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SN74ACT72221L35RJ

Texas Instruments

SN74ACT72221L35RJ by Texas Instruments

SN74ACT72221L35RJ by Texas Instruments is a 1Kx9 FIFO chip with CMOS technology. It operates synchronously at 5V, has 32 terminals, and supports parallel data transfer. This rectangular chip carrier package is ideal for applications requiring high-speed data buffering and storage in commercial temperature environments.

Median Price

$15.825

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,632 parts In-Stock

1+ parts

-

100+ parts

$12.660

1k+ parts

$11.330

10k+ parts

$10.660

1,632

-

$12.660

$11.330

$10.660

DigiKey

USA . 1,632 parts In-Stock

1+ parts

-

100+ parts

$16.660

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-

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1,632

-

$16.660

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Verical

USA . 1,632 parts In-Stock

1+ parts

-

100+ parts

$15.825

1k+ parts

$14.162

10k+ parts

$13.325

1,632

-

$15.825

$14.162

$13.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,016 parts In-Stock

1+ parts

$13.366

100+ parts

-

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4,016

$13.366

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Vyrian

USA . 913 parts In-Stock

1+ parts

$14.070

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-

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913

$14.070

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,186 parts In-Stock

1+ parts

$2.074

100+ parts

-

1k+ parts

$2.593

10k+ parts

-

1,186

$2.074

-

$2.593

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DigiPath Technology Company

USA . 1,015 parts In-Stock

1+ parts

$2.283

100+ parts

$2.101

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-

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1,015

$2.283

$2.101

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ChromeModa Solutions

Germany . 6,963 parts In-Stock

1+ parts

$2.330

100+ parts

$1.911

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6,963

$2.330

$1.911

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IDEA Electronic Components Group

UK . 925 parts In-Stock

1+ parts

$2.330

100+ parts

-

1k+ parts

$2.097

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925

$2.330

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$2.097

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Corphita

USA . 1,818 parts In-Stock

1+ parts

$12.663

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1,818

$12.663

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QUARKTWIN TECHNOLOGY LTD

USA . 13,712 parts In-Stock

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13,712

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Component Stockers USA

USA . 1,520 parts In-Stock

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1,520

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Overview

Elevate your electronic designs with the SN74ACT72221L35RJ FIFO from Texas Instruments. This cutting-edge component boasts top-notch quality and reliability, thanks to its renowned manufacturer. Perfect for a wide range of applications, this FIFO offers seamless data transfer in a synchronous operating mode, making it ideal for commercial-grade projects. With a memory density of 9216 bits and an output enable feature, this chip carrier package delivers unmatched performance and value to customers seeking high-speed data storage solutions. Upgrade your projects today with the SN74ACT72221L35RJ FIFO and experience unparalleled efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes it easy to integrate into circuit boards, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination in data transfer, enhancing overall system performance.

Nominal Supply Voltage: 5V

Operating at a standard 5V supply voltage makes this product compatible with a wide range of systems and power sources.

No. of Terminals: 32

Having 32 terminals provides flexibility in connection options and allows for multiple input/output configurations.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand demanding thermal conditions without compromising performance.

Organization: 1KX9

The 1Kx9 organization allows for efficient storage and retrieval of data in a FIFO configuration, enabling seamless data handling.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

No. of Words: 1024 words

Having a capacity of 1024 words ensures ample storage space for data, accommodating diverse application requirements.

Memory Width: 9

The memory width of 9 bits provides sufficient data capacity for various data processing tasks, contributing to efficient operation.

Memory Density: 9216 bit

The high memory density of 9216 bits allows for the storage of large amounts of data in a compact form factor, optimizing space utilization.

Output Enable: YES

The output enable feature enables control over data output, facilitating data transfer and access as needed, enhancing system flexibility.

Technical Specifications

FIFO SN74ACT72221L35RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-J32

Memory Density:

9216 bit

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX9

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

J BEND

Terminal Position:

QUAD

Trade Compliance

SN74ACT72221L35RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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