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SN74ACT72221L-25RJ

Texas Instruments

SN74ACT72221L-25RJ by Texas Instruments

SN74ACT72221L-25RJ by Texas Instruments is a FIFO chip with 1KX9 organization, 40 MHz clock frequency, and 25 ns cycle time. It operates synchronously at 5V and has a memory density of 9216 bit. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$17.975

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,968 parts In-Stock

1+ parts

-

100+ parts

$14.380

1k+ parts

$12.870

10k+ parts

$12.110

5,968

-

$14.380

$12.870

$12.110

DigiKey

USA . 5,968 parts In-Stock

1+ parts

-

100+ parts

$18.930

1k+ parts

-

10k+ parts

-

5,968

-

$18.930

-

-

Verical

USA . 5,968 parts In-Stock

1+ parts

-

100+ parts

$17.975

1k+ parts

$16.087

10k+ parts

$15.137

5,968

-

$17.975

$16.087

$15.137

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,981 parts In-Stock

1+ parts

$15.181

100+ parts

-

1k+ parts

-

10k+ parts

-

4,981

$15.181

-

-

-

Vyrian

USA . 1,620 parts In-Stock

1+ parts

$15.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,620

$15.980

-

-

-

Freelance Electronics

USA . 219 parts In-Stock

1+ parts

$25.500

100+ parts

$26.775

1k+ parts

$25.245

10k+ parts

-

219

$25.500

$26.775

$25.245

-

DigiKey Marketplace

USA . 5,968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,968

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 44 parts In-Stock

1+ parts

$3.794

100+ parts

-

1k+ parts

$4.284

10k+ parts

-

44

$3.794

-

$4.284

-

DigiPath Technology Company

USA . 1,120 parts In-Stock

1+ parts

$4.178

100+ parts

$3.844

1k+ parts

-

10k+ parts

-

1,120

$4.178

$3.844

-

-

ChromeModa Solutions

Germany . 5,299 parts In-Stock

1+ parts

$4.263

100+ parts

$3.496

1k+ parts

-

10k+ parts

-

5,299

$4.263

$3.496

-

-

IDEA Electronic Components Group

UK . 1,643 parts In-Stock

1+ parts

$4.263

100+ parts

-

1k+ parts

$3.837

10k+ parts

-

1,643

$4.263

-

$3.837

-

Corphita

USA . 749 parts In-Stock

1+ parts

$14.382

100+ parts

-

1k+ parts

-

10k+ parts

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749

$14.382

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-

-

Overview

Unlock the power of seamless data transfer with the SN74ACT72221L-25RJ by Texas Instruments. As a leader in semiconductor technology, Texas Instruments delivers top-quality FIFO products for a wide range of applications. This FIFO chip boasts a cycle time of 25 ns and can operate at a maximum clock frequency of 40 MHz, providing fast and efficient data storage and retrieval. With a memory density of 9216 bits and an output enable feature, this chip offers unmatched performance and reliability. Upgrade your system with the SN74ACT72221L-25RJ and experience the benefits of Texas Instruments' cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the FIFO, making it suitable for various operating environments.

Cycle Time: 25 ns

The fast cycle time of 25 ns allows for quick data storage and retrieval, making the FIFO efficient for high-speed applications.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise timing and coordination within the FIFO system, resulting in reliable data transfer and processing.

Maximum Clock Frequency (fCLK): 40 MHz

With a maximum clock frequency of 40 MHz, this FIFO can handle high-speed data processing and communication tasks efficiently.

Memory Density: 9216 bit

The high memory density of 9216 bits allows for storing a large amount of data in a compact space, making the FIFO ideal for applications requiring extensive data storage.

Technical Specifications

FIFO SN74ACT72221L-25RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Maximum Clock Frequency (fCLK):

40 MHz

Cycle Time:

25 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.995 mm

Memory Density:

9216 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sub-Category:

FIFOs

Maximum Supply Current:

160 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT72221L-25RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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