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SN74ACT7203-50FM

Texas Instruments

SN74ACT7203-50FM by Texas Instruments

SN74ACT7203-50FM by Texas Instruments is a FIFO chip with 2Kx9 organization, 18432-bit memory density, and 15 MHz clock frequency. It operates asynchronously at temperatures from 0 to 70°C and is ideal for commercial applications requiring fast data storage and retrieval.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,166 parts In-Stock

1+ parts

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4,166

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Vyrian

USA . 4,014 parts In-Stock

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4,014

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,080 parts In-Stock

1+ parts

$3.368

100+ parts

-

1k+ parts

$3.894

10k+ parts

-

2,080

$3.368

-

$3.894

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ChromeModa Solutions

Germany . 2,813 parts In-Stock

1+ parts

$3.784

100+ parts

$3.103

1k+ parts

-

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2,813

$3.784

$3.103

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IDEA Electronic Components Group

UK . 629 parts In-Stock

1+ parts

$3.784

100+ parts

-

1k+ parts

$3.406

10k+ parts

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629

$3.784

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$3.406

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AZTECH Wire

Italy . 511 parts In-Stock

1+ parts

$16.786

100+ parts

-

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511

$16.786

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One Stop Electronics

USA . 548 parts In-Stock

1+ parts

$21.000

100+ parts

-

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548

$21.000

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DigiPath Technology Company

USA . 1,978 parts In-Stock

1+ parts

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100+ parts

$3.412

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1,978

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$3.412

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Corphita

USA . 758 parts In-Stock

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758

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Overview

Unlock seamless data transfer with the SN74ACT7203-50FM by Texas Instruments. Manufactured with precision and reliability in mind, this FIFO device offers high-quality performance for a variety of applications. Whether you're looking to streamline data storage or improve system efficiency, this product delivers unmatched value and benefits. Trust in Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Experience the advantages of seamless data handling with the SN74ACT7203-50FM today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and labor costs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation provides flexibility in data transfer timing, making it suitable for various communication protocols.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V allows for easy integration with other components and power sources.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for interfacing with other devices in the system.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the product can withstand harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall reliability of the product.

Maximum Clock Frequency (fCLK): 15 MHz

Support for a maximum clock frequency of 15MHz enables fast data transfer rates, ideal for high-speed applications.

Memory Density: 18432 bit

A high memory density of 18432 bits allows for storing a large amount of data, suitable for buffering and data storage applications.

Maximum Access Time: 50 ns

The low maximum access time of 50ns ensures quick retrieval of data, improving overall system performance.

Technical Specifications

FIFO SN74ACT7203-50FM attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

50 ns

Maximum Clock Frequency (fCLK):

15 MHz

JESD-30 Code:

R-PQCC-J32

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

9

No. of Terminals:

32

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX9

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.01 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

95 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ACT7203-50FM Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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