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CD40105B

Texas Instruments

CD40105B by Texas Instruments

CD40105B by Texas Instruments is a 16x4 FIFO chip operating asynchronously at 5V, with a memory width of 4 bits and memory density of 64 bits. It features output enable functionality, has a max access time of 420ns, and is suitable for military-grade applications due to its temperature range from -55°C to 125°C.

Median Price

$32.200

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 17 parts In-Stock

1+ parts

$32.200

100+ parts

-

1k+ parts

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17

$32.200

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Digiode

USA . 4,988 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,988

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Vyrian

USA . 2,361 parts In-Stock

1+ parts

-

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2,361

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 474 parts In-Stock

1+ parts

$0.255

100+ parts

-

1k+ parts

-

10k+ parts

$0.245

474

$0.255

-

-

$0.245

Northwest PG Solutions

USA . 1,715 parts In-Stock

1+ parts

$0.280

100+ parts

-

1k+ parts

-

10k+ parts

$0.247

1,715

$0.280

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-

$0.247

Parana Technologies

USA . 670 parts In-Stock

1+ parts

$2.955

100+ parts

$274.398

1k+ parts

$2.659

10k+ parts

-

670

$2.955

$274.398

$2.659

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DigiPath Technology Company

USA . 523 parts In-Stock

1+ parts

$3.254

100+ parts

$2.993

1k+ parts

-

10k+ parts

-

523

$3.254

$2.993

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ChromeModa Solutions

Germany . 4,599 parts In-Stock

1+ parts

$3.320

100+ parts

$2.722

1k+ parts

-

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4,599

$3.320

$2.722

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IDEA Electronic Components Group

UK . 1,437 parts In-Stock

1+ parts

$3.320

100+ parts

-

1k+ parts

$2.988

10k+ parts

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1,437

$3.320

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$2.988

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AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$17.626

100+ parts

-

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520

$17.626

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One Stop Electronics

USA . 988 parts In-Stock

1+ parts

$27.000

100+ parts

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988

$27.000

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Corphita

USA . 4,023 parts In-Stock

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4,023

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Overview

Enhance your electronic designs with the CD40105B by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. The CD40105B is a FIFO device that offers seamless data storage and retrieval capabilities, making it ideal for a wide range of applications. With its high performance and innovative features, this product provides exceptional value and unparalleled benefits to customers looking to optimize their designs. Trust Texas Instruments for all your electronic component needs.

Feature Benefit Bullets

Surface Mount: YES

This product can be easily mounted on the surface of a PCB, making it convenient for assembly.

Operating Mode: ASYNCHRONOUS

Allows for independent operation of read and write operations, providing flexibility in data transfer.

Nominal Supply Voltage: 5V

Standard voltage requirement, making it compatible with most electronic systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, suitable for harsh environment applications.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing efficiency.

Memory Width: 4

Allows for efficient storage and retrieval of data in 4-bit chunks.

Output Enable: YES

Provides control over the output signal, allowing for data to be displayed or suppressed as needed.

Technical Specifications

FIFO CD40105B attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

420 ns

JESD-30 Code:

R-XUUC-N16

Memory Density:

64 bit

Memory Width:

4

No. of Functions:

1

No. of Terminals:

16

No. of Words:

16 words

No. of Words Code:

16

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

16X4

Output Enable:

YES

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

CD40105B Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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