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SN74ACT3641-30PQ

Texas Instruments

SN74ACT3641-30PQ by Texas Instruments

SN74ACT3641-30PQ by Texas Instruments is a 1Kx36 CMOS FIFO memory with 30ns cycle time, operating at 5V. It features synchronous operation, 3-STATE output characteristics, and a max clock frequency of 33.4MHz. Ideal for applications requiring high-speed data storage and retrieval in commercial temperature environments.

Median Price

$27.880

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 278 parts In-Stock

1+ parts

-

100+ parts

$24.140

1k+ parts

$21.600

10k+ parts

$20.330

278

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$20.330

DigiKey

USA . 278 parts In-Stock

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$27.880

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Verical

USA . 179 parts In-Stock

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$30.175

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$27.000

10k+ parts

$25.413

179

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$30.175

$27.000

$25.413

Distributors (In-Stock)

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Digiode

USA . 309 parts In-Stock

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$25.470

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309

$25.470

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Vyrian

USA . 6,931 parts In-Stock

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DigiKey Marketplace

USA . 278 parts In-Stock

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Resion

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Distributors (Availability)

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Parana Technologies

USA . 222 parts In-Stock

1+ parts

$5.274

100+ parts

-

1k+ parts

$5.898

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222

$5.274

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$5.898

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DigiPath Technology Company

USA . 145 parts In-Stock

1+ parts

$5.807

100+ parts

$5.343

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145

$5.807

$5.343

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ChromeModa Solutions

Germany . 5,051 parts In-Stock

1+ parts

$5.926

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$4.859

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5,051

$5.926

$4.859

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IDEA Electronic Components Group

UK . 30 parts In-Stock

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$5.926

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$5.333

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30

$5.926

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$5.333

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Corphita

USA . 931 parts In-Stock

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$24.129

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QUARKTWIN TECHNOLOGY LTD

USA . 17,218 parts In-Stock

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Kepictronics

USA . 278 parts In-Stock

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Microchip USA

USA . 141 parts In-Stock

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Overview

Unlock seamless data transfer with the SN74ACT3641-30PQ by Texas Instruments, a top-of-the-line FIFO memory IC. Designed with precision and reliability in mind, this bi-directional FIFO offers unparalleled performance for a wide range of applications. From industrial automation to telecommunications, this versatile component ensures smooth operation and efficient data handling. Trust in Texas Instruments' expertise and invest in the SN74ACT3641-30PQ for superior quality and unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for various applications.

Cycle Time: 30 ns

The fast cycle time of 30 ns ensures quick data access and processing, making the product efficient for high-speed operations.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise timing and coordination of data signals, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage allows for compatibility with standard power sources, making integration into existing systems easier.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signals, allowing for efficient data transmission in various scenarios.

Technical Specifications

FIFO SN74ACT3641-30PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

RETRANSMIT; MAILBOX

Maximum Clock Frequency (fCLK):

33.4 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

132

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0004 Amp

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Trade Compliance

SN74ACT3641-30PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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