Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 5.08 mm;
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FIFO CD40105BDMSR attributes and parameters. Explore more FIFO devices from Renesas Electronics
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CD40105BDMSR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
BAV99
Onsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
2N2222A
International Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
1N4148
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
MMBT2222ALT1G
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
1N4148WS
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diotec Electronics
Gec Plessey Semiconductors
Bytesonic Electronics
LM358N
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
IDT7203L15JI8
Integrated Device Technology
IDT7203L15JI8 by Integrated Device Technology is a FIFO chip with 2Kx9 organization, operating at 40 MHz clock frequency. It features a cycle time of 25 ns and can operate in industrial temperature range. This chip is suitable for applications requiring fast data storage and retrieval in parallel mode.
SN74ACT2236-30FN
Texas Instruments
SN74ACT2236-30FN by Texas Instruments is a 2Kx9 BI-DIRECTIONAL FIFO chip carrier with 3-STATE output, operating at 33MHz with a cycle time of 30.3ns. Ideal for industrial applications, it features synchronous operation and a memory density of 18432 bits, making it suitable for high-speed parallel data transfer.
SN74ACT72221L-25RJR
SN74ACT72221L-25RJR by Texas Instruments is a 1Kx9 FIFO chip with 25ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a memory density of 9216 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT7819A-10PN
SN74ABT7819A-10PN by Texas Instruments is a 512Kx18 BI-DIRECTIONAL FIFO with 10ns cycle time, operating at 100MHz. It features a 5V nominal voltage and GULL WING terminal form. Ideal for applications requiring fast data transfer and synchronization in commercial temperature environments.
7203L12JG8
Renesas Electronics
Renesas Electronics 7203L12JG8 is a FIFO chip with 2Kx9 organization, operating at 50 MHz clock frequency. It has a cycle time of 20 ns and supports parallel mode. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.
CD74HC40105M96G4
CD74HC40105M96G4 by Texas Instruments is a FIFO memory with 16x4 organization, operating at 12 MHz clock frequency. It has a cycle time of 500 ns and can operate in synchronous mode. This small outline package is suitable for military-grade applications requiring fast data storage and retrieval.
SN74ACT2228DW
SN74ACT2228DW by Texas Instruments is a FIFO with 256x1 organization, operating at 22 MHz clock frequency. It has a cycle time of 45.45 ns and operates on a nominal voltage of 5V. Ideal for industrial applications requiring fast data storage and retrieval in synchronous mode.
SN74ACT7204L-50RJR
SN74ACT7204L-50RJR by Texas Instruments is a 4Kx9 FIFO chip with 65ns cycle time, operating at 5V. It features a 3-STATE output and operates in parallel mode. This CMOS technology chip is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT7819A-30PH
SN74ABT7819A-30PH by Texas Instruments is a 512KX18 BI-DIRECTIONAL FIFO with 30 ns cycle time, operating at 33.3 MHz clock frequency. It features synchronous operation and GULL WING terminals, suitable for applications requiring fast data transfer and memory management in commercial-grade environments.
IDT7203L15PI
IDT7203L15PI by Integrated Device Technology is a FIFO memory chip with 2Kx9 organization, operating at 40 MHz clock frequency. It has a cycle time of 25 ns and can function in industrial temperature ranges. This chip is suitable for applications requiring fast data storage and retrieval in parallel processing systems.
7201LA15SOGI
Renesas Electronics' 7201LA15SOGI FIFO features 512x9 organization, 25ns cycle time, and 40MHz clock frequency. Ideal for industrial applications requiring fast data processing with a small outline package style and operating temperature range of -40 to 85°C.
SN74ACT72235-30PMR
SN74ACT72235-30PMR by Texas Instruments is a FIFO with 1KX9 organization, 9216 bit memory density, and 30.3 ns cycle time. It operates synchronously at 5V and has a max access time of 25 ns. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
7203L25PI
7203L25PI FIFO by Integrated Device Technology features a cycle time of 35ns, operating at 5V with an organization of 2KX9. Ideal for industrial applications, it offers a memory density of 18432 bits and operates in parallel mode at a max clock frequency of 28.5MHz.
IDT7202LA15SOGI8
IDT7202LA15SOGI8 by Renesas Electronics is a FIFO with 1KX9 organization, 25 ns cycle time, and operates at 5V. It is used in industrial applications requiring fast parallel access memory with a memory density of 9216 bits and max access time of 15 ns.
SN74ABT3613-15PQ
SN74ABT3613-15PQ by Texas Instruments is a FIFO memory IC with 64x36 organization, 15 ns cycle time, and 66.7 MHz max clock frequency. It operates synchronously at 5V, suitable for commercial applications requiring fast data storage and retrieval in a compact flatpack package.
CD40105BF
CD40105BF by Texas Instruments is a 16x4 FIFO memory IC with 3-STATE output characteristics. It operates in parallel mode, with a max access time of 420ns and supports a supply voltage range of 3V to 18V. This CMOS technology device is ideal for military-grade applications requiring fast data storage and retrieval.
IDT72V265LA15TFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE; Maximum Access Time: 10 ns;
SN74ACT7204L-25RJR
SN74ACT7204L-25RJR by Texas Instruments is a FIFO chip with 4Kx9 organization, 35ns cycle time, and 25ns access time. It operates asynchronously at a supply voltage of 5V, making it ideal for high-speed data buffering in commercial temperature environments.
SN74ACT7204L25RJ
SN74ACT7204L25RJ by Texas Instruments is a FIFO chip with 4Kx9 organization, operating at 28.8MHz clock frequency and 35ns cycle time. It is designed for parallel operation in commercial temperature grade applications, featuring a memory density of 36864 bits and a max supply voltage of 5.5V.
72V241L10PFG
The Renesas Electronics 72V241L10PFG is a FIFO memory with 4Kx9 organization, operating at 100MHz clock frequency and 10ns cycle time. It is used in applications requiring fast synchronous data storage and retrieval, such as networking equipment and communication systems.
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CD40105B
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Position: UPPER;
CD40105BD
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
CD40105BE
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
CD40105BEE4
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;
CD40105BF3A
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
CD40105BF3AS2283
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 64 bit;
CD40105BH
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIE; Package Shape: UNSPECIFIED; Operating Mode: ASYNCHRONOUS;
CD40105BKMSR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
CD40105BMS
FIFOs;
CD40105BDMSH
Harris Semiconductor
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 4;
CD40105BDMSR
CD40105BFMSH
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3 V;
CD40105BFMSR
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
CD40105BKMSH
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
CD40105BD3
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
Intersil
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
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