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SN74ACT3638-15PCBR

Texas Instruments

SN74ACT3638-15PCBR by Texas Instruments

SN74ACT3638-15PCBR by Texas Instruments is a FIFO with 512x32 organization, 15 ns cycle time, and 3-STATE output characteristics. It operates synchronously at 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

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2

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1k+

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Vyrian

USA . 8,298 parts In-Stock

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Digiode

USA . 3,855 parts In-Stock

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Parana Technologies

USA . 769 parts In-Stock

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$3.621

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$4.134

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769

$3.621

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$4.134

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DigiPath Technology Company

USA . 974 parts In-Stock

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$3.987

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$3.668

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974

$3.987

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ChromeModa Solutions

Germany . 878 parts In-Stock

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$4.068

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$3.336

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$4.068

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IDEA Electronic Components Group

UK . 150 parts In-Stock

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$4.068

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$3.661

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One Stop Electronics

USA . 962 parts In-Stock

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$18.000

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962

$18.000

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AZTECH Wire

Italy . 449 parts In-Stock

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$18.084

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Corphita

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Overview

Unlock seamless data transfer and efficient memory management with the SN74ACT3638-15PCBR FIFO by Texas Instruments. Crafted with precision using high-quality materials, this synchronous FIFO offers a 512x32 organization, 3-STATE output characteristics, and a lightning-fast cycle time of 15 ns. Ideal for a wide range of applications, this low-profile device guarantees reliable performance and smooth operation. Elevate your projects with Texas Instruments' trusted technology and experience unparalleled value with the SN74ACT3638-15PCBR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures longevity and ease of handling.

Surface Mount: YES

Easy to integrate into circuit boards.

Cycle Time: 15 ns

Fast operation speed for efficient data retrieval.

Operating Mode: SYNCHRONOUS

Synchronization ensures accurate data transfer.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for compatibility with various systems.

No. of Terminals: 120

Sufficient terminals for connectivity and data transfer.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Compact design for space-saving and efficient PCB layout.

Maximum Operating Temperature: 70 °C

Wide temperature range for versatile application environments.

Organization: 512X32

Optimal organization for handling a large amount of data efficiently.

Output Characteristics: 3-STATE

Ability to drive multiple loads for enhanced flexibility.

Minimum Operating Temperature: 0 °C

Operational in various temperature conditions.

Maximum Seated Height: 1.6 mm

Low-profile design for space-constrained applications.

Width: 14 mm

Compact width for efficient PCB integration.

Minimum Supply Voltage (Vsup): 4.5 V

Low minimum voltage requirement for power efficiency.

Length: 14 mm

Compact length for space-saving PCB layout.

Temperature Grade: COMMERCIAL

Suitable for commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Parallel or Serial: PARALLEL

Parallel data transfer for fast and efficient operation.

Terminal Form: GULL WING

Gull wing terminals for easy soldering and secure connection.

No. of Words: 512 words

Ample memory capacity for storing data.

Memory Width: 32

Optimal memory width for efficient data handling.

Terminal Pitch: 0.4 mm

Fine terminal pitch for compact design and high density.

No. of Words Code: 512

Generous memory capacity for data storage.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum voltage tolerance for flexibility in power supply.

Memory Density: 16384 bit

High memory density for storing large amounts of data.

Output Enable: YES

Output enable feature for controlling data output.

Maximum Access Time: 11 ns

Fast access time for quick data retrieval.

Technical Specifications

FIFO SN74ACT3638-15PCBR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

11 ns

Additional Features:

RETRANSMIT; MAILBOX

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

16384 bit

Memory Width:

32

No. of Functions:

1

No. of Terminals:

120

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X32

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SN74ACT3638-15PCBR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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