features a 3-STATE output characteristic and supports parallel operation with a memory width of 36 bits.

Median Price

$17.160

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 643 parts In-Stock

1+ parts

-

100+ parts

$14.850

1k+ parts

$13.290

10k+ parts

$12.500

643

-

$14.850

$13.290

$12.500

DigiKey

USA . 643 parts In-Stock

1+ parts

-

100+ parts

$17.160

1k+ parts

-

10k+ parts

-

643

-

$17.160

-

-

Verical

USA . 365 parts In-Stock

1+ parts

-

100+ parts

$18.563

1k+ parts

$16.613

10k+ parts

$15.625

365

-

$18.563

$16.613

$15.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,848 parts In-Stock

1+ parts

$15.675

100+ parts

-

1k+ parts

-

10k+ parts

-

1,848

$15.675

-

-

-

Vyrian

USA . 5,703 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,703

-

-

-

-

Resion

USA . 34 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

34

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,133 parts In-Stock

1+ parts

$3.767

100+ parts

-

1k+ parts

$4.261

10k+ parts

-

2,133

$3.767

-

$4.261

-

ChromeModa Solutions

Germany . 6,906 parts In-Stock

1+ parts

$4.233

100+ parts

$3.471

1k+ parts

-

10k+ parts

-

6,906

$4.233

$3.471

-

-

IDEA Electronic Components Group

UK . 582 parts In-Stock

1+ parts

$4.233

100+ parts

-

1k+ parts

$3.810

10k+ parts

-

582

$4.233

-

$3.810

-

Ampacity Inc.

Singapore . 201 parts In-Stock

1+ parts

$14.030

100+ parts

-

1k+ parts

-

10k+ parts

-

201

$14.030

-

-

-

Corphita

USA . 2,767 parts In-Stock

1+ parts

$14.850

100+ parts

-

1k+ parts

-

10k+ parts

-

2,767

$14.850

-

-

-

Microchip USA

USA . 355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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355

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-

-

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DigiPath Technology Company

USA . 345 parts In-Stock

1+ parts

-

100+ parts

$3.816

1k+ parts

-

10k+ parts

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345

-

$3.816

-

-

Overview

Enhance your electronic designs with the SN74ACT3631-20PCB by Texas Instruments, a top-quality FIFO device that guarantees reliability and performance. This versatile component offers fast cycle times, synchronous operation, and a wide operating voltage range, making it ideal for a variety of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this product will deliver superior results. Upgrade your projects with the SN74ACT3631-20PCB and experience the value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the FIFO device, making it suitable for various applications.

Cycle Time: 20 ns

With a fast cycle time of 20 ns, this FIFO device ensures quick and efficient data storage and retrieval processes, improving overall system performance.

Operating Mode: SYNCHRONOUS

The synchronous operating mode allows for precise timing and coordination with other components in the system, enhancing data transfer reliability.

Maximum Clock Frequency (fCLK): 50 MHz

The high maximum clock frequency of 50 MHz enables rapid communication and data processing, making this FIFO device ideal for high-performance systems.

Memory Density: 18432 bit

With a high memory density of 18432 bits, this FIFO device can store a large amount of data efficiently, catering to the needs of data-intensive applications.

Technical Specifications

FIFO SN74ACT3631-20PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

13 ns

Additional Features:

MAILBOX

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G120

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

120

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74ACT3631-20PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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