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SN74ACT3631-15PCB

Texas Instruments

SN74ACT3631-15PCB by Texas Instruments

SN74ACT3631-15PCB by Texas Instruments is a FIFO with 512x36 organization, operating at 66.7MHz with a cycle time of 15ns. It features synchronous operation, 3-STATE output characteristics, and is suitable for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$17.160

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 358 parts In-Stock

1+ parts

-

100+ parts

$14.850

1k+ parts

$13.290

10k+ parts

$12.500

358

-

$14.850

$13.290

$12.500

DigiKey

USA . 358 parts In-Stock

1+ parts

-

100+ parts

$17.160

1k+ parts

-

10k+ parts

-

358

-

$17.160

-

-

Verical

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$18.563

1k+ parts

$16.613

10k+ parts

$15.625

260

-

$18.563

$16.613

$15.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,869 parts In-Stock

1+ parts

$15.675

100+ parts

-

1k+ parts

-

10k+ parts

-

4,869

$15.675

-

-

-

Vyrian

USA . 8,998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,998

-

-

-

-

DigiKey Marketplace

USA . 358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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358

-

-

-

-

LWI Electronics Inc

India . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,345 parts In-Stock

1+ parts

$4.203

100+ parts

-

1k+ parts

$4.639

10k+ parts

-

1,345

$4.203

-

$4.639

-

DigiPath Technology Company

USA . 586 parts In-Stock

1+ parts

$4.628

100+ parts

-

1k+ parts

-

10k+ parts

-

586

$4.628

-

-

-

ChromeModa Solutions

Germany . 5,884 parts In-Stock

1+ parts

$4.722

100+ parts

$3.872

1k+ parts

-

10k+ parts

-

5,884

$4.722

$3.872

-

-

IDEA Electronic Components Group

UK . 610 parts In-Stock

1+ parts

$4.722

100+ parts

-

1k+ parts

$4.250

10k+ parts

-

610

$4.722

-

$4.250

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$7.144

100+ parts

$7.072

1k+ parts

$6.786

10k+ parts

-

50

$7.144

$7.072

$6.786

-

Corphita

USA . 3,935 parts In-Stock

1+ parts

$14.850

100+ parts

-

1k+ parts

-

10k+ parts

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3,935

$14.850

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 20,593 parts In-Stock

1+ parts

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20,593

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Microchip USA

USA . 109 parts In-Stock

1+ parts

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109

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Assy Fe

Spain . 30 parts In-Stock

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30

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Overview

Enhance your electronic projects with the SN74ACT3631-15PCB by Texas Instruments, a high-quality FIFO memory IC that offers unrivaled performance and reliability. Designed with precision and expertise, this product is perfect for a wide range of applications, providing seamless data storage and retrieval. With a fast cycle time of 15 ns and an operating mode of synchronous, you can trust this device to deliver optimal results every time. Invest in the SN74ACT3631-15PCB today and experience the superior value, benefits, and advantages that Texas Instruments brings to the table. Elevate your projects with the best in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability for the product, making it suitable for various applications.

Cycle Time: 15 ns

The fast cycle time of 15 ns ensures efficient and quick data processing, making the product ideal for high-speed applications.

Operating Mode: SYNCHRONOUS

The synchronous operation allows for precise timing and coordination between data inputs and outputs, enhancing overall performance.

Memory Width: 36

With a memory width of 36, this FIFO product can efficiently handle a large amount of data simultaneously, making it suitable for data-intensive tasks.

Maximum Clock Frequency (fCLK): 66.7 MHz

The high maximum clock frequency of 66.7 MHz ensures fast data transfer rates and processing speeds, making the product ideal for high-performance applications.

Technical Specifications

FIFO SN74ACT3631-15PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

11 ns

Additional Features:

MAILBOX

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G120

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

120

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74ACT3631-15PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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