Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Renesas Electronics 72V275L10TFG8 is a FIFO memory IC with a cycle time of 10 ns and an operating frequency of up to 100 MHz. It has a memory density of 589824 bits and is commonly used in applications requiring high-speed data buffering and storage.
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PLASTIC/EPOXY - Makes the product lightweight and durable, suitable for various applications.
YES - Allows for easy and efficient installation on circuit boards, saving time and effort.
10 ns - Provides fast data transfer and processing, enhancing overall performance.
1 - Simplifies the design and integration process, making it cost-effective and reliable.
SQUARE - Allows for efficient use of space on the circuit board, optimizing the layout.
SYNCHRONOUS - Ensures synchronized communication and data transfer, reducing errors.
3.3 - Offers a standard voltage level compatible with most systems, enhancing compatibility.
3.3 - Provides a reliable power source, ensuring stable and consistent operation.
64 - Offers a sufficient number of terminals for easy connectivity and integration.
FLATPACK, LOW PROFILE, FINE PITCH - Enables compact and space-efficient designs, suitable for compact devices.
70 °C - Allows the product to operate in various environments without the risk of overheating.
32KX18 - Provides a large memory capacity, allowing for the storage and retrieval of a significant amount of data.
0 °C - Enables the product to operate in cold environments without performance degradation.
Matte Tin (Sn) - annealed - Enhances the durability and longevity of the terminals, reducing the risk of corrosion.
QUAD - Facilitates easy and organized connectivity with other components in the circuit.
1.6 mm - Allows for a low-profile design, enabling the product to fit in tight spaces.
100 MHz - Provides high-speed data transfer capabilities, improving overall system performance.
10 mm - Compact size allows for flexible placement and integration in various devices or systems.
3 V - Provides a lower voltage option for systems with specific power requirements.
30 - Allows for safe and efficient soldering without damaging the product.
260 - Can withstand high-temperature soldering processes, ensuring product reliability.
10 mm - Compact size allows for versatile integration in different systems or devices.
COMMERCIAL - Suitable for standard commercial applications, ensuring compatibility and availability.
CMOS - Utilizes CMOS technology for efficient power consumption and reliable performance.
PARALLEL - Offers parallel data transfer, enabling fast and simultaneous processing.
GULL WING - Easy to solder and provides secure connections, ensuring reliable operation.
60 mA - Efficient power consumption, reducing the strain on the power supply system.
32768 words - Large memory capacity for storing extensive data, suitable for demanding applications.
18 - Wide memory width allows for handling larger chunks of data simultaneously, increasing efficiency.
0.5 mm - Provides a narrow pitch for efficient and compact board layout, optimizing space utilization.
32K - Identifies the memory capacity as 32K words for easy reference and compatibility.
3 - Indicates resistance to moisture-related damage, ensuring product reliability.
3.6 V - Allows for a higher voltage supply option in systems requiring increased power.
589824 bit - Large memory density, facilitating the storage of vast amounts of data for complex applications.
OTHER FIFO - Indicates the product functions as a FIFO memory, enabling efficient data handling.
YES - Provides the option to enable or disable the output, offering flexibility in data transmission.
0.02 Amp - Low standby current consumption, reducing power usage during idle periods.
6.5 ns - Fast access time enables quick retrieval and processing of data, enhancing overall performance.
FIFO 72V275L10TFG8 attributes and parameters. Explore more FIFO devices from Renesas Electronics
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JESD-609 Code:
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Organization:
Output Enable:
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Parallel or Serial:
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72V275L10TFG8 Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Design/Specification - All Dev Label Chg 1/Dec/2022
PCN Assembly/Origin - Alt. Assembly Site 15/Feb/2016
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
2N2222A
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1554216002
Molex
WIRE AND CABLE;
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
SMBJ18CA
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
SS14
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Microsemi
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
SN74ACT2236-30FNR
Texas Instruments
SN74ACT2236-30FNR by Texas Instruments is a FIFO chip with 2Kx9 organization, 30.3ns cycle time, and 25ns max access time. It operates synchronously at 5V with 44 terminals in a square chip carrier package. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT3622-20PCB
SN74ACT3622-20PCB by Texas Instruments is a FIFO memory IC with 256x36 organization, operating at 20ns cycle time and 50MHz clock frequency. It features a parallel interface, synchronous operation, and 3-state output characteristics. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7202LA25J8
Integrated Device Technology
7202LA25J8 by Integrated Device Technology is a FIFO memory chip with a cycle time of 35 ns and an operating voltage of 5V. It is commonly used in applications that require high-speed data buffering and storage, such as telecommunications and networking systems.
