Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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CD40105BH by Texas Instruments is a FIFO chip with 16X4 organization, operating in asynchronous mode. It features a memory width of 4, memory density of 64 bit, and operates in parallel mode. This military-grade CMOS technology has an operating temperature range from -55°C to 125°C, making it suitable for rugged applications requiring reliable data storage and retrieval.
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$4.244
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$4.674
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$9.000
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Surface mount capability allows for easy integration into PCB designs, saving valuable space and simplifying assembly processes.
Asynchronous operation provides flexibility in data transfer timing, allowing for independent control of read and write operations.
Having 16 terminals provides ample connectivity options for interfacing with other components or systems.
The unencased chip package style offers a compact and lightweight form factor, ideal for applications where space and weight constraints are critical.
With a high maximum operating temperature, this FIFO product can withstand harsh environmental conditions and maintain reliable performance.
The 16X4 organization provides a balance between storage capacity and access speed, suitable for a wide range of data buffering and transfer applications.
The low minimum operating temperature ensures reliable operation even in extreme cold environments, making this FIFO product versatile and dependable.
Having terminals positioned at the upper side facilitates easier PCB layout and routing, enhancing overall design efficiency.
The low minimum supply voltage requirement enables compatibility with a wide range of power sources, increasing the product's flexibility in different operating conditions.
Designed to meet military-grade standards, this FIFO product ensures high reliability, durability, and performance in demanding defense and aerospace applications.
Utilizing CMOS technology offers the advantages of low power consumption, high noise immunity, and compatibility with a wide range of operating voltages, making this FIFO product energy-efficient and versatile.
Parallel data transfer allows for high-speed communication between components, making this FIFO product suitable for applications requiring fast and efficient data processing.
The no-lead terminal form simplifies soldering processes and enhances reliability by reducing the risk of solder joint failures, ensuring robust connectivity in various operational conditions.
With a capacity of 16 words, this FIFO product offers sufficient storage for temporary data buffering and transfer, meeting the needs of various data processing applications.
The memory width of 4 bits per word provides a balance between data granularity and storage efficiency, making this FIFO product suitable for a wide range of data processing tasks.
Having 16 words for data storage allows for flexible data organization and management, enhancing the versatility and efficiency of this FIFO product in handling different data formats.
The high maximum supply voltage tolerance ensures compatibility with a wide range of power sources, offering robust performance and reliability in diverse operating conditions.
With a memory density of 64 bits, this FIFO product offers a balance between storage capacity and access speed, suitable for a variety of data buffering and processing requirements.
The output enable feature allows for control over data output operations, enabling efficient data transfer management and enhancing overall system flexibility and performance.
FIFO CD40105BH attributes and parameters. Explore more FIFO devices from Texas Instruments
JESD-30 Code:
Memory Density:
Memory Width:
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Enable:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Qualification:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
Terminal Position:
CD40105BH Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.
President, CEO
Haviv Ilan
Chairman
Richard K. Templeton
Senior VP, CFO
Rafael R. Lizardi
M - Fab
Fabrication
Fab Initiation
1997
USA
South Portland
Wafer Capacity
32,000
D - FAB
1966
Dallas
42,000
D MOS - 6
2002
25,000
D MOS - 5
1995
75,000
Miho - 8
1980
Japan
Inashiki
43,000
S FAB 1
Sherman
91,000
F - FAB
2001
Germany
Freising
37,000
R Fab 1
2010
Richardson
40,000
D HC Line
1999
2,000
JV3
Aizu Wakamatsu
45,000
C - FAB
2007
China
Chengdu
30,000
L - Fab
2015
Lehi
70,000
R - Fab 2
2022
S - FAB 2
2025
S - FAB 3
2028
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
LL4148
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
LM317D2TG
Onsemi
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
SMBJ18CA
Micro Commercial Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
SS14
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diodes Incorporated
Rfe International
Brightking
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
RK73H2ATTD10R0F
Koa Speer Electronics
RK73H2ATTD10R0F by Koa Speer Electronics is a 0805 SMT fixed resistor with 10 ohm resistance, 1% tolerance, and 0.25 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V.
