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CD54HCT40105F3A

Texas Instruments

CD54HCT40105F3A by Texas Instruments

CD54HCT40105F3A by Texas Instruments is a 16x4 FIFO with 100ns cycle time, operating at 5V. It has a max clock frequency of 10MHz and is suitable for military-grade applications requiring synchronous operation.

Median Price

$15.680

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6 parts In-Stock

1+ parts

-

100+ parts

$15.680

1k+ parts

$14.030

10k+ parts

$13.200

6

-

$15.680

$14.030

$13.200

Distributors (In-Stock)

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Digiode

USA . 2,439 parts In-Stock

1+ parts

$16.540

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-

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2,439

$16.540

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Freelance Electronics

USA . 48 parts In-Stock

1+ parts

$16.664

100+ parts

$17.497

1k+ parts

$16.498

10k+ parts

-

48

$16.664

$17.497

$16.498

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Vyrian

USA . 5,613 parts In-Stock

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5,613

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Electronic Expediters

USA . 28 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,157 parts In-Stock

1+ parts

$4.976

100+ parts

-

1k+ parts

$5.523

10k+ parts

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1,157

$4.976

-

$5.523

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DigiPath Technology Company

USA . 1,078 parts In-Stock

1+ parts

$5.479

100+ parts

$5.041

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1,078

$5.479

$5.041

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ChromeModa Solutions

Germany . 4,653 parts In-Stock

1+ parts

$5.591

100+ parts

$4.585

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-

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4,653

$5.591

$4.585

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IDEA Electronic Components Group

UK . 2,190 parts In-Stock

1+ parts

$5.591

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-

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$5.032

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2,190

$5.591

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$5.032

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Corphita

USA . 1,013 parts In-Stock

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$15.669

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1,013

$15.669

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Component Stockers USA

USA . 7 parts In-Stock

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$18.080

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7

$18.080

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Microchip USA

USA . 1,449 parts In-Stock

1+ parts

$46.790

100+ parts

$46.120

1k+ parts

$45.790

10k+ parts

$45.450

1,449

$46.790

$46.120

$45.790

$45.450

QUARKTWIN TECHNOLOGY LTD

USA . 4,416 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Northwest PG Solutions

USA . 1,484 parts In-Stock

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1,484

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Native Components

USA . 613 parts In-Stock

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613

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Supply Digital

USA . 159 parts In-Stock

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159

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Perfect Parts

USA . 18 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 8 parts In-Stock

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Overview

Unlock seamless data transfer with the CD54HCT40105F3A FIFO by Texas Instruments. Crafted with precision and reliability, this ceramic, glass-sealed gem offers a seamless synchronous operating mode for a variety of applications. From military-grade operations to industrial automation, experience lightning-fast data handling with a maximum clock frequency of 10 MHz. Upgrade your systems with Texas Instruments' innovative technology and stay ahead of the curve.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed material provides durability and protection for the internal components, ensuring longevity and reliability of the product.

Cycle Time: 100 ns

With a fast cycle time of 100 ns, this FIFO product offers efficient data handling and processing, making it suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination among all connected devices, leading to synchronized data transfer and reduced chances of data errors.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this FIFO product to function reliably in a wide range of environmental conditions, making it suitable for various industrial applications.

Memory Width: 4

With a memory width of 4, this FIFO product is capable of storing and processing data in parallel, improving overall efficiency and performance.

Technical Specifications

FIFO CD54HCT40105F3A attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

2250 ns

Maximum Clock Frequency (fCLK):

10 MHz

Cycle Time:

100 ns

JESD-30 Code:

R-GDIP-T16

Length:

19.56 mm

Memory Density:

64 bit

Memory IC Type:

Memory Width:

4

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

16X4

Output Enable:

YES

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD54HCT40105F3A Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

NSN

5962-01-268-6364, 5962012686364

NIIN

012686364

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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