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SN74ACT3631-15PCBR

Texas Instruments

SN74ACT3631-15PCBR by Texas Instruments

SN74ACT3631-15PCBR by Texas Instruments is a FIFO with 512x36 organization, 15 ns cycle time, and operates at 5V. It is used in applications requiring fast data transfer and storage, such as networking equipment and communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,567 parts In-Stock

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Digiode

USA . 4,446 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,178 parts In-Stock

1+ parts

$2.407

100+ parts

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$2.905

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2,178

$2.407

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$2.905

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DigiPath Technology Company

USA . 546 parts In-Stock

1+ parts

$2.651

100+ parts

$2.439

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546

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$2.439

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ChromeModa Solutions

Germany . 2,584 parts In-Stock

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$2.705

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$2.218

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$2.705

$2.218

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IDEA Electronic Components Group

UK . 329 parts In-Stock

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$2.705

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$2.434

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329

$2.705

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$2.434

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AZTECH Wire

Italy . 742 parts In-Stock

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$8.779

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742

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One Stop Electronics

USA . 234 parts In-Stock

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$12.000

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Corphita

USA . 3,165 parts In-Stock

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Overview

Enhance your electronic projects with the SN74ACT3631-15PCBR by Texas Instruments, a top-quality FIFO solution that offers unmatched reliability and performance. With its synchronous operation and 512x36 organization, this device ensures seamless data transfer at a fast cycle time of 15 ns. Ideal for a wide range of applications, from telecommunications to industrial automation, this FIFO promises superior functionality and ease of use. Trust Texas Instruments for cutting-edge technology and unlock endless possibilities with the SN74ACT3631-15PCBR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components.

Surface Mount: YES

Allows for easy installation on PCBs.

Cycle Time: 15 ns

Ensures fast data transfer speeds.

Package Shape: SQUARE

Compact design saves space in electronic devices.

Operating Mode: SYNCHRONOUS

Ensures data is transmitted accurately and efficiently.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage compatibility for most electronic systems.

No. of Terminals: 120

Allows for multiple connections for data input and output.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Offers flexibility in mounting options for different applications.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures in various environments.

Organization: 512X36

Provides a large storage capacity for data.

Output Characteristics: 3-STATE

Allows for tri-state outputs for more versatile data processing.

Minimum Operating Temperature: 0 °C

Suitable for use in cold environments without risk of malfunction.

Terminal Position: QUAD

Facilitates easy connection to other components.

Maximum Seated Height: 1.6 mm

Low profile design for slim electronic devices.

Width: 14 mm

Compact size for space-saving installation.

Minimum Supply Voltage (Vsup): 4.5 V

Allows for operation at lower voltages for energy efficiency.

Length: 14 mm

Compact size for space-saving installation.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications.

Technology: CMOS

Offers low power consumption and high speed performance.

Parallel or Serial: PARALLEL

Enables simultaneous data transfer for efficient processing.

Terminal Form: GULL WING

Facilitates easy soldering onto PCBs.

No. of Words: 512 words

Large storage capacity for data processing.

Memory Width: 36

Enables processing of data in 36-bit chunks.

Terminal Pitch: 0.4 mm

Fine pitch for high density data connections.

No. of Words Code: 512

Indicates the number of words that can be stored in memory.

Maximum Supply Voltage (Vsup): 5.5 V

Allows for operation at higher voltages without risk of damage.

Memory Density: 18432 bit

High memory density for storing large amounts of data.

Output Enable: YES

Allows for control over data output to other components.

Maximum Access Time: 11 ns

Ensures fast access to stored data for efficient processing.

Technical Specifications

FIFO SN74ACT3631-15PCBR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

11 ns

Additional Features:

MAILBOX

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

18432 bit

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SN74ACT3631-15PCBR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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