FDV304P
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
Goodwork Semiconductor
SN74ACT72231L-15RJ
SN74ACT72231L-15RJ by Texas Instruments is a FIFO chip with 2Kx9 organization, 15 ns cycle time, and 66.7 MHz clock frequency. It operates synchronously at 5V and has a memory density of 18432 bits. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
CD40105BF3AS2283
CD40105BF3AS2283 by Texas Instruments is a 16X4 FIFO with 64-bit memory density. Operating at -55 to 125 °C, it has an access time of 420 ns and supports parallel data transfer. Ideal for military applications requiring fast and reliable data storage and retrieval.
SN74ABT3614-15PCBR
SN74ABT3614-15PCBR by Texas Instruments is a FIFO with 64x36 organization, 15 ns cycle time, and 3-STATE output characteristics. It operates synchronously at a supply voltage of 5V and is suitable for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT2235-30PMR
SN74ACT2235-30PMR by Texas Instruments is a FIFO with 1KX9 organization, 30 ns cycle time, and 3-STATE output characteristics. It operates at 5V, suitable for commercial applications requiring fast data transfer in parallel mode. The device comes in a square plastic/epoxy package with gull wing terminals and is surface mountable.
IDT72V05L25JI
Integrated Device Technology
IDT72V05L25JI by Integrated Device Technology is a FIFO chip with 8Kx9 organization, operating at 28.5 MHz clock frequency and 35 ns cycle time. It is designed for industrial applications requiring fast data storage and retrieval in parallel mode, featuring a memory density of 73728 bits and low standby current consumption of 0.005Amp.
7283L12PAG
Renesas Electronics
Renesas Electronics' 7283L12PAG FIFO operates at 50 MHz with a cycle time of 20 ns. It has a memory density of 18432 bit and is suitable for commercial applications requiring a small outline, thin profile package with dual terminal position.
SN74ACT3632-30PCBR
SN74ACT3632-30PCBR by Texas Instruments is a FIFO with 512x36 organization, 30 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments where parallel memory width of 36 bits is needed.
72V3660L7-5PFGI8
OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; Package Equivalence Code: QFP128,.63X.87,20;
SN74ACT72235-20PAGR
SN74ACT72235-20PAGR by Texas Instruments is a FIFO with 1KX9 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and parallel data transfer. The device features a thin profile flatpack package with gull wing terminals for surface mount assembly.
1M7804-20DLRG4
1M7804-20DLRG4 by Texas Instruments is a 512x18 FIFO with synchronous operation, 50 MHz clock frequency, and 15 ns access time. Ideal for commercial applications requiring fast data storage and retrieval in a compact small outline package.
SN74ACT2235-30PAGR
SN74ACT2235-30PAGR by Texas Instruments is a FIFO with 1KX9 organization, 30 ns cycle time, and 3-STATE output characteristics. It operates at 5V with a temperature range of 0-70 °C and is suitable for parallel applications requiring fast access times.
IDT7208L25JGI8
FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Seated Height: 3.55 mm;
SN74ACT7206-50RJ
SN74ACT7206-50RJ by Texas Instruments is a 16Kx9 FIFO chip carrier with 3-state output, operating at 5V. It features asynchronous mode, CMOS technology, and parallel organization. Ideal for applications requiring high-speed data transfer and temporary storage in electronic systems.
SN74ACT72211L-50RJ
SN74ACT72211L-50RJ by Texas Instruments is a FIFO chip with 512x9 organization, operating at 20MHz. It has a cycle time of 50ns and supports synchronous operation. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
72V275L10PFG8
OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 64; Package Code: LQFP; Package Shape: SQUARE; Maximum Access Time: 6.5 ns;
SN74ACT7204L-25DVR
SN74ACT7204L-25DVR by Texas Instruments is a 4Kx9 FIFO with 35ns cycle time and 25ns access time. It operates at 5V, has 28 terminals, and supports parallel mode. This device is ideal for applications requiring fast data transfer and storage in commercial temperature environments.
