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SN74ABT3612-20PQ

Texas Instruments

SN74ABT3612-20PQ by Texas Instruments

SN74ABT3612-20PQ by Texas Instruments is a 64x36 bi-directional FIFO memory IC with a cycle time of 20 ns and max clock frequency of 50 MHz. It operates in synchronous mode, has a memory density of 2304 bit, and supports parallel data transfer. This device is ideal for applications requiring fast and efficient data storage and retrieval in commercial temperature environments.

Median Price

$11.760

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,175 parts In-Stock

1+ parts

-

100+ parts

$10.170

1k+ parts

$9.100

10k+ parts

$8.570

4,175

-

$10.170

$9.100

$8.570

DigiKey

USA . 4,175 parts In-Stock

1+ parts

-

100+ parts

$11.760

1k+ parts

-

10k+ parts

-

4,175

-

$11.760

-

-

Verical

USA . 3,134 parts In-Stock

1+ parts

-

100+ parts

$12.713

1k+ parts

$11.375

10k+ parts

$10.713

3,134

-

$12.713

$11.375

$10.713

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 673 parts In-Stock

1+ parts

$10.744

100+ parts

-

1k+ parts

-

10k+ parts

-

673

$10.744

-

-

-

Vyrian

USA . 4,085 parts In-Stock

1+ parts

$11.310

100+ parts

-

1k+ parts

-

10k+ parts

-

4,085

$11.310

-

-

-

DigiKey Marketplace

USA . 4,201 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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4,201

-

-

-

-

Inland Empire Components Inc.

USA . 179 parts In-Stock

1+ parts

-

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179

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J & M Industries LLC

USA . 128 parts In-Stock

1+ parts

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128

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Elcom Components

USA . 56 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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56

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,161 parts In-Stock

1+ parts

$4.477

100+ parts

-

1k+ parts

$4.912

10k+ parts

-

2,161

$4.477

-

$4.912

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DigiPath Technology Company

USA . 2,097 parts In-Stock

1+ parts

$4.929

100+ parts

$4.535

1k+ parts

-

10k+ parts

-

2,097

$4.929

$4.535

-

-

ChromeModa Solutions

Germany . 4,270 parts In-Stock

1+ parts

$5.030

100+ parts

$4.125

1k+ parts

-

10k+ parts

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4,270

$5.030

$4.125

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-

IDEA Electronic Components Group

UK . 183 parts In-Stock

1+ parts

$5.030

100+ parts

-

1k+ parts

$4.527

10k+ parts

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183

$5.030

-

$4.527

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Corphita

USA . 3,563 parts In-Stock

1+ parts

$10.179

100+ parts

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10k+ parts

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3,563

$10.179

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Microchip USA

USA . 346 parts In-Stock

1+ parts

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100+ parts

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346

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Overview

Unlock seamless data transfer and increased efficiency with the Texas Instruments SN74ABT3612-20PQ FIFO memory IC. Trusted by industry leaders for its superior quality and reliability, this product offers a wide range of applications in various electronic devices. With a cycle time of 20 ns and an operating mode of synchronous, this FIFO memory chip guarantees fast and synchronized data processing. Experience the value of smooth operation, high performance, and unmatched convenience with the SN74ABT3612-20PQ from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for portable applications.

Cycle Time: 20 ns

The fast cycle time of 20 ns ensures efficient operation and high-speed data processing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

No. of Terminals: 132

Having 132 terminals allows for flexible connectivity options and integration with other components.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand a wide range of environmental conditions.

Organization: 64X36

The 64X36 organization offers a large memory capacity and efficient data storage capabilities.

Technology: BICMOS

Utilizing BICMOS technology ensures high performance, low power consumption, and reliability in data processing.

Memory IC Type: BI-DIRECTIONAL FIFO

The bi-directional FIFO memory IC type allows for seamless data transfer in both directions, enhancing overall system functionality.

Technical Specifications

FIFO SN74ABT3612-20PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

12 ns

Additional Features:

PARITY GENERATOR/CHECKER; MAILBOX

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

132

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Current:

130 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Trade Compliance

SN74ABT3612-20PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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