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SN74ACT3622-15PCB

Texas Instruments

SN74ACT3622-15PCB by Texas Instruments

SN74ACT3622-15PCB by Texas Instruments is a FIFO memory IC with 256x36 organization, operating at 66.7MHz cycle time of 15ns. It features a parallel interface, synchronous operation, and output enable function. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$17.160

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,941 parts In-Stock

1+ parts

-

100+ parts

$14.850

1k+ parts

$13.290

10k+ parts

$12.500

5,941

-

$14.850

$13.290

$12.500

DigiKey

USA . 5,941 parts In-Stock

1+ parts

-

100+ parts

$17.160

1k+ parts

-

10k+ parts

-

5,941

-

$17.160

-

-

Verical

USA . 4,187 parts In-Stock

1+ parts

-

100+ parts

$18.563

1k+ parts

$16.613

10k+ parts

$15.625

4,187

-

$18.563

$16.613

$15.625

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 32 parts In-Stock

1+ parts

$13.500

100+ parts

$8.438

1k+ parts

-

10k+ parts

-

32

$13.500

$8.438

-

-

Digiode

USA . 287 parts In-Stock

1+ parts

$15.675

100+ parts

-

1k+ parts

-

10k+ parts

-

287

$15.675

-

-

-

Vyrian

USA . 2,343 parts In-Stock

1+ parts

$16.500

100+ parts

-

1k+ parts

-

10k+ parts

-

2,343

$16.500

-

-

-

DigiKey Marketplace

USA . 5,941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

5,941

-

-

-

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Electronics Depot

USA . 286 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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286

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-

-

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Prism Electronics

USA . 248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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248

-

-

-

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ACDS - Activité Composants Distribution Service

France . 32 parts In-Stock

1+ parts

-

100+ parts

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32

-

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Dan-Mar Components

USA . 32 parts In-Stock

1+ parts

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100+ parts

-

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32

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LWI Electronics Inc

India . 3 parts In-Stock

1+ parts

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100+ parts

-

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3

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,185 parts In-Stock

1+ parts

$3.326

100+ parts

-

1k+ parts

$3.850

10k+ parts

-

1,185

$3.326

-

$3.850

-

DigiPath Technology Company

USA . 2,176 parts In-Stock

1+ parts

$3.662

100+ parts

-

1k+ parts

-

10k+ parts

-

2,176

$3.662

-

-

-

IDEA Electronic Components Group

UK . 1,233 parts In-Stock

1+ parts

$3.737

100+ parts

-

1k+ parts

$3.363

10k+ parts

-

1,233

$3.737

-

$3.363

-

ChromeModa Solutions

Germany . 113 parts In-Stock

1+ parts

$3.737

100+ parts

$3.064

1k+ parts

-

10k+ parts

-

113

$3.737

$3.064

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$3.987

100+ parts

$3.628

1k+ parts

$3.269

10k+ parts

-

200

$3.987

$3.628

$3.269

-

Corphita

USA . 3,410 parts In-Stock

1+ parts

$14.850

100+ parts

-

1k+ parts

-

10k+ parts

-

3,410

$14.850

-

-

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Perfect Parts

USA . 278 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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278

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Microchip USA

USA . 193 parts In-Stock

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100+ parts

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193

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Overview

Looking for a reliable FIFO memory IC for your project? Look no further than the SN74ACT3622-15PCB by Texas Instruments. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers top-notch quality and performance. This FIFO memory device is perfect for applications requiring fast data transfer with its 15 ns cycle time and 256x36 organization. The 3-state output characteristics and bi-directional functionality make it versatile for various parallel data processing tasks. Trust Texas Instruments to provide you with the solution you need for seamless data management in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, ensuring reliability in various operating conditions.

Cycle Time: 15 ns

The fast cycle time of 15 nanoseconds allows for quick data processing and efficient operation of the FIFO product.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures that data is processed at a consistent rate, enhancing the overall performance of the product.

Nominal Supply Voltage / Vsup (V): 5

The nominal 5V supply voltage allows for compatibility with standard power sources, making it easy to integrate into existing systems.

Organization: 256X36

With a large storage capacity of 256 words and a width of 36 bits, this FIFO product can handle a significant amount of data efficiently.

Maximum Clock Frequency (fCLK): 66.7 MHz

The high clock frequency of 66.7 MHz enables rapid data transfer and processing, making this FIFO suitable for high-performance applications.

Technology: CMOS

The CMOS technology used in this FIFO ensures low power consumption and reliable operation, making it a cost-effective and efficient choice.

No. of Words: 256 words

The ample storage capacity of 256 words allows for flexibility in storing and retrieving data, making this FIFO versatile for various applications.

Technical Specifications

FIFO SN74ACT3622-15PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

11 ns

Additional Features:

MAILBOX

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G120

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

120

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74ACT3622-15PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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