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SN74ACT7203L-15DV

Texas Instruments

SN74ACT7203L-15DV by Texas Instruments

SN74ACT7203L-15DV by Texas Instruments is a 2Kx9 FIFO with 25ns cycle time, operating at 5V. It features a max clock frequency of 40MHz and is suitable for applications requiring fast data transfer and storage in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,646 parts In-Stock

1+ parts

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9,646

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Digiode

USA . 3,336 parts In-Stock

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3,336

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Distributors (Availability)

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One Stop Electronics

USA . 831 parts In-Stock

1+ parts

$2.000

100+ parts

-

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831

$2.000

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Parana Technologies

USA . 316 parts In-Stock

1+ parts

$2.417

100+ parts

-

1k+ parts

$2.915

10k+ parts

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316

$2.417

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$2.915

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DigiPath Technology Company

USA . 2,059 parts In-Stock

1+ parts

$2.662

100+ parts

-

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2,059

$2.662

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ChromeModa Solutions

Germany . 5,801 parts In-Stock

1+ parts

$2.716

100+ parts

$2.227

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5,801

$2.716

$2.227

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IDEA Electronic Components Group

UK . 463 parts In-Stock

1+ parts

$2.716

100+ parts

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$2.444

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463

$2.716

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$2.444

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AZTECH Wire

Italy . 437 parts In-Stock

1+ parts

$6.097

100+ parts

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437

$6.097

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Corphita

USA . 2,212 parts In-Stock

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Overview

Experience seamless data transfer and efficient memory management with the SN74ACT7203L-15DV FIFO by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality products that are reliable and durable. The SN74ACT7203L-15DV is perfect for applications requiring fast data processing and storage. With a cycle time of 25 ns and a maximum clock frequency of 40 MHz, this FIFO ensures quick and accurate performance. Trust in Texas Instruments to provide you with cutting-edge technology that enhances your systems' capabilities and boosts productivity. Choose the SN74ACT7203L-15DV for superior quality and unmatched efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body ensures product reliability and easy handling.

Cycle Time: 25 ns

Fast cycle time allows for efficient data transfer and processing, improving overall system performance.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible data transfer without the need for strict timing synchronization.

Nominal Supply Voltage / Vsup (V): 5

Stable supply voltage of 5V ensures consistent and reliable operation of the product.

Maximum Clock Frequency (fCLK): 40 MHz

High clock frequency allows for rapid data retrieval and processing, enhancing system speed.

Technical Specifications

FIFO SN74ACT7203L-15DV attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

15 ns

Maximum Clock Frequency (fCLK):

40 MHz

Cycle Time:

25 ns

JESD-30 Code:

R-PDSO-G28

Length:

18.365 mm

Memory Density:

18432 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

28

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX9

Output Characteristics:

3-STATE

Output Enable:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.45

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.05 mm

Maximum Standby Current:

.002 Amp

Sub-Category:

FIFOs

Maximum Supply Current:

120 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8.765 mm

Trade Compliance

SN74ACT7203L-15DV Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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