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SN74ACT3638-20PQ

Texas Instruments

SN74ACT3638-20PQ by Texas Instruments

SN74ACT3638-20PQ by Texas Instruments is a 512x32 FIFO with 20ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and GULL WING terminal form. Ideal for applications requiring high-speed data buffering in commercial temperature environments up to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 395 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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395

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,053 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,053

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Digiode

USA . 2,149 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,149

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,474 parts In-Stock

1+ parts

$5.254

100+ parts

-

1k+ parts

$5.873

10k+ parts

-

1,474

$5.254

-

$5.873

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ChromeModa Solutions

Germany . 6,681 parts In-Stock

1+ parts

$5.903

100+ parts

$4.840

1k+ parts

-

10k+ parts

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6,681

$5.903

$4.840

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IDEA Electronic Components Group

UK . 1,432 parts In-Stock

1+ parts

$5.903

100+ parts

-

1k+ parts

$5.313

10k+ parts

-

1,432

$5.903

-

$5.313

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Ampacity Inc.

Singapore . 205 parts In-Stock

1+ parts

$19.000

100+ parts

-

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10k+ parts

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205

$19.000

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Corphita

USA . 3,908 parts In-Stock

1+ parts

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100+ parts

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3,908

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DigiPath Technology Company

USA . 2,354 parts In-Stock

1+ parts

-

100+ parts

$5.322

1k+ parts

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10k+ parts

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2,354

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$5.322

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Overview

Experience seamless data transfer and reliable performance with the SN74ACT3638-20PQ FIFO by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and innovative technology in all their products. This FIFO device is ideal for a wide range of applications, offering fast cycle times and synchronous operation. With a high-speed clock frequency of up to 50 MHz, this FIFO provides efficient data storage and retrieval. Trust Texas Instruments for superior products that deliver value, efficiency, and unmatched performance in every application. Upgrade your system with the SN74ACT3638-20PQ and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the body material makes the product lightweight and durable, making it easy to handle and less prone to damage.

Surface Mount: YES

Being surface mountable allows for easy installation on PCBs, saving space and simplifying the manufacturing process.

Cycle Time: 20 ns

The fast cycle time of 20 ns ensures efficient data processing and transmission, making the product suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures that data is transferred in sync with the clock signal, reducing the chance of errors and improving overall system performance.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V provides stable power to the product, ensuring reliable operation.

Power Supplies (V): 5

The consistent power supply of 5V further enhances the reliability and consistency of the product.

No. of Terminals: 132

The ample number of terminals allows for versatile connections and compatibility with various systems and setups.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand high temperatures, making it suitable for industrial environments.

Organization: 512X32

The 512X32 organization offers a balance between storage capacity and data width, making the product suitable for a wide range of applications.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow the product to drive multiple loads effectively, increasing its functionality and versatility.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures that the product can function reliably in cold environments as well.

Terminal Position: QUAD

The quad terminal position simplifies the installation process and ensures proper alignment, enhancing the product's overall usability.

Maximum Seated Height: 4.57 mm

The low maximum seated height of 4.57 mm allows for compact designs and efficient use of space in electronic systems.

Maximum Clock Frequency (fCLK): 50 MHz

The high maximum clock frequency of 50 MHz enables fast data processing and transmission speeds, making the product ideal for demanding applications.

Width: 24.13 mm

The compact width of 24.13 mm ensures that the product can fit into tight spaces and PCB layouts without compromising on performance.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V ensures that the product remains operational even under low power conditions, increasing its reliability.

Length: 24.13 mm

The short length of 24.13 mm further enhances the product's compactness and suitability for small-scale electronic applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures that the product meets industry standards and can reliably perform in typical operating conditions.

Technology: CMOS

The use of CMOS technology offers low power consumption and high noise immunity, contributing to the product's efficiency and reliability.

Parallel or Serial: PARALLEL

The parallel data transfer mode allows for fast and simultaneous transmission of multiple data bits, making the product well-suited for real-time applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and robust mechanical connections, ensuring stable signal transmission and durability.

No. of Words: 512 words

The 512 words capacity offers ample storage for data processing and retrieval, making the product suitable for applications requiring large memory storage.

Memory Width: 32

The 32 memory width allows for efficient data handling and processing, providing a balance between data capacity and speed.

Terminal Pitch: 0.635 mm

The narrow terminal pitch of 0.635 mm enables high-density mounting and compact PCB layouts, enhancing the product's versatility and compatibility.

No. of Words Code: 512

The 512 words code enables precise addressing and data retrieval, ensuring accurate data transmission and storage.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides flexibility and tolerance against voltage fluctuations, ensuring stable operation in varying conditions.

Memory Density: 16384 bit

The high memory density of 16384 bits enables the product to store and process large amounts of data effectively, making it suitable for data-intensive applications.

Memory IC Type: BI-DIRECTIONAL FIFO

The bi-directional FIFO memory IC type allows for simultaneous read and write operations, enhancing data transfer efficiency and system performance.

Output Enable: YES

The output enable feature provides control over data output, allowing for flexible data transmission and enabling power-saving modes when not in use.

Maximum Standby Current: 0.0004 Amp

The low maximum standby current of 0.0004 Amp ensures energy efficiency and minimal power consumption during idle or standby modes.

Maximum Access Time: 13 ns

The fast maximum access time of 13 ns ensures quick data retrieval and processing, making the product suitable for real-time applications with low latency requirements.

Technical Specifications

FIFO SN74ACT3638-20PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

13 ns

Additional Features:

RETRANSMIT; MAILBOX

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

32

No. of Functions:

1

No. of Terminals:

132

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X32

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Trade Compliance

SN74ACT3638-20PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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