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SN74ABT7820-25PNR

Texas Instruments

SN74ABT7820-25PNR by Texas Instruments

SN74ABT7820-25PNR by Texas Instruments is a FIFO with 512x18 organization, 25 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments needing high memory density and low profile packaging.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,838 parts In-Stock

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Digiode

USA . 1,990 parts In-Stock

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1,990

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Parana Technologies

USA . 319 parts In-Stock

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$2.490

100+ parts

$231.255

1k+ parts

$2.241

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319

$2.490

$231.255

$2.241

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DigiPath Technology Company

USA . 688 parts In-Stock

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$2.742

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ChromeModa Solutions

Germany . 3,206 parts In-Stock

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$2.798

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$2.294

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$2.798

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IDEA Electronic Components Group

UK . 1,052 parts In-Stock

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$2.798

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$2.518

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$2.798

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AZTECH Wire

Italy . 392 parts In-Stock

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$7.350

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One Stop Electronics

USA . 1,295 parts In-Stock

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$30.000

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Corphita

USA . 590 parts In-Stock

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Overview

Experience unparalleled speed and reliability with the SN74ABT7820-25PNR FIFO by Texas Instruments. Designed with state-of-the-art technology, this FIFO offers seamless operation in synchronous mode, ensuring quick data transfer with a cycle time of 25 ns. Whether you're working on high-speed communication systems or data processing applications, the SN74ABT7820-25PNR delivers unmatched performance and efficiency. Trust in Texas Instruments' reputation for quality and innovation, and elevate your projects with this top-of-the-line FIFO solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Cycle Time: 25 ns

Provides fast data processing speed and efficiency.

Package Shape: SQUARE

Optimal use of space on the circuit board.

Operating Mode: SYNCHRONOUS

Ensures synchronized data processing for overall system efficiency.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage requirements for many electronic devices.

No. of Terminals: 80

Provides ample connectivity options for diverse applications.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Offers a compact and slim design for space-constrained applications.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures for reliable performance in various environments.

Organization: 512X18

Provides a good balance between capacity and data width for efficient data storage.

Output Characteristics: 3-STATE

Allows for multiple output states for flexible data transmission.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions without compromising performance.

Terminal Position: QUAD

Enables easy connectivity and integration into circuit board layouts.

Maximum Seated Height: 1.6 mm

Low profile design for space-saving installations.

Width: 12 mm

Compact size for efficient use of space on the circuit board.

Minimum Supply Voltage (Vsup): 4.5 V

Allows operation even with slightly lower voltage inputs.

Length: 12 mm

Compact size for efficient use of space on the circuit board.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies for efficient performance.

Parallel or Serial: PARALLEL

Enables simultaneous data transfer for faster processing.

Terminal Form: GULL WING

Facilitates easy soldering and connection to the circuit board.

No. of Words: 512 words

Offers ample storage capacity for data processing applications.

Memory Width: 18

Suitable for processing data in 18-bit chunks for efficient operations.

Terminal Pitch: 0.5 mm

Allows for close placement of terminals for compact design.

No. of Words Code: 512

Indicates the capacity of the memory in terms of the number of words it can store.

Maximum Supply Voltage (Vsup): 5.5 V

Allows operation with slightly higher voltage inputs for flexibility.

Memory Density: 9216 bit

Provides high data storage density for efficient memory usage.

Output Enable: YES

Enables control over the output for efficient data transmission.

Maximum Access Time: 15 ns

Provides fast data access for quick and efficient processing.

Technical Specifications

FIFO SN74ABT7820-25PNR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

BYPASS XCVR

Cycle Time:

25 ns

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Memory Density:

9216 bit

Memory Width:

18

No. of Functions:

1

No. of Terminals:

80

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X18

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Trade Compliance

SN74ABT7820-25PNR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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