Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Position: DUAL;
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FIFO CD54HC7030F attributes and parameters. Explore more FIFO devices from Renesas Electronics
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CD54HC7030F Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
LM358DR2G
Onsemi
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
MBRS3200T3G
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
TCA6424ARGJR
Texas Instruments
TCA6424ARGJR by Texas Instruments is a CMOS parallel I/O port with 24 bits and 3 ports. It operates b/w -40 to 85°C, suitable for industrial applications. With a max clock frequency of 0.4 MHz, it offers low power consumption at only 0.03 mA supply current.
Synsemi
1N4148
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138LT3G
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
Diotec Electronics
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
L78L05ABZ-AP
STMicroelectronics
L78L05ABZ-AP by STMicroelectronics is a BIPOLAR fixed positive single output standard regulator with an operating temperature range of -40 to 125°C. It has a nominal output voltage of 5V, max load regulation of 0.06%, and can handle a max output current of 0.07A. Ideal for applications requiring stable voltage regulation in various electronic devices.
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
SN74ACT7204L25RJ
SN74ACT7204L25RJ by Texas Instruments is a FIFO chip with 4Kx9 organization, operating at 28.8MHz clock frequency and 35ns cycle time. It is designed for parallel operation in commercial temperature grade applications, featuring a memory density of 36864 bits and a max supply voltage of 5.5V.
CY7C4235-15AC
Cypress Semiconductor
CY7C4235-15AC by Cypress Semiconductor is a 2Kx18 FIFO with 15ns cycle time, operating at 66.7MHz clock frequency. It is used in applications requiring fast synchronous data transfer and features a 64-terminal flatpack package suitable for surface mount assembly.
SN74ACT3641-20PQR
SN74ACT3641-20PQR by Texas Instruments is a FIFO with 1KX36 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics.
7201LA12JG8
Renesas Electronics
Renesas Electronics 7201LA12JG8 FIFO chip features 512x9 organization, operates at 50 MHz clock frequency, and has a cycle time of 20 ns. Ideal for applications requiring fast data storage and retrieval in commercial-grade temperature environments.
SN74ACT7206L-50DV
SN74ACT7206L-50DV by Texas Instruments is a FIFO memory with 16Kx9 organization, 65ns cycle time, and 15MHz clock frequency. It operates asynchronously at 5V and is ideal for parallel data storage applications in commercial temperature environments.
SN54ABT3614HFPR
SN54ABT3614HFPR by Texas Instruments is a FIFO with 64x36 organization, operating at 5V. It features a cycle time of 20ns and max access time of 12ns. Ideal for military applications due to its MIL-graded temperature range and BICMOS technology.
1M7807-15PAGG4
1M7807-15PAGG4 by Texas Instruments is a 2Kx9 FIFO with 15ns cycle time, operating at 67MHz. Ideal for commercial applications, it features a 64-terminal flatpack package with synchronous operation and parallel interface.
SN74ACT7201LA-25NP
SN74ACT7201LA-25NP by Texas Instruments is a FIFO with 512x9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates at 5V, has a temp range of 0-70°C, and is ideal for parallel memory applications due to its CMOS technology and 3-STATE output characteristics.
SN74ACT72235-20PAGR
SN74ACT72235-20PAGR by Texas Instruments is a FIFO with 1KX9 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and parallel data transfer. The device features a thin profile flatpack package with gull wing terminals for surface mount assembly.
IDT72V2105L10PFG8
IDT72V2105L10PFG8 by Renesas Electronics is a 256Kx18 FIFO with 10ns cycle time, operating at 3.3V. It features synchronous operation and GULL WING terminals in a low profile FLATPACK package. Ideal for applications requiring fast data transfer and memory management in commercial-grade environments.
72V82L15PAG8
The Renesas Electronics 72V82L15PAG8 is a FIFO memory IC with 1Kx9 organization, operating at 3.3V. It features a max access time of 15ns, parallel technology, and a small outline thin profile package shape. Ideal for applications requiring fast data transfer in commercial temperature environments.
72V291L10TFG8
The Renesas Electronics 72V291L10TFG8 FIFO operates synchronously with a cycle time of 10 ns and a clock frequency of up to 100 MHz. With a memory density of 1179648 bit, it is ideal for applications requiring fast data processing such as networking equipment and telecommunications devices. The device features parallel operation, low profile flatpack packaging, and a max operating temperature of 70°C.
SN74ACT3638-15PQ
SN74ACT3638-15PQ by Texas Instruments is a 512x32 FIFO memory IC with 15ns cycle time, operating at 66.7MHz clock frequency. It features a 3-STATE output and operates in synchronous mode. This CMOS technology device is ideal for applications requiring high-speed data storage and retrieval in commercial temperature environments.
CD74HCT40105MG4
CD74HCT40105MG4 by Texas Instruments is a FIFO IC with 16x4 organization, operating at 5V. It features a cycle time of 100ns, synchronous mode, and max clock frequency of 12MHz. Ideal for military-grade applications requiring fast data storage and retrieval in compact designs.
SN74ACT2236-20FN
SN74ACT2236-20FN by Texas Instruments is a 2Kx9 FIFO chip carrier with 20ns cycle time, operating at 5V. It features synchronous operation, 50MHz clock frequency, and 3-STATE output characteristics. Ideal for industrial applications requiring bi-directional FIFO memory with parallel interface.
SN74ACT72235-20FNR
SN74ACT72235-20FNR by Texas Instruments is a FIFO chip with 1KX9 organization, 1024 words, and 9216 bit memory density. It operates synchronously at a cycle time of 20 ns and has an output enable feature. This chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7202LA50JG8
Integrated Device Technology
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
CD40105BF3A
CD40105BF3A by Texas Instruments is a 16X4 FIFO with 666.66 ns cycle time, operating at 5V. It has 3-STATE output characteristics and supports a max clock frequency of 1.5 MHz. Ideal for military applications requiring fast data storage and retrieval in harsh environments.
IDT72V835L15PF8
IDT72V835L15PF8 by Integrated Device Technology is a 2Kx18 FIFO with 15ns cycle time, operating at 3.3V. It features synchronous operation, parallel interface, and output enable function. Ideal for applications requiring fast data storage and retrieval in commercial-grade environments.
7203L25J8
7203L25J8 by Integrated Device Technology is a FIFO chip with 2KX9 organization, operating at 5V. It features a cycle time of 35ns and max clock frequency of 28.5MHz. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
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CD54HC40105F3A
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
CD54HCT40105F3A
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Cycle Time: 100 ns;
CD54AC7201F/3A
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 512 words;
CD54AC7202F/3A
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 9216 bit;
CD54ACT7201F/3A
FIFOs;
CD54ACT7202F/3A
CD54HCT7030F
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
CD54HC40105F
Rca Solid State
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE;
CD54HC40105F/3A
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
CD54HC40105F/3W
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Operating Mode: ASYNCHRONOUS;
CD54HC40105F/4
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 10 MHz;
CD54HCT40105F
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;
CD54HCT40105F/3A
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified;
CD54HCT40105F/3W
CD54HC7030F
Intersil
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP28,.6;
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 64 words;
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP16,.3;
Harris Semiconductor
CD54HC7030E
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 28; Package Shape: RECTANGULAR; Surface Mount: NO; Package Style (Meter): IN-LINE;
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
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