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SN74ACT72231L-20RJ

Texas Instruments

SN74ACT72231L-20RJ by Texas Instruments

SN74ACT72231L-20RJ by Texas Instruments is a 2Kx9 FIFO chip carrier with 20ns cycle time, operating at 5V. It features synchronous operation, 50MHz clock frequency, and 3-STATE output characteristics. Ideal for applications requiring fast data transfer and storage in commercial temperature environments.

Median Price

$18.663

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,269 parts In-Stock

1+ parts

-

100+ parts

$14.930

1k+ parts

$13.360

10k+ parts

$12.580

2,269

-

$14.930

$13.360

$12.580

DigiKey

USA . 2,269 parts In-Stock

1+ parts

-

100+ parts

$19.650

1k+ parts

-

10k+ parts

-

2,269

-

$19.650

-

-

Verical

USA . 2,269 parts In-Stock

1+ parts

-

100+ parts

$18.663

1k+ parts

$16.700

10k+ parts

$15.725

2,269

-

$18.663

$16.700

$15.725

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 455 parts In-Stock

1+ parts

$15.770

100+ parts

-

1k+ parts

-

10k+ parts

-

455

$15.770

-

-

-

Vyrian

USA . 3,156 parts In-Stock

1+ parts

$16.600

100+ parts

-

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-

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3,156

$16.600

-

-

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DigiKey Marketplace

USA . 2,269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,269

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 930 parts In-Stock

1+ parts

$2.164

100+ parts

-

1k+ parts

$2.676

10k+ parts

-

930

$2.164

-

$2.676

-

DigiPath Technology Company

USA . 68 parts In-Stock

1+ parts

$2.382

100+ parts

$2.192

1k+ parts

-

10k+ parts

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68

$2.382

$2.192

-

-

IDEA Electronic Components Group

UK . 1,717 parts In-Stock

1+ parts

$2.431

100+ parts

-

1k+ parts

$2.188

10k+ parts

-

1,717

$2.431

-

$2.188

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ChromeModa Solutions

Germany . 646 parts In-Stock

1+ parts

$2.431

100+ parts

$1.993

1k+ parts

-

10k+ parts

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646

$2.431

$1.993

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-

Corphita

USA . 3,313 parts In-Stock

1+ parts

$14.940

100+ parts

-

1k+ parts

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3,313

$14.940

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QUARKTWIN TECHNOLOGY LTD

USA . 6,043 parts In-Stock

1+ parts

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100+ parts

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6,043

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Overview

Experience seamless data transfer with the SN74ACT72231L-20RJ FIFO by Texas Instruments, a top-tier manufacturer known for quality and reliability. This versatile chip carrier is perfect for applications requiring fast, synchronous operation with a 20 ns cycle time and 50 MHz clock frequency. With a memory density of 18,432 bits and 2Kx9 organization, this FIFO offers high performance and efficiency. Say goodbye to data bottlenecks and hello to smooth operations with the SN74ACT72231L-20RJ - the perfect solution for your parallel data transfer needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the internal components of the FIFO from external elements, ensuring reliability in various operating conditions.

Cycle Time: 20 ns

Fast cycle time of 20 ns allows for quick data transfer and processing, making the FIFO ideal for applications that require high-speed operation.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power systems and simplifies integration into existing circuits.

Maximum Clock Frequency (fCLK): 50 MHz

The high maximum clock frequency of 50 MHz enables efficient data handling and access within the FIFO, making it suitable for demanding applications that require rapid data processing.

Memory IC Type: OTHER FIFO

The memory IC type of FIFO indicates that the product is specifically designed for First-In-First-Out data storage and retrieval, making it a specialized and reliable choice for buffering data streams.

Technical Specifications

FIFO SN74ACT72231L-20RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

12 ns

Maximum Clock Frequency (fCLK):

50 MHz

Cycle Time:

20 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.995 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sub-Category:

FIFOs

Maximum Supply Current:

160 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT72231L-20RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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