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SN74ABT7815-20PCB

Texas Instruments

SN74ABT7815-20PCB by Texas Instruments

SN74ABT7815-20PCB by Texas Instruments is a 128x36 bi-directional FIFO memory IC with synchronous operation at 50 MHz. It operates on a 5V supply, has a max access time of 12ns, and can function in commercial temperature grades. This device is ideal for applications requiring fast data transfer and storage in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,783 parts In-Stock

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4,783

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Digiode

USA . 167 parts In-Stock

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167

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Parana Technologies

USA . 2,062 parts In-Stock

1+ parts

$2.348

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-

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$2.848

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2,062

$2.348

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$2.848

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DigiPath Technology Company

USA . 1,795 parts In-Stock

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$2.585

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1,795

$2.585

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IDEA Electronic Components Group

UK . 223 parts In-Stock

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$2.638

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$2.374

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223

$2.638

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$2.374

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ChromeModa Solutions

Germany . 205 parts In-Stock

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$2.638

100+ parts

$2.163

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205

$2.638

$2.163

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One Stop Electronics

USA . 907 parts In-Stock

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$4.000

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907

$4.000

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AZTECH Wire

Italy . 737 parts In-Stock

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$15.023

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737

$15.023

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Corphita

USA . 1,979 parts In-Stock

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Overview

Experience seamless and efficient data transfer with the Texas Instruments SN74ABT7815-20PCB FIFO memory IC. This high-quality product boasts a robust construction and reliable performance, thanks to its manufacturer's stellar reputation. Perfect for a wide range of applications, this BI-DIRECTIONAL FIFO memory IC offers customers unparalleled value and benefits. With a maximum clock frequency of 50 MHz and a fast maximum access time of 12 ns, this product ensures smooth operations and optimal efficiency. Upgrade your system with the SN74ABT7815-20PCB and enjoy superior performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy installation and saves space on the PCB, making it suitable for compact designs.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures that data is processed at a predictable rate, improving overall system performance and reliability.

Nominal Supply Voltage / Vsup (V): 5

Having a standard supply voltage of 5V simplifies power management and compatibility with other components.

No. of Terminals: 120

Having 120 terminals allows for a large number of input and output connections, making the product versatile for various applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the product can withstand harsh environmental conditions and maintain reliable operation.

Memory Width: 36

A memory width of 36 bits enables the product to handle larger amounts of data efficiently, suitable for high-performance applications.

Maximum Clock Frequency (fCLK): 50 MHz

A maximum clock frequency of 50 MHz allows for fast data processing and high-speed operation, making it suitable for demanding applications.

Temperature Grade: COMMERCIAL

Being commercial grade ensures that the product meets industry standards for reliability and performance in typical operating conditions.

Maximum Access Time: 12 ns

A maximum access time of 12 ns ensures quick data retrieval and processing, essential for time-sensitive applications.

Technical Specifications

FIFO SN74ABT7815-20PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

12 ns

Maximum Clock Frequency (fCLK):

50 MHz

JESD-30 Code:

S-PQFP-G120

Memory IC Type:

Memory Width:

36

No. of Terminals:

120

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128X36

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

FIFOs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ABT7815-20PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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