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SN74ACT3641-20PCB

Texas Instruments

SN74ACT3641-20PCB by Texas Instruments

SN74ACT3641-20PCB by Texas Instruments is a FIFO memory IC with 1Kx36 organization, operating at 20ns cycle time and 50MHz clock frequency. It features a parallel interface, synchronous operation, and output enable function. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$22.380

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,249 parts In-Stock

1+ parts

-

100+ parts

$19.360

1k+ parts

$17.320

10k+ parts

$16.300

1,249

-

$19.360

$17.320

$16.300

DigiKey

USA . 1,249 parts In-Stock

1+ parts

-

100+ parts

$22.380

1k+ parts

-

10k+ parts

-

1,249

-

$22.380

-

-

Verical

USA . 720 parts In-Stock

1+ parts

-

100+ parts

$24.200

1k+ parts

$21.650

10k+ parts

$20.375

720

-

$24.200

$21.650

$20.375

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,333 parts In-Stock

1+ parts

$20.444

100+ parts

-

1k+ parts

-

10k+ parts

-

3,333

$20.444

-

-

-

Vyrian

USA . 1,888 parts In-Stock

1+ parts

$21.520

100+ parts

-

1k+ parts

-

10k+ parts

-

1,888

$21.520

-

-

-

DigiKey Marketplace

USA . 1,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,969

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,186 parts In-Stock

1+ parts

$3.185

100+ parts

-

1k+ parts

$3.707

10k+ parts

-

1,186

$3.185

-

$3.707

-

DigiPath Technology Company

USA . 2,045 parts In-Stock

1+ parts

$3.507

100+ parts

-

1k+ parts

-

10k+ parts

-

2,045

$3.507

-

-

-

ChromeModa Solutions

Germany . 3,342 parts In-Stock

1+ parts

$3.579

100+ parts

$2.935

1k+ parts

-

10k+ parts

-

3,342

$3.579

$2.935

-

-

IDEA Electronic Components Group

UK . 651 parts In-Stock

1+ parts

$3.579

100+ parts

-

1k+ parts

$3.221

10k+ parts

-

651

$3.579

-

$3.221

-

Ampacity Inc.

Singapore . 922 parts In-Stock

1+ parts

$18.290

100+ parts

-

1k+ parts

-

10k+ parts

-

922

$18.290

-

-

-

Corphita

USA . 1,768 parts In-Stock

1+ parts

$19.368

100+ parts

-

1k+ parts

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10k+ parts

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1,768

$19.368

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 13,396 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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13,396

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-

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Microchip USA

USA . 411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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411

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-

-

-

Overview

Enhance the efficiency and performance of your electronic devices with the Texas Instruments SN74ACT3641-20PCB FIFO memory IC. Manufactured by a trusted industry leader, this high-quality product offers seamless synchronization, fast cycle times, and versatile applications in various systems. With a robust design and reliable operation, this FIFO memory IC provides exceptional value and benefits to customers looking for optimal data storage solutions. Upgrade your devices today with the cutting-edge technology and unmatched advantages of the SN74ACT3641-20PCB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longevity of the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Cycle Time: 20 ns

Offers fast data transmission speeds, making this FIFO ideal for high-performance applications.

Operating Mode: SYNCHRONOUS

Enables synchronous operation with other components in the system, ensuring smooth and consistent data flow.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage, ensuring compatibility with most circuits and power sources.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for a variety of environments and applications.

Memory IC Type: BI-DIRECTIONAL FIFO

Bi-directional functionality allows for efficient data read and write operations, enhancing overall performance.

Maximum Clock Frequency (fCLK): 50 MHz

Supports high clock frequencies, enabling quick data processing and transfer speeds.

Technical Specifications

FIFO SN74ACT3641-20PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

13 ns

Additional Features:

RETRANSMIT; MAILBOX

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G120

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

120

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74ACT3641-20PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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