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SN74ABT7815-25PQ

Texas Instruments

SN74ABT7815-25PQ by Texas Instruments

SN74ABT7815-25PQ by Texas Instruments is a 128x36 bi-directional FIFO memory IC with 40 MHz clock frequency, operating at 5V. It features synchronous operation, GULL WING terminals, and a max access time of 14ns. Ideal for applications requiring fast data transfer in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,187 parts In-Stock

1+ parts

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8,187

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Digiode

USA . 2,091 parts In-Stock

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2,091

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 434 parts In-Stock

1+ parts

$3.559

100+ parts

$330.517

1k+ parts

$3.203

10k+ parts

-

434

$3.559

$330.517

$3.203

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DigiPath Technology Company

USA . 1,162 parts In-Stock

1+ parts

$3.919

100+ parts

-

1k+ parts

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1,162

$3.919

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ChromeModa Solutions

Germany . 3,582 parts In-Stock

1+ parts

$3.999

100+ parts

$3.279

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-

10k+ parts

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3,582

$3.999

$3.279

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IDEA Electronic Components Group

UK . 711 parts In-Stock

1+ parts

$3.999

100+ parts

-

1k+ parts

$3.599

10k+ parts

-

711

$3.999

-

$3.599

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AZTECH Wire

Italy . 781 parts In-Stock

1+ parts

$10.590

100+ parts

-

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781

$10.590

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One Stop Electronics

USA . 520 parts In-Stock

1+ parts

$22.000

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520

$22.000

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Corphita

USA . 2,252 parts In-Stock

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2,252

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Overview

Enhance your electronics projects with the SN74ABT7815-25PQ FIFO by Texas Instruments. Known for its top-notch quality and reliability, Texas Instruments is a trusted manufacturer in the industry. This FIFO device offers seamless data storage and retrieval, making it ideal for applications requiring efficient data buffering and temporary storage. With a nominal supply voltage of 5V and a maximum clock frequency of 40 MHz, this product provides excellent performance in a compact FLATPACK package. Trust Texas Instruments to deliver cutting-edge solutions for your electronics needs. Elevate your designs with the SN74ABT7815-25PQ FIFO today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection for the components inside.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and facilitating assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination within the system.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies, making integration into existing systems simple.

No. of Terminals: 132

Ample terminals for connection and communication with other components in the system.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, suitable for various operating environments.

Organization: 128X36

Efficient organization of memory storage, allowing for quick and reliable data retrieval.

Maximum Clock Frequency (fCLK): 40 MHz

Supports high-speed data processing, contributing to overall system performance.

Terminal Form: GULL WING

Gull wing terminals provide secure connections, reducing the risk of disconnection or signal loss.

No. of Words: 128 words

Ample storage capacity for data and instructions, accommodating complex applications.

Memory Width: 36

Wider memory width allows for processing and storage of larger chunks of data at once.

Maximum Access Time: 14 ns

Low access time ensures quick retrieval and processing of data, improving overall system response time.

Technical Specifications

FIFO SN74ABT7815-25PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

14 ns

Maximum Clock Frequency (fCLK):

40 MHz

JESD-30 Code:

S-PQFP-G132

Memory IC Type:

Memory Width:

36

No. of Terminals:

132

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128X36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

FIFOs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ABT7815-25PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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