SN74ACT53861PZ
SN74ACT53861PZ by Texas Instruments is a FIFO memory IC with 4Kx18 organization, operating at 50 MHz with a cycle time of 20 ns. It features synchronous operation, 3-STATE output characteristics, and parallel interface. This device is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ACT3638-15PCBR
SN74ACT3638-15PCBR by Texas Instruments is a FIFO with 512x32 organization, 15 ns cycle time, and 3-STATE output characteristics. It operates synchronously at 5V and is ideal for applications requiring fast data storage and retrieval in commercial temperature environments.
SN74ABT3612-20PCB
SN74ABT3612-20PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, operating at 20 ns cycle time and 50 MHz clock frequency. It is suitable for applications requiring fast synchronous data transfer in commercial-grade environments.
SN74ACT7201LA-25NP
SN74ACT7201LA-25NP by Texas Instruments is a FIFO with 512x9 organization, 35ns cycle time, and 28.5MHz max clock frequency. It operates at 5V, has a temp range of 0-70°C, and is ideal for parallel memory applications due to its CMOS technology and 3-STATE output characteristics.
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DS160PT801ACBR
DS160PT801ACBR by Texas Instruments is a bus controller IC with 339 terminals, operating at -40 to 85°C. It supports PCI bus compatibility with a data transfer rate of 2000 MBps. This CMOS technology device has a thin profile and fine pitch package suitable for industrial applications.
LMR43610MSC3RPERQ1
LMR43610MSC3RPERQ1 by Texas Instruments is a 9-terminal switching regulator with a max output voltage of 32V and max output current of 1A. Ideal for automotive applications, it operates b/w -40 to 150°C, featuring a buck switcher config and PWM control mode at up to 2200kHz frequency.
TPS7A4301DGQR
TPS7A4301DGQR by Texas Instruments is an adjustable positive single output LDO regulator with a max output voltage of 14.5V and a dropout voltage of 0.6V. It operates in temperatures ranging from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
DRV3255EPAPRQ1
DRV3255EPAPRQ1 by Texas Instruments is a Motion Control IC with 64 terminals, operating at -40 to 150°C. It is an AEC-Q100 compliant automotive-grade IC for Brushless DC Motor control, supporting supply voltages from 5V to 90V and output currents up to 3.5A. The package style includes a flatpack with heat sink/slug, suitable for surface mount applications in automotive systems.
DRV8316RRGFR
DRV8316RRGFR by Texas Instruments is a motion control IC with a rectangular package and a terminal form of gull wing. It has a max output current of 8A and can operate at temperatures ranging from -40 to 125°C. This IC is commonly used as a brushless DC motor controller in automotive applications.
CC2662R1FTWRGZRQ1
CC2662R1FTWRGZRQ1 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 48 MHz clock frequency, and 81920 bytes of RAM. Ideal for industrial applications, it features 8 ADC channels, 32 DMA channels, and peripherals like AES and PWM for efficient system integration.
UCC27284DRCR
UCC27284DRCR by Texas Instruments is a MOSFET gate driver with 2 channels, capable of handling a max output current of 3.5A. It operates in automotive-grade temperatures (-40 to 125°C) and has a turn-on/off time of 30µs. This chip carrier package with very thin profile is suitable for high side driver applications requiring fast switching speeds.
CD40105B
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIE; Package Shape: RECTANGULAR; Terminal Position: UPPER;
CD40105BD
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;
CD40105BE
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE;
CD40105BEE4
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 5;
CD40105BF
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words Code: 16;
CD40105BF3A
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 64 bit;
CD40105BDMSR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 5.08 mm;
CD40105BKMSR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS;
CD40105BMS
FIFOs;
CD40105BDMSH
Harris Semiconductor
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Memory Width: 4;
CD40105BFMSH
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 3 V;
CD40105BFMSR
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;
CD40105BK3
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; No. of Words: 16 words;
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
CD40105BD3
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel;
Intersil
OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
CD40105BHMSR
FIFOs; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIE; Package Shape: RECTANGULAR; JESD-609 Code: e0;
Supply Digital Components
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