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IDT72V7280L10BBG

Integrated Device Technology

IDT72V7280L10BBG by Integrated Device Technology

IDT72V7280L10BBG is a 16Kx72 FIFO with 10ns cycle time, operating in synchronous mode at 3.3V. It has a memory density of 1179648 bit and offers parallel access with an output enable feature. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.

Median Price

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1k+

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Vyrian

USA . 1,469 parts In-Stock

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Nova Conductors

Japan . 60 parts In-Stock

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AZTECH Wire

Italy . 846 parts In-Stock

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$16.060

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Ampacity Inc.

Singapore . 482 parts In-Stock

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Argo Parts USA

USA . 1,355 parts In-Stock

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Continental Prestige Electronics

USA . 1,313 parts In-Stock

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Microchip USA

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Bastille Electronics

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Overview

Discover the IDT72V7280L10BBG by Integrated Device Technology, a top-tier FIFO device that delivers unparalleled performance and reliability. With a focus on quality and innovation, Integrated Device Technology ensures that their products meet the highest industry standards. Ideal for a wide range of applications, this FIFO device offers exceptional value to customers seeking seamless data transfer and efficient data storage solutions. Experience the advantages of the IDT72V7280L10BBG and unlock new possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

This product can easily be mounted on a surface, saving space and making it suitable for compact designs.

Cycle Time: 10 ns

With a fast cycle time of 10 ns, this product offers high-speed performance for efficient data processing.

Package Shape: SQUARE

The square shape of the package provides a uniform layout, optimizing space utilization in circuit designs.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures consistent and synchronized data transfer, enhancing system reliability.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V offers compatibility with standard power sources, making integration easier.

No. of Terminals: 256

With 256 terminals, this product allows for multiple connections, enabling versatile data input/output options.

Package Style (Meter): GRID ARRAY

The grid array package style provides a secure and stable connection, reducing the risk of signal interference.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance in various environmental conditions.

Organization: 16KX72

The 16Kx72 organization offers a high memory capacity, suitable for applications requiring extensive data storage.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows for operation in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB mounting, simplifying the installation process.

Maximum Seated Height: 3.5 mm

The maximum seated height of 3.5 mm allows for a low-profile design, suitable for space-constrained applications.

Width: 17 mm

With a width of 17 mm, this product is compact and can be easily integrated into small electronic devices.

Minimum Supply Voltage (Vsup): 3.15 V

The minimum supply voltage of 3.15V ensures stable operation even under low power conditions.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature of 40 seconds allows for efficient soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable solder joints, enhancing product durability.

Length: 17 mm

The length of 17 mm contributes to the compact form factor of the product, suitable for space-efficient designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that this product meets industry standards for reliable operation in commercial applications.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high-speed performance, making it energy-efficient.

Parallel or Serial: PARALLEL

The parallel data transfer mode allows for simultaneous processing of multiple signals, improving data throughput.

Terminal Form: BALL

The ball terminal form provides a secure connection and efficient signal transmission, enhancing overall system performance.

No. of Words: 16384 words

With 16384 words, this product offers a large memory capacity for storing extensive data sets.

Memory Width: 72

The memory width of 72 bits enables the product to handle large data streams efficiently, enhancing processing speed.

Terminal Pitch: 1 mm

The terminal pitch of 1 mm provides precise alignment and connectivity, reducing the risk of signal loss.

No. of Words Code: 16K

The 16K words code allows for efficient data organization and retrieval, enhancing overall system efficiency.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures that this product is suitable for use in a variety of environments with varying humidity levels.

Maximum Supply Voltage (Vsup): 3.45 V

The maximum supply voltage of 3.45V offers a safety margin for overvoltage protection, ensuring long-term reliability.

Memory Density: 1179648 bit

The high memory density of 1179648 bits provides ample storage capacity for demanding applications.

Output Enable: YES

The output enable feature allows for efficient control of data output, improving system flexibility and performance.

Maximum Access Time: 6.5 ns

With a maximum access time of 6.5 ns, this product offers fast data retrieval for quick response times.

Technical Specifications

FIFO IDT72V7280L10BBG attributes and parameters. Explore more FIFO devices from Integrated Device Technology

Specs

Maximum Access Time:

6.5 ns

Additional Features:

RETRANSMIT

Cycle Time:

10 ns

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Memory Density:

1179648 bit

Memory Width:

72

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

256

No. of Words:

16384 words

No. of Words Code:

16K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16KX72

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Trade Compliance

IDT72V7280L10BBG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Integrated Device Technology

Renesas Electronics Corporation (TSE: 6723, “Renesas”), a premier supplier of advanced semiconductor solutions, and Integrated Device Technology, Inc. (“IDT”), a leading supplier of analog mixed-signal products, including sensors, connectivity and wireless power, today jointly announced the successful completion of Renesas’ acquisition of IDT, as of March 30, 2019 JST, March 29, 2019 PDT, following approvals by IDT shareholders and the relevant regulatory authorities.

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