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SN74ACT7203L50RJ

Texas Instruments

SN74ACT7203L50RJ by Texas Instruments

SN74ACT7203L50RJ by Texas Instruments is a FIFO chip with 2Kx9 organization, operating at 5V with a cycle time of 65ns. It features parallel operation, 15MHz clock frequency, and is suitable for commercial temperature grade applications.

Median Price

$2.950

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$2.950

1k+ parts

$2.640

10k+ parts

$2.490

6

-

$2.950

$2.640

$2.490

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 397 parts In-Stock

1+ parts

$3.106

100+ parts

-

1k+ parts

-

10k+ parts

-

397

$3.106

-

-

-

Vyrian

USA . 5,736 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,736

-

-

-

-

Inland Empire Components Inc.

USA . 78 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

78

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,670 parts In-Stock

1+ parts

$2.184

100+ parts

-

1k+ parts

$2.695

10k+ parts

-

1,670

$2.184

-

$2.695

-

DigiPath Technology Company

USA . 2,240 parts In-Stock

1+ parts

$2.405

100+ parts

-

1k+ parts

-

10k+ parts

-

2,240

$2.405

-

-

-

IDEA Electronic Components Group

UK . 2,298 parts In-Stock

1+ parts

$2.454

100+ parts

-

1k+ parts

$2.209

10k+ parts

-

2,298

$2.454

-

$2.209

-

ChromeModa Solutions

Germany . 2,136 parts In-Stock

1+ parts

$2.454

100+ parts

$2.012

1k+ parts

-

10k+ parts

-

2,136

$2.454

$2.012

-

-

Corphita

USA . 3,407 parts In-Stock

1+ parts

$2.943

100+ parts

-

1k+ parts

-

10k+ parts

-

3,407

$2.943

-

-

-

Microchip USA

USA . 2,431 parts In-Stock

1+ parts

$20.410

100+ parts

$20.280

1k+ parts

$20.220

10k+ parts

$20.160

2,431

$20.410

$20.280

$20.220

$20.160

Overview

Experience seamless data transfer with the SN74ACT7203L50RJ by Texas Instruments, a high-quality FIFO memory chip designed for reliable performance. Perfect for a wide range of applications, this chip offers a fast cycle time of 65 ns, making it ideal for use in commercial-grade electronics. With a nominal supply voltage of 5V and low power consumption, customers can trust in the efficiency and durability of this product. Upgrade your devices today with the trusted technology of Texas Instruments.

Feature Benefit Bullets

Cycle Time: 65 ns

Fast cycle time of 65 ns allows for quick data retrieval and processing, making this FIFO a high-performance option.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent and flexible data transfer, enhancing the efficiency and versatility of the FIFO.

Maximum Clock Frequency: 15 MHz

Support for a high clock frequency of 15 MHz enables rapid data transfer and processing, making this FIFO suitable for applications requiring quick data handling.

Memory Density: 18432 bit

High memory density of 18432 bit allows for storage of a large amount of data, making this FIFO ideal for applications with extensive data requirements.

Memory IC Type: OTHER FIFO

The use of FIFO memory IC type ensures efficient and organized data handling, making this product a reliable choice for data storage and retrieval.

Technical Specifications

FIFO SN74ACT7203L50RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

50 ns

Maximum Clock Frequency (fCLK):

15 MHz

Cycle Time:

65 ns

JESD-30 Code:

R-PQCC-J32

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.002 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ACT7203L50RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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