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SN74ACT3622-20PCB

Texas Instruments

SN74ACT3622-20PCB by Texas Instruments

SN74ACT3622-20PCB by Texas Instruments is a FIFO memory IC with 256x36 organization, operating at 20ns cycle time and 50MHz clock frequency. It features a parallel interface, synchronous operation, and 3-state output characteristics. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$22.830

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,432 parts In-Stock

1+ parts

-

100+ parts

$19.750

1k+ parts

$17.670

10k+ parts

$16.630

1,432

-

$19.750

$17.670

$16.630

DigiKey

USA . 982 parts In-Stock

1+ parts

-

100+ parts

$22.830

1k+ parts

-

10k+ parts

-

982

-

$22.830

-

-

Verical

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$24.688

1k+ parts

$22.087

10k+ parts

$20.788

900

-

$24.688

$22.087

$20.788

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,509 parts In-Stock

1+ parts

$20.852

100+ parts

-

1k+ parts

-

10k+ parts

-

3,509

$20.852

-

-

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Vyrian

USA . 5,309 parts In-Stock

1+ parts

-

100+ parts

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-

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5,309

-

-

-

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DigiKey Marketplace

USA . 1,432 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,432

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,281 parts In-Stock

1+ parts

$2.805

100+ parts

-

1k+ parts

$3.291

10k+ parts

-

2,281

$2.805

-

$3.291

-

DigiPath Technology Company

USA . 2,047 parts In-Stock

1+ parts

$3.089

100+ parts

$2.842

1k+ parts

-

10k+ parts

-

2,047

$3.089

$2.842

-

-

ChromeModa Solutions

Germany . 6,609 parts In-Stock

1+ parts

$3.152

100+ parts

$2.585

1k+ parts

-

10k+ parts

-

6,609

$3.152

$2.585

-

-

IDEA Electronic Components Group

UK . 294 parts In-Stock

1+ parts

$3.152

100+ parts

-

1k+ parts

$2.837

10k+ parts

-

294

$3.152

-

$2.837

-

Corphita

USA . 1,930 parts In-Stock

1+ parts

$19.755

100+ parts

-

1k+ parts

-

10k+ parts

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1,930

$19.755

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-

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QUARKTWIN TECHNOLOGY LTD

USA . 17,020 parts In-Stock

1+ parts

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100+ parts

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17,020

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Microchip USA

USA . 371 parts In-Stock

1+ parts

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371

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Overview

Experience seamless data transfer and reliable performance with the SN74ACT3622-20PCB FIFO by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovation in every product they create. Ideal for a wide range of applications, this FIFO offers fast cycle times and operates synchronously, providing customers with efficient data storage and retrieval. With a 256x36 organization and 3-state output characteristics, this FIFO delivers exceptional value and benefits to meet your data processing needs. Choose Texas Instruments for superior technology and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protects the internal components of the FIFO, ensuring long-term reliability.

Cycle Time: 20 ns

The fast cycle time of 20 ns allows for quick data processing and efficient operation of the FIFO, making it suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V, this FIFO is compatible with standard power supplies and can easily integrate into existing systems.

Organization: 256X36

With an organization of 256 words by 36 bits, this FIFO provides ample storage capacity for data buffering and transfer, suitable for complex data processing tasks.

Maximum Clock Frequency (fCLK): 50 MHz

The high maximum clock frequency of 50 MHz allows for rapid data transfer and processing, making this FIFO ideal for applications requiring real-time data handling.

Technology: CMOS

Utilizing CMOS technology, this FIFO offers low power consumption and high noise immunity, enhancing overall performance efficiency.

Memory IC Type: BI-DIRECTIONAL FIFO

The bi-directional FIFO design supports simultaneous read and write operations, enabling efficient data flow management and enhancing system flexibility.

Technical Specifications

FIFO SN74ACT3622-20PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

13 ns

Additional Features:

MAILBOX

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

SN74ACT3622-20PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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