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SN74ACT7200L20DV

Texas Instruments

SN74ACT7200L20DV by Texas Instruments

SN74ACT7200L20DV by Texas Instruments is a FIFO chip with 256x9 organization, operating in asynchronous mode at 5V. It features a memory density of 2304 bits and operates in parallel mode. This CMOS technology device is ideal for applications requiring high-speed data storage and retrieval.

Median Price

$4.350

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,534 parts In-Stock

1+ parts

-

100+ parts

$3.480

1k+ parts

$3.110

10k+ parts

$2.930

1,534

-

$3.480

$3.110

$2.930

DigiKey

USA . 1,534 parts In-Stock

1+ parts

-

100+ parts

$4.580

1k+ parts

-

10k+ parts

-

1,534

-

$4.580

-

-

Verical

USA . 1,534 parts In-Stock

1+ parts

-

100+ parts

$4.350

1k+ parts

$3.888

10k+ parts

$3.663

1,534

-

$4.350

$3.888

$3.663

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,333 parts In-Stock

1+ parts

$3.676

100+ parts

-

1k+ parts

-

10k+ parts

-

3,333

$3.676

-

-

-

Vyrian

USA . 3,647 parts In-Stock

1+ parts

$3.870

100+ parts

-

1k+ parts

-

10k+ parts

-

3,647

$3.870

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,410 parts In-Stock

1+ parts

$3.483

100+ parts

-

1k+ parts

-

10k+ parts

-

2,410

$3.483

-

-

-

Parana Technologies

USA . 251 parts In-Stock

1+ parts

$4.332

100+ parts

-

1k+ parts

$4.752

10k+ parts

-

251

$4.332

-

$4.752

-

DigiPath Technology Company

USA . 1,762 parts In-Stock

1+ parts

$4.770

100+ parts

$4.388

1k+ parts

-

10k+ parts

-

1,762

$4.770

$4.388

-

-

ChromeModa Solutions

Germany . 4,930 parts In-Stock

1+ parts

$4.867

100+ parts

$3.991

1k+ parts

-

10k+ parts

-

4,930

$4.867

$3.991

-

-

IDEA Electronic Components Group

UK . 445 parts In-Stock

1+ parts

$4.867

100+ parts

-

1k+ parts

$4.380

10k+ parts

-

445

$4.867

-

$4.380

-

Overview

Enhance your electronic designs with the SN74ACT7200L20DV by Texas Instruments. This FIFO device boasts top-notch quality and reliability, courtesy of its reputable manufacturer. Perfect for a wide range of applications, this product offers seamless operation in an asynchronous mode. With a variety of features like small outline packaging and gull wing terminals, this versatile component ensures smooth performance at temperatures ranging from 0 to 70°C. Elevate your projects with the unmatched value and benefits that this cutting-edge technology brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent and flexible data transfer, providing versatility in different system configurations.

Nominal Supply Voltage / Vsup (V): 5

A stable supply voltage of 5V ensures reliable performance and consistent operation of the FIFO product.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and compatibility with a wide range of systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the FIFO can withstand high temperature environments without compromising performance.

Organization: 256X9

The 256x9 organization provides ample storage and data capacity, suitable for demanding applications that require large amounts of data buffering.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the FIFO remains operational even in low temperature conditions.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V ensures that the FIFO can still function within a safe voltage range, preventing damage from undervoltage.

Temperature Grade: COMMERCIAL

Designed for commercial applications, the FIFO is suitable for use in a wide range of industries and environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to the efficiency and reliability of the FIFO product.

Terminal Form: GULL WING

The gull wing terminal form provides easy soldering and connectivity, ensuring a secure and stable connection on the circuit board.

No. of Words: 256 words

Having 256 words of memory capacity allows for storing a large amount of data, making the FIFO suitable for applications that require extensive data handling.

Memory Width: 9

A memory width of 9 bits allows for efficient data transfer and processing, enhancing the performance of the FIFO product.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V ensures that the FIFO can handle voltage spikes or fluctuations without getting damaged.

Memory Density: 2304 bit

With a memory density of 2304 bits, the FIFO can store a large amount of data in a compact form factor, making it a versatile solution for various applications.

Technical Specifications

FIFO SN74ACT7200L20DV attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G28

Memory Density:

2304 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256X9

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Position:

DUAL

Trade Compliance

SN74ACT7200L20DV Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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