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SN74ABT3614-20PCB

Texas Instruments

SN74ABT3614-20PCB by Texas Instruments

SN74ABT3614-20PCB by Texas Instruments is a FIFO memory IC with 64x36 organization, 20 ns cycle time, and 50 MHz clock frequency. It operates synchronously at 5V and has a low profile flatpack package. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$26.730

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,879 parts In-Stock

1+ parts

-

100+ parts

$23.120

1k+ parts

$20.690

10k+ parts

$19.470

1,879

-

$23.120

$20.690

$19.470

DigiKey

USA . 1,839 parts In-Stock

1+ parts

-

100+ parts

$26.730

1k+ parts

-

10k+ parts

-

1,839

-

$26.730

-

-

Verical

USA . 1,605 parts In-Stock

1+ parts

-

100+ parts

$28.900

1k+ parts

$25.863

10k+ parts

$24.337

1,605

-

$28.900

$25.863

$24.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 790 parts In-Stock

1+ parts

$24.415

100+ parts

-

1k+ parts

-

10k+ parts

-

790

$24.415

-

-

-

Vyrian

USA . 2,032 parts In-Stock

1+ parts

$25.700

100+ parts

-

1k+ parts

-

10k+ parts

-

2,032

$25.700

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,221 parts In-Stock

1+ parts

$3.689

100+ parts

-

1k+ parts

$4.194

10k+ parts

-

2,221

$3.689

-

$4.194

-

ChromeModa Solutions

Germany . 4,491 parts In-Stock

1+ parts

$4.145

100+ parts

$3.399

1k+ parts

-

10k+ parts

-

4,491

$4.145

$3.399

-

-

IDEA Electronic Components Group

UK . 558 parts In-Stock

1+ parts

$4.145

100+ parts

-

1k+ parts

$3.730

10k+ parts

-

558

$4.145

-

$3.730

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$4.204

100+ parts

$3.826

1k+ parts

$3.447

10k+ parts

-

10

$4.204

$3.826

$3.447

-

Corphita

USA . 2,587 parts In-Stock

1+ parts

$23.130

100+ parts

-

1k+ parts

-

10k+ parts

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2,587

$23.130

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,099 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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29,099

-

-

-

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Microchip USA

USA . 4,851 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,851

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-

-

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DigiPath Technology Company

USA . 1,498 parts In-Stock

1+ parts

-

100+ parts

$3.737

1k+ parts

-

10k+ parts

-

1,498

-

$3.737

-

-

Overview

Unlock seamless data transfer with the Texas Instruments SN74ABT3614-20PCB FIFO. With a reputation for high-quality components, Texas Instruments delivers a reliable solution for your synchronization needs. This FIFO is perfect for a wide range of applications, offering customers unparalleled value and efficiency. Stay ahead of the curve with the cutting-edge technology and superior performance of the SN74ABT3614-20PCB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy body material ensures durability and resistance to external elements, making this product suitable for a variety of applications.

Cycle Time: 20 ns

The fast cycle time of 20 ns ensures quick data processing and transfer, making this FIFO product efficient and reliable in high-speed applications.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures proper coordination and timing in data transfer, resulting in accurate and efficient communication within the system.

Maximum Clock Frequency (fCLK): 50 MHz

With a maximum clock frequency of 50 MHz, this FIFO product can handle high-speed data processing tasks with ease, making it suitable for demanding applications.

Memory IC Type: BI-DIRECTIONAL FIFO

The bi-directional FIFO memory IC type allows for simultaneous read and write operations, enabling efficient data flow in both directions and enhancing the overall performance of the product.

Technical Specifications

FIFO SN74ABT3614-20PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

12 ns

Additional Features:

PARITY GENERATOR/CHECKER, MAILBOX

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G120

JESD-609 Code:

e4

Length:

14 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

120

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

130 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Trade Compliance

SN74ABT3614-20PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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