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SN74ABT7815-25PCB

Texas Instruments

SN74ABT7815-25PCB by Texas Instruments

SN74ABT7815-25PCB by Texas Instruments is a 128x36 bi-directional FIFO memory IC with 40MHz clock frequency, operating at 5V. It features synchronous operation, GULL WING terminals, and a flatpack package style. Ideal for applications requiring fast data access and storage in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,277 parts In-Stock

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6,277

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Digiode

USA . 4,612 parts In-Stock

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4,612

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 154 parts In-Stock

1+ parts

$4.199

100+ parts

-

1k+ parts

$4.638

10k+ parts

-

154

$4.199

-

$4.638

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DigiPath Technology Company

USA . 753 parts In-Stock

1+ parts

$4.624

100+ parts

$4.254

1k+ parts

-

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753

$4.624

$4.254

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ChromeModa Solutions

Germany . 3,339 parts In-Stock

1+ parts

$4.718

100+ parts

$3.869

1k+ parts

-

10k+ parts

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3,339

$4.718

$3.869

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IDEA Electronic Components Group

UK . 408 parts In-Stock

1+ parts

$4.718

100+ parts

-

1k+ parts

$4.246

10k+ parts

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408

$4.718

-

$4.246

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AZTECH Wire

Italy . 421 parts In-Stock

1+ parts

$11.743

100+ parts

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421

$11.743

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One Stop Electronics

USA . 981 parts In-Stock

1+ parts

$24.000

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981

$24.000

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Corphita

USA . 1,622 parts In-Stock

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1,622

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Overview

Experience unparalleled performance and reliability with the SN74ABT7815-25PCB FIFO by Texas Instruments. Designed with precision and expertise, this bi-directional FIFO memory IC is perfect for a wide range of applications, providing seamless data transfer and efficient storage. With a maximum clock frequency of 40 MHz and a temperature grade suitable for commercial use, this device offers unmatched value and benefits to customers looking for high-quality solutions. Trust Texas Instruments for cutting-edge technology and superior products that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package, making it ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and flexible PCB assembly, saving space and facilitating automated production processes.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and data transfer, which is critical for real-time applications and data integrity.

Maximum Clock Frequency (fCLK): 40 MHz

The high maximum clock frequency of 40 MHz enables fast data processing and efficient operation in time-sensitive applications.

No. of Words: 128 words

With a capacity of 128 words, this FIFO can store and manage a large volume of data, making it suitable for applications with high data throughput.

Memory Width: 36

The wide memory width of 36 bits allows for processing larger chunks of data at once, increasing efficiency in data transfer and manipulation.

Maximum Access Time: 14 ns

The fast maximum access time of 14 ns ensures quick retrieval of data, minimizing latency and improving overall system performance.

Technical Specifications

FIFO SN74ABT7815-25PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

14 ns

Maximum Clock Frequency (fCLK):

40 MHz

JESD-30 Code:

S-PQFP-G120

Memory IC Type:

Memory Width:

36

No. of Terminals:

120

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128X36

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

FIFOs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ABT7815-25PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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