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SN74ACT2235-40FN

Texas Instruments

SN74ACT2235-40FN by Texas Instruments

SN74ACT2235-40FN by Texas Instruments is a FIFO chip with 1Kx9 organization, operating at 25MHz clock frequency and 40ns cycle time. It features a memory density of 9216 bit and supports parallel operation. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.

Median Price

$10.450

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,649 parts In-Stock

1+ parts

-

100+ parts

$10.450

1k+ parts

-

10k+ parts

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1,649

-

$10.450

-

-

Rochester

USA . 661 parts In-Stock

1+ parts

-

100+ parts

$9.050

1k+ parts

$8.100

10k+ parts

$7.620

661

-

$9.050

$8.100

$7.620

Verical

USA . 494 parts In-Stock

1+ parts

-

100+ parts

$11.313

1k+ parts

$10.125

10k+ parts

$9.525

494

-

$11.313

$10.125

$9.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 208 parts In-Stock

1+ parts

$9.000

100+ parts

$5.400

1k+ parts

$5.175

10k+ parts

-

208

$9.000

$5.400

$5.175

-

Digiode

USA . 3,425 parts In-Stock

1+ parts

$9.548

100+ parts

-

1k+ parts

-

10k+ parts

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3,425

$9.548

-

-

-

Vyrian

USA . 3,871 parts In-Stock

1+ parts

$10.050

100+ parts

-

1k+ parts

-

10k+ parts

-

3,871

$10.050

-

-

-

DigiKey Marketplace

USA . 1,649 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,649

-

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 371 parts In-Stock

1+ parts

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100+ parts

-

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371

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Microfarads

USA . 201 parts In-Stock

1+ parts

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201

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,788 parts In-Stock

1+ parts

$3.520

100+ parts

-

1k+ parts

$4.043

10k+ parts

-

1,788

$3.520

-

$4.043

-

DigiPath Technology Company

USA . 1,209 parts In-Stock

1+ parts

$3.876

100+ parts

-

1k+ parts

-

10k+ parts

-

1,209

$3.876

-

-

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ChromeModa Solutions

Germany . 2,841 parts In-Stock

1+ parts

$3.955

100+ parts

$3.243

1k+ parts

-

10k+ parts

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2,841

$3.955

$3.243

-

-

IDEA Electronic Components Group

UK . 737 parts In-Stock

1+ parts

$3.955

100+ parts

-

1k+ parts

$3.560

10k+ parts

-

737

$3.955

-

$3.560

-

Corphita

USA . 1,458 parts In-Stock

1+ parts

$9.045

100+ parts

-

1k+ parts

-

10k+ parts

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1,458

$9.045

-

-

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Component Stockers USA

USA . 2,016 parts In-Stock

1+ parts

$10.400

100+ parts

$9.770

1k+ parts

$8.840

10k+ parts

-

2,016

$10.400

$9.770

$8.840

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Microchip USA

USA . 481 parts In-Stock

1+ parts

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100+ parts

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481

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Perfect Parts

USA . 3 parts In-Stock

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3

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Overview

Discover the Texas Instruments SN74ACT2235-40FN, a high-quality FIFO memory IC that offers unparalleled reliability and performance. With Texas Instruments' reputation for excellence in semiconductor manufacturing, this chip is perfect for a wide range of applications requiring fast and efficient data storage and retrieval. Benefit from its 1Kx9 organization, 40 ns cycle time, and 3-STATE output characteristics. Whether you're designing consumer electronics, industrial equipment, or telecommunications systems, this chip is sure to deliver the value and advantages you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the components inside the package, making it a reliable and long-lasting choice.

Cycle Time: 40 ns

With a fast cycle time of 40 ns, this FIFO product can efficiently handle data storage and retrieval operations, making it suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with a wide range of systems, making it versatile and easy to integrate.

Maximum Clock Frequency (fCLK): 25 MHz

With a maximum clock frequency of 25 MHz, this FIFO can process data at high speeds, making it ideal for applications that require quick data transfers.

Memory IC Type: BI-DIRECTIONAL FIFO

The bi-directional FIFO design allows for simultaneous read and write operations, enhancing the efficiency and flexibility of the memory storage.

Technical Specifications

FIFO SN74ACT2235-40FN attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

35 ns

Additional Features:

BYPASS-XCVR

Maximum Clock Frequency (fCLK):

25 MHz

Cycle Time:

40 ns

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e4

Length:

16.585 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

9

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Trade Compliance

SN74ACT2235-40FN Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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