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SN74ABT3612-30PCB

Texas Instruments

SN74ABT3612-30PCB by Texas Instruments

SN74ABT3612-30PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 30 ns cycle time, and 33.4 MHz clock frequency. It operates synchronously at 5V and has a low profile flatpack package suitable for commercial temperature grade applications.

Median Price

$18.150

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,447 parts In-Stock

1+ parts

-

100+ parts

$15.710

1k+ parts

$14.060

10k+ parts

$13.230

2,447

-

$15.710

$14.060

$13.230

DigiKey

USA . 2,447 parts In-Stock

1+ parts

-

100+ parts

$18.150

1k+ parts

-

10k+ parts

-

2,447

-

$18.150

-

-

Verical

USA . 1,547 parts In-Stock

1+ parts

-

100+ parts

$19.637

1k+ parts

$17.575

10k+ parts

$16.538

1,547

-

$19.637

$17.575

$16.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,699 parts In-Stock

1+ parts

$16.578

100+ parts

-

1k+ parts

-

10k+ parts

-

2,699

$16.578

-

-

-

Vyrian

USA . 361 parts In-Stock

1+ parts

$17.450

100+ parts

-

1k+ parts

-

10k+ parts

-

361

$17.450

-

-

-

DigiKey Marketplace

USA . 2,447 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,447

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,289 parts In-Stock

1+ parts

$2.815

100+ parts

-

1k+ parts

$3.300

10k+ parts

-

1,289

$2.815

-

$3.300

-

DigiPath Technology Company

USA . 1,391 parts In-Stock

1+ parts

$3.100

100+ parts

$2.852

1k+ parts

-

10k+ parts

-

1,391

$3.100

$2.852

-

-

ChromeModa Solutions

Germany . 1,955 parts In-Stock

1+ parts

$3.163

100+ parts

$2.594

1k+ parts

-

10k+ parts

-

1,955

$3.163

$2.594

-

-

IDEA Electronic Components Group

UK . 12 parts In-Stock

1+ parts

$3.163

100+ parts

-

1k+ parts

$2.847

10k+ parts

-

12

$3.163

-

$2.847

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Ampacity Inc.

Singapore . 1,662 parts In-Stock

1+ parts

$14.830

100+ parts

-

1k+ parts

-

10k+ parts

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1,662

$14.830

-

-

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Corphita

USA . 2,204 parts In-Stock

1+ parts

$15.705

100+ parts

-

1k+ parts

-

10k+ parts

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2,204

$15.705

-

-

-

Component Stockers USA

USA . 4,676 parts In-Stock

1+ parts

$17.810

100+ parts

$16.740

1k+ parts

$15.130

10k+ parts

-

4,676

$17.810

$16.740

$15.130

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Microchip USA

USA . 182 parts In-Stock

1+ parts

-

100+ parts

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182

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Overview

Experience superior performance and reliability with the Texas Instruments SN74ABT3612-30PCB FIFO memory IC. Manufactured by industry leader Texas Instruments, this BI-DIRECTIONAL FIFO offers a seamless synchronization process, ensuring efficient data transfer at a cycle time of 30 ns. Ideal for a wide range of applications, this memory IC boasts a high-speed operation with a maximum clock frequency of 33.4 MHz. Trust in Texas Instruments to deliver top-notch quality and innovation, providing you with the value and benefits you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components.

Cycle Time: 30 ns

Fast data transfer speeds ensure efficient operation of the FIFO.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfers, reducing the chance of errors.

Maximum Operating Temperature: 70 °C

Can operate in various temperature conditions without compromising performance.

Memory Density: 2304 bit

High memory density allows for storage of a large amount of data.

Technical Specifications

FIFO SN74ABT3612-30PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Additional Features:

PARITY GENERATOR/CHECKER; MAILBOX

Maximum Clock Frequency (fCLK):

33.4 MHz

Cycle Time:

30 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

130 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

SN74ABT3612-30PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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