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SN74ACT2227DL

Texas Instruments

SN74ACT2227DL by Texas Instruments

SN74ACT2227DL by Texas Instruments is a FIFO memory IC with 128x1 organization, operating at 5V. It features synchronous operation, 12ns access time, and 0.0004A standby current. Ideal for industrial applications requiring fast data storage in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,057 parts In-Stock

1+ parts

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8,057

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Digiode

USA . 4,389 parts In-Stock

1+ parts

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4,389

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 603 parts In-Stock

1+ parts

$5.241

100+ parts

-

1k+ parts

$5.859

10k+ parts

-

603

$5.241

-

$5.859

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DigiPath Technology Company

USA . 1,629 parts In-Stock

1+ parts

$5.771

100+ parts

-

1k+ parts

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10k+ parts

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1,629

$5.771

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ChromeModa Solutions

Germany . 5,279 parts In-Stock

1+ parts

$5.889

100+ parts

$4.829

1k+ parts

-

10k+ parts

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5,279

$5.889

$4.829

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IDEA Electronic Components Group

UK . 1,351 parts In-Stock

1+ parts

$5.889

100+ parts

-

1k+ parts

$5.300

10k+ parts

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1,351

$5.889

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$5.300

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One Stop Electronics

USA . 1,633 parts In-Stock

1+ parts

$8.000

100+ parts

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1,633

$8.000

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AZTECH Wire

Italy . 398 parts In-Stock

1+ parts

$11.757

100+ parts

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398

$11.757

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Corphita

USA . 587 parts In-Stock

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587

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Overview

Enhance your system's performance and reliability with the SN74ACT2227DL by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality FIFO solutions that guarantee seamless data transfer and storage. This versatile component is ideal for various applications, offering unmatched value and benefits to customers looking to optimize their systems. With its advanced technology and industrial-grade construction, the SN74ACT2227DL ensures efficient operation even in the most demanding environments. Trust Texas Instruments to provide the innovative solutions you need to stay ahead of the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures efficient and synchronized data transfer.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard power supplies.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for interfacing with other components.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product is suitable for industrial environments.

No. of Words: 128 words

With a capacity of 128 words, this FIFO offers sufficient memory storage for data buffering.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed performance.

Maximum Access Time: 12 ns

The fast maximum access time of 12ns results in quick data retrieval and processing.

Technical Specifications

FIFO SN74ACT2227DL attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

12 ns

JESD-30 Code:

R-PDSO-G28

Memory IC Type:

Memory Width:

1

No. of Terminals:

28

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SN74ACT2227DL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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