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72V835L15PF8

Integrated Device Technology

72V835L15PF8 by Integrated Device Technology

72V835L15PF8 by Integrated Device Technology is a FIFO with 2KX18 organization, operating at 66.7 MHz clock frequency and 15 ns cycle time. It is suitable for applications requiring fast synchronous data transfer in commercial temperature grade environments.

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Overview

Unlock seamless data storage and retrieval with the 72V835L15PF8 by Integrated Device Technology. Experience top-quality manufacturing and reliability in this FIFO category product, perfect for a wide range of applications. With its innovative design and advanced technology, this product offers unbeatable value, efficiency, and performance to customers. Say goodbye to data access delays and hello to streamlined processes with the 72V835L15PF8.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FIFO, ensuring long-lasting performance.

Cycle Time: 15 ns

The fast cycle time of 15 ns allows for efficient data transfer and processing, making this FIFO suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage ensures compatibility with standard electronic systems, making integration easier.

Maximum Clock Frequency (fCLK): 66.7 MHz

The high clock frequency allows for quick data retrieval and storage, enhancing the overall performance of the FIFO.

Memory Density: 36864 bit

With a high memory density, this FIFO can store a large amount of data, making it suitable for applications requiring extensive data buffering.

Technical Specifications

FIFO 72V835L15PF8 attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

10 ns

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e0

Length:

20 mm

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

18

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

128

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

225

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.01 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

72V835L15PF8 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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