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SN74ACT7201LA20RJ

Texas Instruments

SN74ACT7201LA20RJ by Texas Instruments

SN74ACT7201LA20RJ by Texas Instruments is a 512x9 FIFO chip with CMOS technology. It operates asynchronously at 5V, suitable for commercial temperature grades. With a memory density of 4608 bits, it offers parallel organization and J bend terminals, ideal for various data buffering applications.

Median Price

$4.513

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,888 parts In-Stock

1+ parts

-

100+ parts

$3.610

1k+ parts

$3.230

10k+ parts

$3.040

1,888

-

$3.610

$3.230

$3.040

DigiKey

USA . 1,888 parts In-Stock

1+ parts

-

100+ parts

$4.750

1k+ parts

-

10k+ parts

-

1,888

-

$4.750

-

-

Verical

USA . 1,888 parts In-Stock

1+ parts

-

100+ parts

$4.513

1k+ parts

$4.037

10k+ parts

$3.800

1,888

-

$4.513

$4.037

$3.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 75 parts In-Stock

1+ parts

$3.810

100+ parts

-

1k+ parts

-

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-

75

$3.810

-

-

-

Vyrian

USA . 1,172 parts In-Stock

1+ parts

$4.010

100+ parts

-

1k+ parts

-

10k+ parts

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1,172

$4.010

-

-

-

DigiKey Marketplace

USA . 1,888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,888

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 454 parts In-Stock

1+ parts

$3.609

100+ parts

-

1k+ parts

-

10k+ parts

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454

$3.609

-

-

-

Parana Technologies

USA . 198 parts In-Stock

1+ parts

$5.149

100+ parts

-

1k+ parts

$5.745

10k+ parts

-

198

$5.149

-

$5.745

-

DigiPath Technology Company

USA . 737 parts In-Stock

1+ parts

$5.669

100+ parts

$5.216

1k+ parts

-

10k+ parts

-

737

$5.669

$5.216

-

-

ChromeModa Solutions

Germany . 3,934 parts In-Stock

1+ parts

$5.785

100+ parts

$4.744

1k+ parts

-

10k+ parts

-

3,934

$5.785

$4.744

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IDEA Electronic Components Group

UK . 83 parts In-Stock

1+ parts

$5.785

100+ parts

-

1k+ parts

$5.206

10k+ parts

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83

$5.785

-

$5.206

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QUARKTWIN TECHNOLOGY LTD

USA . 23,620 parts In-Stock

1+ parts

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100+ parts

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23,620

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Overview

Unlock seamless data transfer with the SN74ACT7201LA20RJ FIFO chip by Texas Instruments, a leader in semiconductor technology. This high-quality, rectangular package offers asynchronous operation and a 512x9 organization, making it ideal for a wide range of applications. Experience the reliability and efficiency of this chip carrier with its commercial-grade temperature rating and CMOS technology. Trust Texas Instruments to deliver unmatched performance and value, providing you with the tools you need to succeed in today's fast-paced digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the FIFO, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes the installation of this FIFO easier and more convenient, especially in compact electronic devices.

Operating Mode: ASYNCHRONOUS

The asynchronous operation allows for independent and immediate read and write operations, enhancing the efficiency of data transfer.

Nominal Supply Voltage (Vsup): 5V

Operates at a standard voltage level, making it compatible with various electronic systems and power sources.

No. of Terminals: 32

Having 32 terminals allows for multiple connections and expansions, enabling greater flexibility in system integration.

Maximum Operating Temperature: 70°C

Capable of operating at relatively high temperatures, making it suitable for industrial and harsh environments.

Minimum Operating Temperature: 0°C

Supports operation at low temperatures, ensuring functionality in diverse temperature conditions.

Memory Density: 4608 bit

With a high memory density, this FIFO can store large amounts of data efficiently, suitable for applications requiring extensive data storage.

Technical Specifications

FIFO SN74ACT7201LA20RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-J32

Length:

13.995 mm

Memory Density:

4608 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT7201LA20RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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