72V36110L15PFI8
72V36110L15PFI8 FIFO by Integrated Device Technology features a cycle time of 15ns, operating at 3.3V with an organization of 128KX36. Ideal for industrial applications, this FIFO offers parallel operation and a max clock frequency of 66.7MHz, making it suitable for high-speed data buffering needs.
SN74ACT3642-30PQR
SN74ACT3642-30PQR by Texas Instruments is a FIFO with 1KX36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments.
7206L15JG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Qualification: Not Qualified;
SN74ABT7819-12PH
SN74ABT7819-12PH by Texas Instruments is a 512x18 FIFO with 80 terminals and operates at a max clock frequency of 80 MHz. It features a cycle time of 12.5 ns, synchronous operation, and output enable functionality. This memory IC type is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT7200L12SOG8
Renesas Electronics
The Renesas Electronics IDT7200L12SOG8 is a FIFO memory with 256x9 organization, operating at 50 MHz clock frequency. It features a cycle time of 20 ns and operates on a nominal voltage of 5V. Ideal for applications requiring fast data storage and retrieval in commercial-grade environments.
IDT7202LA12PDG
The Renesas Electronics IDT7202LA12PDG is a FIFO memory with 1Kx9 organization, operating at 20ns cycle time and 50MHz clock frequency. It is used in applications requiring fast data storage and retrieval, with a max supply voltage of 5.5V and temperature range of 0-70°C.
SN74ACT3632-20PQ
SN74ACT3632-20PQ by Texas Instruments is a FIFO with 512x36 organization, operating at 20ns cycle time and 50MHz clock frequency. It is used in applications requiring bi-directional memory storage with parallel data transfer, featuring a max standby current of 0.0004A and output enable functionality.
72V801L15PFGI8
The Renesas Electronics 72V801L15PFGI8 is a FIFO with 256x9 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It is suitable for industrial applications requiring a memory density of 2304 bit, such as data buffering in communication systems or signal processing equipment.
72V3664L10PFG8
The Renesas Electronics 72V3664L10PFG8 is a FIFO memory IC with 4Kx36 organization, operating at 3.3V. It features a cycle time of 10ns and synchronous operation mode, suitable for applications requiring fast data processing in commercial temperature environments. The device has a memory density of 147456 bits and supports parallel access with an output enable feature for efficient data retrieval.
1O7820-15PNG4
1O7820-15PNG4 by Texas Instruments is a 512x18 FIFO with 15ns cycle time, operating at 5V. It features synchronous operation and GULL WING terminals in a low profile FLATPACK package. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT7202LA35SO8
IDT7202LA35SO8 by Integrated Device Technology is a FIFO with 1KX9 organization, 45 ns cycle time, and 22.2 MHz clock frequency. It operates at 5V, has a small outline package style, and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT7201LA50RJ
SN74ACT7201LA50RJ by Texas Instruments is a FIFO chip with 512x9 organization, operating at 15 MHz clock frequency. It has a cycle time of 65 ns and operates on a nominal voltage of 5V. This CMOS technology chip is used for parallel data storage applications due to its fast access time and low standby current consumption.
7204
Teledyne E2v (Uk)
FIFOs;
SN74ACT3622-30PQR
SN74ACT3622-30PQR by Texas Instruments is a FIFO with 256x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments.
SN74ACT3638-15PQR
SN74ACT3638-15PQR by Texas Instruments is a FIFO with 512x32 organization, 15 ns cycle time, and 3-STATE output characteristics. It operates synchronously at a supply voltage of 5V and is suitable for applications requiring fast data storage and retrieval in commercial temperature environments.
IDT7204L15SOI8
Rochester Electronics
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Finish: TIN LEAD;
SN74ACT7201LA-35RJ
SN74ACT7201LA-35RJ by Texas Instruments is a FIFO chip with 512x9 organization, 45ns cycle time, and 22.2MHz clock frequency. It operates asynchronously at a supply voltage of 5V, making it ideal for high-speed data buffering applications in commercial temperature environments.
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72V2105L10PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Qualification: Not Qualified;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 262144 words;
72V2113L6PFG
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Operating Mode: SYNCHRONOUS;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE; Memory Width: 18;
72V2105L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
72V2111L15PFGI
The Renesas Electronics 72V2111L15PFGI FIFO operates synchronously with a cycle time of 15 ns and a clock frequency of up to 66.7 MHz. It features a memory density of 4718592 bit, suitable for industrial applications requiring fast data processing and parallel operation at temperatures ranging from -40 to 85°C.
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 524288 words;
72V2111L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Standby Current: .02 Amp;
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
72V211L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; No. of Words: 512 words;
72V2111L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; No. of Functions: 1;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 3.15 V;
72V211L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Memory Density: 4608 bit;
72V241L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Minimum Operating Temperature: 0 Cel;
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Surface Mount: YES;
72V241L15PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;
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