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SN74ACT72211L-50RJ

Texas Instruments

SN74ACT72211L-50RJ by Texas Instruments

SN74ACT72211L-50RJ by Texas Instruments is a FIFO chip with 512x9 organization, operating at 20MHz. It has a cycle time of 50ns and supports synchronous operation. Ideal for applications requiring fast data storage and retrieval in commercial temperature environments.

Median Price

$9.662

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,374 parts In-Stock

1+ parts

-

100+ parts

$7.730

1k+ parts

$6.920

10k+ parts

$6.510

9,374

-

$7.730

$6.920

$6.510

DigiKey

USA . 9,374 parts In-Stock

1+ parts

-

100+ parts

$10.180

1k+ parts

-

10k+ parts

-

9,374

-

$10.180

-

-

Verical

USA . 6,176 parts In-Stock

1+ parts

-

100+ parts

$9.662

1k+ parts

$8.650

10k+ parts

$8.137

6,176

-

$9.662

$8.650

$8.137

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,491 parts In-Stock

1+ parts

$8.160

100+ parts

-

1k+ parts

-

10k+ parts

-

1,491

$8.160

-

-

-

Vyrian

USA . 2,847 parts In-Stock

1+ parts

$8.590

100+ parts

-

1k+ parts

-

10k+ parts

-

2,847

$8.590

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 571 parts In-Stock

1+ parts

$3.912

100+ parts

-

1k+ parts

$4.386

10k+ parts

-

571

$3.912

-

$4.386

-

DigiPath Technology Company

USA . 1,859 parts In-Stock

1+ parts

$4.307

100+ parts

$3.963

1k+ parts

-

10k+ parts

-

1,859

$4.307

$3.963

-

-

ChromeModa Solutions

Germany . 5,789 parts In-Stock

1+ parts

$4.395

100+ parts

$3.604

1k+ parts

-

10k+ parts

-

5,789

$4.395

$3.604

-

-

IDEA Electronic Components Group

UK . 798 parts In-Stock

1+ parts

$4.395

100+ parts

-

1k+ parts

$3.956

10k+ parts

-

798

$4.395

-

$3.956

-

Corphita

USA . 3,563 parts In-Stock

1+ parts

$7.731

100+ parts

-

1k+ parts

-

10k+ parts

-

3,563

$7.731

-

-

-

Overview

Elevate your designs with the Texas Instruments SN74ACT72211L-50RJ FIFO chip carrier, offering reliable performance and efficient operation. Perfect for a wide range of applications, this synchronous FIFO device boasts a cycle time of 50 ns and a maximum clock frequency of 20 MHz. With Texas Instruments' renowned quality and innovation, you can trust in the seamless functionality and durability of this product. Experience the benefits of faster data transfer speeds, improved organization, and enhanced efficiency with the SN74ACT72211L-50RJ - a valuable addition to any project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides a lightweight and durable package for the FIFO, ensuring protection and longevity.

Cycle Time: 50 ns

With a fast cycle time of 50 ns, this FIFO can efficiently handle data transfer operations with minimal delay.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures that data transfers are synchronized and efficient, enhancing overall performance.

Maximum Clock Frequency (fCLK): 20 MHz

With a high maximum clock frequency of 20 MHz, this FIFO can support fast data processing and transfer speeds.

Memory Density: 4608 bit

The high memory density of 4608 bit allows for storing a large amount of data in the FIFO, making it suitable for applications requiring extensive data storage.

Output Enable: YES

The output enable feature allows for controlling the data output from the FIFO, providing flexibility and versatility in data handling.

Technical Specifications

FIFO SN74ACT72211L-50RJ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

25 ns

Maximum Clock Frequency (fCLK):

20 MHz

Cycle Time:

50 ns

JESD-30 Code:

R-PQCC-J32

JESD-609 Code:

e0

Length:

13.995 mm

Memory Density:

4608 bit

Memory IC Type:

Memory Width:

9

No. of Functions:

1

No. of Terminals:

32

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512X9

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC32,.5X.6

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Sub-Category:

FIFOs

Maximum Supply Current:

140 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4554 mm

Trade Compliance

SN74ACT72211L-50RJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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