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5962-9562701NXX

Texas Instruments

5962-9562701NXX by Texas Instruments

The Texas Instruments 5962-9562701NXX FIFO operates synchronously with a cycle time of 20 ns and memory width of 18. It is a MILITARY-grade device suitable for applications requiring fast access times, such as aerospace and defense systems. The package style is FLATPACK with low profile, fine pitch design, making it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,370 parts In-Stock

1+ parts

-

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5,370

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Digiode

USA . 4,877 parts In-Stock

1+ parts

-

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-

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4,877

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 528 parts In-Stock

1+ parts

$0.428

100+ parts

-

1k+ parts

-

10k+ parts

$0.411

528

$0.428

-

-

$0.411

Northwest PG Solutions

USA . 2,282 parts In-Stock

1+ parts

$0.471

100+ parts

-

1k+ parts

-

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$0.415

2,282

$0.471

-

-

$0.415

Parana Technologies

USA . 1,345 parts In-Stock

1+ parts

$4.580

100+ parts

-

1k+ parts

$5.036

10k+ parts

-

1,345

$4.580

-

$5.036

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DigiPath Technology Company

USA . 1,217 parts In-Stock

1+ parts

$5.043

100+ parts

$4.640

1k+ parts

-

10k+ parts

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1,217

$5.043

$4.640

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IDEA Electronic Components Group

UK . 1,448 parts In-Stock

1+ parts

$5.146

100+ parts

-

1k+ parts

$4.631

10k+ parts

-

1,448

$5.146

-

$4.631

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ChromeModa Solutions

Germany . 788 parts In-Stock

1+ parts

$5.146

100+ parts

$4.220

1k+ parts

-

10k+ parts

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788

$5.146

$4.220

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AZTECH Wire

Italy . 667 parts In-Stock

1+ parts

$5.891

100+ parts

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667

$5.891

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One Stop Electronics

USA . 567 parts In-Stock

1+ parts

$16.000

100+ parts

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567

$16.000

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Corphita

USA . 1,598 parts In-Stock

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1,598

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Overview

Elevate your electronic designs with the 5962-9562701NXX by Texas Instruments. As a leader in manufacturing high-quality FIFO devices, Texas Instruments delivers reliable performance and durability for a wide range of applications. This versatile product offers a seamless synchronous operation, low power consumption, and fast cycle time of just 20 ns. With its compact design and military-grade temperature tolerance, this FIFO is perfect for demanding environments where reliability is key. Experience the innovation and precision that Texas Instruments brings to the table with the 5962-9562701NXX.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring long-term reliability.

Cycle Time: 20 ns

Fast cycle time allows for quick data transfer and processing, suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination between components, leading to efficient data handling.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level commonly used in electronic devices, making it compatible with a wide range of systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ideal for energy-efficient and reliable performance.

Memory Width: 18

With a wide memory width, the FIFO can handle larger data chunks at once, improving processing efficiency.

Output Enable: YES

The output enable feature allows for controlled data output, enabling flexibility in data retrieval and processing.

Maximum Access Time: 13 ns

Quick access time ensures minimal delay in retrieving data, enhancing overall system responsiveness.

Technical Specifications

FIFO 5962-9562701NXX attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

13 ns

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Memory Density:

18432 bit

Memory Width:

18

No. of Functions:

1

No. of Terminals:

80

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

1KX18

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class N

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Trade Compliance

5962-9562701NXX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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