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SN74ABT3613-15PQ

Texas Instruments

SN74ABT3613-15PQ by Texas Instruments

SN74ABT3613-15PQ by Texas Instruments is a FIFO memory IC with 64x36 organization, 15 ns cycle time, and 66.7 MHz max clock frequency. It operates synchronously at 5V, suitable for commercial applications requiring fast data storage and retrieval in a compact flatpack package.

Median Price

$18.380

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,763 parts In-Stock

1+ parts

-

100+ parts

$15.900

1k+ parts

$14.230

10k+ parts

$13.390

1,763

-

$15.900

$14.230

$13.390

DigiKey

USA . 1,562 parts In-Stock

1+ parts

-

100+ parts

$18.380

1k+ parts

-

10k+ parts

-

1,562

-

$18.380

-

-

Verical

USA . 1,559 parts In-Stock

1+ parts

-

100+ parts

$19.875

1k+ parts

$17.788

10k+ parts

$16.738

1,559

-

$19.875

$17.788

$16.738

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,820 parts In-Stock

1+ parts

$16.786

100+ parts

-

1k+ parts

-

10k+ parts

-

3,820

$16.786

-

-

-

Vyrian

USA . 2,181 parts In-Stock

1+ parts

$17.670

100+ parts

-

1k+ parts

-

10k+ parts

-

2,181

$17.670

-

-

-

DigiKey Marketplace

USA . 1,778 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,778

-

-

-

-

LWI Electronics Inc

India . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$3.079

100+ parts

$2.802

1k+ parts

$2.525

10k+ parts

-

2,500

$3.079

$2.802

$2.525

-

Parana Technologies

USA . 792 parts In-Stock

1+ parts

$3.309

100+ parts

-

1k+ parts

$3.831

10k+ parts

-

792

$3.309

-

$3.831

-

DigiPath Technology Company

USA . 554 parts In-Stock

1+ parts

$3.644

100+ parts

$3.352

1k+ parts

-

10k+ parts

-

554

$3.644

$3.352

-

-

ChromeModa Solutions

Germany . 6,370 parts In-Stock

1+ parts

$3.718

100+ parts

$3.049

1k+ parts

-

10k+ parts

-

6,370

$3.718

$3.049

-

-

IDEA Electronic Components Group

UK . 1,567 parts In-Stock

1+ parts

$3.718

100+ parts

-

1k+ parts

$3.346

10k+ parts

-

1,567

$3.718

-

$3.346

-

Corphita

USA . 3,253 parts In-Stock

1+ parts

$15.903

100+ parts

-

1k+ parts

-

10k+ parts

-

3,253

$15.903

-

-

-

Microchip USA

USA . 214 parts In-Stock

1+ parts

$51.460

100+ parts

$50.730

1k+ parts

$50.360

10k+ parts

$49.990

214

$51.460

$50.730

$50.360

$49.990

Overview

Experience seamless data transfer and efficient memory management with the Texas Instruments SN74ABT3613-15PQ FIFO. Manufactured by an industry leader known for reliability and innovation, this product offers a high-quality solution for various applications. With a fast cycle time of 15ns and a maximum clock frequency of 66.7MHz, this FIFO ensures optimal performance. Its bi-directional design and 3-STATE output characteristics provide versatility, while the compact square package makes it easy to integrate into your systems. Trust Texas Instruments for superior products that deliver value and benefits to enhance your operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can protect the internal components of the FIFO from external factors, ensuring a longer lifespan.

Cycle Time: 15 ns

With a fast cycle time, this FIFO can efficiently process data at high speeds, making it suitable for applications requiring quick data handling.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this FIFO is compatible with many existing systems, making integration easier.

Maximum Clock Frequency (fCLK): 66.7 MHz

With a high clock frequency, this FIFO can handle data at rapid speeds, ensuring efficient performance in data-intensive applications.

Technology: BICMOS

Being based on BICMOS technology, this FIFO offers a balance of high-speed performance and low power consumption, making it a versatile choice for various applications.

Technical Specifications

FIFO SN74ABT3613-15PQ attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

10 ns

Additional Features:

PARITY GENERATOR/CHECKER; MAILBOX

Maximum Clock Frequency (fCLK):

66.7 MHz

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G132

Length:

24.13 mm

Memory Density:

2304 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

132

No. of Words:

64 words

No. of Words Code:

64

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64X36

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK, BUMPER

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FIFOs

Maximum Supply Current:

130 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

24.13 mm

Trade Compliance

SN74ABT3613-15PQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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