Loading...

SN74ABT3614-20PCBR

Texas Instruments

SN74ABT3614-20PCBR by Texas Instruments

SN74ABT3614-20PCBR by Texas Instruments is a FIFO with 64x36 organization, 20 ns cycle time, and 5V nominal voltage. It is used in applications requiring fast synchronous operation and 3-STATE output characteristics. Ideal for commercial temperature grade environments, this device offers parallel access with a memory density of 2304 bits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,503

-

-

-

-

Digiode

USA . 4,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,349

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,240 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,240

$4.000

-

-

-

Parana Technologies

USA . 1,301 parts In-Stock

1+ parts

$5.041

100+ parts

-

1k+ parts

$5.602

10k+ parts

-

1,301

$5.041

-

$5.602

-

DigiPath Technology Company

USA . 1,640 parts In-Stock

1+ parts

$5.551

100+ parts

$5.107

1k+ parts

-

10k+ parts

-

1,640

$5.551

$5.107

-

-

ChromeModa Solutions

Germany . 618 parts In-Stock

1+ parts

$5.664

100+ parts

$4.644

1k+ parts

-

10k+ parts

-

618

$5.664

$4.644

-

-

IDEA Electronic Components Group

UK . 549 parts In-Stock

1+ parts

$5.664

100+ parts

-

1k+ parts

$5.098

10k+ parts

-

549

$5.664

-

$5.098

-

AZTECH Wire

Italy . 430 parts In-Stock

1+ parts

$8.295

100+ parts

-

1k+ parts

-

10k+ parts

-

430

$8.295

-

-

-

Corphita

USA . 2,160 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,160

-

-

-

-

Overview

Unlock seamless data transfer and efficient memory management with the SN74ABT3614-20PCBR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality FIFO products like this one, designed for synchronous operation with a fast cycle time of 20 ns. Perfect for a wide range of applications, this FIFO device offers customers value, reliability, and high performance, making it an essential component for any data processing system. Experience the benefits of smooth data flow and optimized memory organization with the SN74ABT3614-20PCBR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Cycle Time: 20 ns

Fast cycle time of 20 ns ensures efficient operation and quick data retrieval.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and coordinated data transfers within the FIFO.

Nominal Supply Voltage / Vsup (V): 5V

Operating at a standard supply voltage of 5V makes it compatible with a wide range of systems.

Output Characteristics: 3-STATE

The 3-state output allows for flexible control of the output signal, enhancing versatility.

Technology: BICMOS

Utilizing BiCMOS technology combines the advantages of bipolar and CMOS technologies, offering high speed and low power consumption.

Memory Density: 2304 bit

High memory density of 2304 bit allows for storage of large amounts of data in the FIFO.

Output Enable: YES

The output enable feature provides control over when data is outputted, enhancing data management.

Maximum Access Time: 12 ns

The fast maximum access time of 12 ns ensures quick retrieval of data from the FIFO.

Technical Specifications

FIFO SN74ABT3614-20PCBR attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

12 ns

Additional Features:

PARITY GENERATOR/CHECKER, MAILBOX

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

2304 bit

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Trade Compliance

SN74ABT3614-20PCBR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20